NXP 製品

MC33912G5AC

NXP

IC SYSTEM BASIS CHIP 32LQFP

• Applications: System Basis Chip
• Current - Supply: 4.5mA
• Voltage - Supply: 5.5 V ~ 27 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

パッケージ: 32-LQFP

SSTUG32865ET/S,518

NXP

IC BUFFER 1.8V 28BIT 160-TFBGA

• Logic Type: 1:2 Registered Buffer with Parity
• Supply Voltage: 1.7 V ~ 2 V
• Number of Bits: 28
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 160-TFBGA
• Supplier Device Package: 160-TFBGA (9x13)

パッケージ: 160-TFBGA

74ABT573APW,118

NXP

IC OCTAL D TRANSP LATCH 20TSSOP

• Logic Type: D-Type Transparent Latch
• Circuit: 8:8
• Output Type: Tri-State
• Voltage - Supply: 4.5 V ~ 5.5 V
• Independent Circuits: 1
• Delay Time - Propagation: 3.3ns
• Current - Output High, Low: 32mA, 64mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

パッケージ: 20-TSSOP (0.173", 4.40mm Width)

TDA19989BET/C1,557

NXP

IC HDMI INTERFACE 64TFBGA

• Type: HDMI 1.4
• Applications: HDMI, DVI, Receivers
• Mounting Type: Surface Mount
• Package / Case: 64-TFBGA
• Supplier Device Package: 64-TFBGA (4.5x4.5)

パッケージ: 64-TFBGA

SAA7135HL/V101,518

NXP

IC VIDEO DECODER 128-LQFP

• Type: Video/Stereo Decoder
• Applications: TV
• Voltage - Supply, Analog: 3 V ~ 3.6 V
• Voltage - Supply, Digital: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Package / Case: 128-LQFP
• Supplier Device Package: 128-LQFP (14x20)

パッケージ: 128-LQFP

NX3L1T5157GM,132

NXP

IC ANALOG SWITCH SPDT XSON6

• Switch Circuit: SPDT
• Multiplexer/Demultiplexer Circuit: 2:1
• Number of Circuits: 1
• On-State Resistance (Max): 750 mOhm
• Channel-to-Channel Matching (ΔRon): 20 mOhm
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 40ns, 20ns
• -3db Bandwidth: 60MHz
• Charge Injection: 15pC
• Channel Capacitance (CS(off), CD(off)): 35pF
• Current - Leakage (IS(off)) (Max): 10nA
• Crosstalk: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 6-XFDFN
• Supplier Device Package: 6-XSON, SOT886 (1.45x1)

パッケージ: 6-XFDFN

MCIMX31CVMN4DR2

NXP

IC MPU I.MX31 400MHZ 473MAPBGA

• Core Processor: ARM1136JF-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
• RAM Controllers: DDR
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keyboard, Keypad, LCD
• Ethernet: -
• SATA: -
• USB: USB 2.0 (3)
• Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
• Package / Case: 473-LFBGA
• Supplier Device Package: -

パッケージ: 473-LFBGA

MPC8360EVVALFHA

NXP

IC MPU MPC83XX 667MHZ 740TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 740-LBGA
• Supplier Device Package: 740-TBGA (37.5x37.5)

パッケージ: 740-LBGA

P1022NXE2HFB

NXP

IC MPU Q OR IