ページ 147 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
BF861A,215	NXP	JFET N-CH 25V 6.5MA SOT23 Transistor Type: N-Channel JFET Frequency: - Gain: - Voltage - Test: - Current Rating: 6.5mA Noise Figure: - Current - Test: - Power - Output: - Voltage - Rated: 25V Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫7,744
NVT2003DP,118	NXP	IC TRANSLATOR BIDIR 10-TSSOP Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 3 Voltage - VCCA: 1V ~ 3.6V Voltage - VCCB: 1.8V ~ 5.5V Input Signal: - Output Signal: - Output Type: Open Drain, Push-Pull Data Rate: - Operating Temperature: -40°C ~ 85°C (TA) Features: Auto-Direction Sensing Mounting Type: Surface Mount Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Supplier Device Package: 10-TSSOP	パッケージ: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)	在庫14,292
SSTU32865ET/G,557	NXP	IC REG BUFFER 28BIT 160-TFBGA Logic Type: 1:2 Registered Buffer with Parity Supply Voltage: 1.7 V ~ 1.9 V Number of Bits: 28 Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 160-TFBGA Supplier Device Package: 160-TFBGA (9x13)	パッケージ: 160-TFBGA	在庫4,064
CBTD16213DL,512	NXP	IC FET BUS EXCH SWCH 56-SSOP Type: Bus FET Exchange Switch Circuit: 12 x 2:2 Independent Circuits: 1 Current - Output High, Low: - Voltage Supply Source: Single Supply Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 56-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 56-SSOP	パッケージ: 56-BSSOP (0.295", 7.50mm Width)	在庫4,128
74LVC1G07GW/DG,125	NXP	IC BUFF OPEN DRAIN N-INV 5TSSOP Logic Type: Buffer, Non-Inverting Number of Elements: 1 Number of Bits per Element: 1 Input Type: - Output Type: Open Drain Current - Output High, Low: -, 32mA Voltage - Supply: 1.65 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 5-TSSOP, SC-70-5, SOT-353 Supplier Device Package: 5-TSSOP	パッケージ: 5-TSSOP, SC-70-5, SOT-353	在庫2,656
TDA18271HD/C2,518	NXP	IC TV SILICON TUNER 64-HLQFN Type: Silicon Tuner Applications: Set-Top Boxes Mounting Type: Surface Mount Package / Case: 64-LFQFN Exposed Pad Supplier Device Package: 64-HLFQFN (9x9)	パッケージ: 64-LFQFN Exposed Pad	在庫5,776
PC33901WNEFR2	NXP	CANHS 8SOIC Applications: - Interface: - Voltage - Supply: - Package / Case: - Supplier Device Package: - Mounting Type: -	パッケージ: -	在庫4,944
MPC8547EVTAQGB	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫5,120
MPC8547ECVTAQGB	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫2,800
MPC755BVT350LE	NXP	IC MPU MPC7XX 350MHZ 360FCBGA Core Processor: PowerPC Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 350MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-BBGA, FCCBGA Supplier Device Package: 360-FCPBGA (25x25)	パッケージ: 360-BBGA, FCCBGA	在庫4,144
MPC8255AZUPIBB	NXP	IC MPU MPC82XX 300MHZ 408TBGA Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	パッケージ: 480-LBGA	在庫4,336
MCIMX6DP6AVT1AA	NXP	IC MPU I.MX6DP 1GHZ 624FCBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	パッケージ: 624-FBGA, FCBGA	在庫5,008
SPC5517EAMMG66	NXP	IC MCU 32BIT 1.5MB FLASH 208BGA Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Speed: 66MHz Connectivity: CAN, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 144 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 208-BGA Supplier Device Package: 208-MAPBGA (17x17)	パッケージ: 208-BGA	在庫5,968
SC68376BACAB25	NXP	IC MCU 32BIT ROMLESS 160QFP Core Processor: CPU32 Core Size: 32-Bit Speed: 25MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 18 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 7.5K x 8 Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 160-BQFP Supplier Device Package: 160-QFP (28x28)	パッケージ: 160-BQFP	在庫2,448
MK51DN512ZCLQ10	NXP	IC MCU 32BIT 512KB FLASH 144LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Number of I/O: 94 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 41x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫4,416
MC9S08DZ48ACLC	NXP	IC MCU 8BIT 48KB FLASH 32LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 25 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 3K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	パッケージ: 32-LQFP	在庫5,344
MSC8113TMP4800V	NXP	DSP TRI-CORE 431FCBGA Type: SC140 Core Interface: Ethernet, I2C, TDM, UART Clock Rate: 400MHz Non-Volatile Memory: External On-Chip RAM: 1.436MB Voltage - I/O: 3.30V Voltage - Core: 1.10V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 431-BFBGA, FCBGA Supplier Device Package: 431-FCPBGA (20x20)	パッケージ: 431-BFBGA, FCBGA	在庫4,528
MC100ES6221TB	NXP	IC CLK BUFFER 2:20 2GHZ 52LQFP Type: Fanout Buffer (Distribution), Multiplexer Number of Circuits: 1 Ratio - Input:Output: 2:20 Differential - Input:Output: Yes/Yes Input: ECL, HSTL, PECL Output: ECL, PECL Frequency - Max: 2GHz Voltage - Supply: 2.375 V ~ 3.465 V Operating Temperature: -40°C ~ 110°C Mounting Type: Surface Mount Package / Case: 52-LQFP Exposed Pad Supplier Device Package: 52-LQFP (10x10)	パッケージ: 52-LQFP Exposed Pad	在庫3,952
MPX4115AP	NXP	SENSOR ABS PRESS 16.7 PSI MAX Pressure Type: Absolute Operating Pressure: 2.18 PSI ~ 16.68 PSI (15 kPa ~ 115 kPa) Output Type: Analog Voltage Output: 0.2 V ~ 4.8 V Accuracy: - Voltage - Supply: 4.85 V ~ 5.35 V Port Size: Male - 0.19" (4.93mm) Tube Port Style: Barbed Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 6-SIP Module Supplier Device Package: -	パッケージ: 6-SIP Module	在庫14,436
PCF7937EA/C0AB2601	NXP	IC TRANSPONDER PLLMC Style: - Technology: - Frequency: 125kHz Memory Type: Read/Write Writable Memory: - Standards: - Operating Temperature: - Size / Dimension: -	パッケージ: -	在庫7,578
JN5148/001M00T,534	NXP	RF TXRX MOD 802.15.4 TRACE ANT RF Family/Standard: 802.15.4 Protocol: Zigbee? Modulation: - Frequency: 2.4GHz Data Rate: - Power - Output: 2.5dBm Sensitivity: -95dBm Serial Interfaces: I2C, SPI, UART Antenna Type: Integrated, Trace Memory Size: 128kB ROM, 128kB RAM Voltage - Supply: 2.7 V ~ 3.6 V Current - Receiving: 17.5mA Current - Transmitting: 15mA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Package / Case: Module	パッケージ: Module	在庫8,838
TWR-RF-SNAP	NXP	TOWER SYST MODULE Type: Transceiver, 802.15.4 Frequency: 2.4GHz For Use With/Related Products: Freescale Tower System Supplied Contents: Board	パッケージ: -	在庫6,948
MC35FS4500NAE	NXP	FS4500 Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP Exposed Pad	在庫4,192
T4241NSE7TTB	NXP	QORIQ 64B POWER 24X 1.8GHZ THR Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫5,136
SPC5741PK1AMLQ9	NXP	1MB, 128K RAM, 144PIN Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 200MHz Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Number of I/O: - Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫5,664
S9S08DZ48F2CLFR	NXP	8-BIT MCU S08 CORE 48KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 3K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP	在庫5,424
MGD3160AM318EK	NXP	GATE DRIVER Driven Configuration: High-Side Channel Type: Single Number of Drivers: 1 Gate Type: IGBT, SiC MOSFET Voltage - Supply: 4.5V ~ 40V Logic Voltage - VIL, VIH: - Current - Peak Output (Source, Sink): 15A, 15A Input Type: Non-Inverting High Side Voltage - Max (Bootstrap): - Rise / Fall Time (Typ): - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 32-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 32-SOIC	パッケージ: -	Request a Quote
MC33FS8435G0KS	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	パッケージ: -	Request a Quote

BF861A,215

NXP

JFET N-CH 25V 6.5MA SOT23

Transistor Type: N-Channel JFET
Frequency: -
Gain: -
Voltage - Test: -
Current Rating: 6.5mA
Noise Figure: -
Current - Test: -
Power - Output: -
Voltage - Rated: 25V
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫7,744

NVT2003DP,118

NXP

IC TRANSLATOR BIDIR 10-TSSOP

Translator Type: Voltage Level
Channel Type: Bidirectional
Number of Circuits: 1
Channels per Circuit: 3
Voltage - VCCA: 1V ~ 3.6V
Voltage - VCCB: 1.8V ~ 5.5V
Input Signal: -
Output Signal: -
Output Type: Open Drain, Push-Pull
Data Rate: -
Operating Temperature: -40°C ~ 85°C (TA)
Features: Auto-Direction Sensing
Mounting Type: Surface Mount
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Supplier Device Package: 10-TSSOP

パッケージ: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)

在庫14,292

SSTU32865ET/G,557

NXP

IC REG BUFFER 28BIT 160-TFBGA

Logic Type: 1:2 Registered Buffer with Parity
Supply Voltage: 1.7 V ~ 1.9 V
Number of Bits: 28
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 160-TFBGA
Supplier Device Package: 160-TFBGA (9x13)

パッケージ: 160-TFBGA

在庫4,064

CBTD16213DL,512

NXP

IC FET BUS EXCH SWCH 56-SSOP

Type: Bus FET Exchange Switch
Circuit: 12 x 2:2
Independent Circuits: 1
Current - Output High, Low: -
Voltage Supply Source: Single Supply
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 56-BSSOP (0.295", 7.50mm Width)
Supplier Device Package: 56-SSOP

パッケージ: 56-BSSOP (0.295", 7.50mm Width)

在庫4,128

74LVC1G07GW/DG,125

NXP

IC BUFF OPEN DRAIN N-INV 5TSSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 1
Input Type: -
Output Type: Open Drain
Current - Output High, Low: -, 32mA
Voltage - Supply: 1.65 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Supplier Device Package: 5-TSSOP

パッケージ: 5-TSSOP, SC-70-5, SOT-353

在庫2,656

TDA18271HD/C2,518

NXP

IC TV SILICON TUNER 64-HLQFN

Type: Silicon Tuner
Applications: Set-Top Boxes
Mounting Type: Surface Mount
Package / Case: 64-LFQFN Exposed Pad
Supplier Device Package: 64-HLFQFN (9x9)

パッケージ: 64-LFQFN Exposed Pad

在庫5,776

PC33901WNEFR2

NXP

CANHS 8SOIC

Applications: -
Interface: -
Voltage - Supply: -
Package / Case: -
Supplier Device Package: -
Mounting Type: -

パッケージ: -

在庫4,944

MPC8547EVTAQGB

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫5,120

MPC8547ECVTAQGB

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫2,800

MPC755BVT350LE

NXP

IC MPU MPC7XX 350MHZ 360FCBGA

Core Processor: PowerPC
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 350MHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 360-BBGA, FCCBGA
Supplier Device Package: 360-FCPBGA (25x25)

パッケージ: 360-BBGA, FCCBGA

在庫4,144

MPC8255AZUPIBB

NXP

IC MPU MPC82XX 300MHZ 408TBGA

Core Processor: PowerPC G2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 300MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 480-LBGA
Supplier Device Package: 408-TBGA (37.5x37.5)

パッケージ: 480-LBGA

在庫4,336

MCIMX6DP6AVT1AA

NXP

IC MPU I.MX6DP 1GHZ 624FCBGA

Core Processor: ARM? Cortex?-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet: 10/100/1000 Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Package / Case: 624-FBGA, FCBGA
Supplier Device Package: 624-FCBGA (21x21)

パッケージ: 624-FBGA, FCBGA

在庫5,008

SPC5517EAMMG66

NXP

IC MCU 32BIT 1.5MB FLASH 208BGA

Core Processor: e200z0, e200z1
Core Size: 32-Bit Dual-Core
Speed: 66MHz
Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 144
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
Data Converters: A/D 40x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 208-BGA
Supplier Device Package: 208-MAPBGA (17x17)

パッケージ: 208-BGA

在庫5,968

SC68376BACAB25

NXP

IC MCU 32BIT ROMLESS 160QFP

Core Processor: CPU32
Core Size: 32-Bit
Speed: 25MHz
Connectivity: CAN, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 18
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 7.5K x 8
Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
Data Converters: A/D 16x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 160-BQFP
Supplier Device Package: 160-QFP (28x28)

パッケージ: 160-BQFP

在庫2,448

MK51DN512ZCLQ10

NXP

IC MCU 32BIT 512KB FLASH 144LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O: 94
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 41x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫4,416

MC9S08DZ48ACLC

NXP

IC MCU 8BIT 48KB FLASH 32LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 25
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
RAM Size: 3K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 10x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

パッケージ: 32-LQFP

在庫5,344

MSC8113TMP4800V

NXP

DSP TRI-CORE 431FCBGA

Type: SC140 Core
Interface: Ethernet, I2C, TDM, UART
Clock Rate: 400MHz
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 431-BFBGA, FCBGA
Supplier Device Package: 431-FCPBGA (20x20)

パッケージ: 431-BFBGA, FCBGA

在庫4,528

MC100ES6221TB

NXP

IC CLK BUFFER 2:20 2GHZ 52LQFP

Type: Fanout Buffer (Distribution), Multiplexer
Number of Circuits: 1
Ratio - Input:Output: 2:20
Differential - Input:Output: Yes/Yes
Input: ECL, HSTL, PECL
Output: ECL, PECL
Frequency - Max: 2GHz
Voltage - Supply: 2.375 V ~ 3.465 V
Operating Temperature: -40°C ~ 110°C
Mounting Type: Surface Mount
Package / Case: 52-LQFP Exposed Pad
Supplier Device Package: 52-LQFP (10x10)

パッケージ: 52-LQFP Exposed Pad

在庫3,952

MPX4115AP

NXP

SENSOR ABS PRESS 16.7 PSI MAX

Pressure Type: Absolute
Operating Pressure: 2.18 PSI ~ 16.68 PSI (15 kPa ~ 115 kPa)
Output Type: Analog Voltage
Output: 0.2 V ~ 4.8 V
Accuracy: -
Voltage - Supply: 4.85 V ~ 5.35 V
Port Size: Male - 0.19" (4.93mm) Tube
Port Style: Barbed
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 58.02 PSI (400 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 6-SIP Module
Supplier Device Package: -

パッケージ: 6-SIP Module

在庫14,436

PCF7937EA/C0AB2601

NXP

IC TRANSPONDER PLLMC

Style: -
Technology: -
Frequency: 125kHz
Memory Type: Read/Write
Writable Memory: -
Standards: -
Operating Temperature: -
Size / Dimension: -

パッケージ: -

在庫7,578

JN5148/001M00T,534

NXP

RF TXRX MOD 802.15.4 TRACE ANT

RF Family/Standard: 802.15.4
Protocol: Zigbee?
Modulation: -
Frequency: 2.4GHz
Data Rate: -
Power - Output: 2.5dBm
Sensitivity: -95dBm
Serial Interfaces: I2C, SPI, UART
Antenna Type: Integrated, Trace
Memory Size: 128kB ROM, 128kB RAM
Voltage - Supply: 2.7 V ~ 3.6 V
Current - Receiving: 17.5mA
Current - Transmitting: 15mA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Package / Case: Module

パッケージ: Module

在庫8,838

TWR-RF-SNAP

NXP

TOWER SYST MODULE

Type: Transceiver, 802.15.4
Frequency: 2.4GHz
For Use With/Related Products: Freescale Tower System
Supplied Contents: Board

パッケージ: -

在庫6,948

MC35FS4500NAE

NXP

FS4500

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP Exposed Pad

在庫4,192

T4241NSE7TTB

NXP

QORIQ 64B POWER 24X 1.8GHZ THR

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫5,136

SPC5741PK1AMLQ9

NXP

1MB, 128K RAM, 144PIN

Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Speed: 200MHz
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Number of I/O: -
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫5,664

S9S08DZ48F2CLFR

NXP

8-BIT MCU S08 CORE 48KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
RAM Size: 3K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP

在庫5,424

MGD3160AM318EK

NXP

GATE DRIVER

Driven Configuration: High-Side
Channel Type: Single
Number of Drivers: 1
Gate Type: IGBT, SiC MOSFET
Voltage - Supply: 4.5V ~ 40V
Logic Voltage - VIL, VIH: -
Current - Peak Output (Source, Sink): 15A, 15A
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): -
Rise / Fall Time (Typ): -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Supplier Device Package: 32-SOIC

パッケージ: -

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MC33FS8435G0KS

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

パッケージ: -

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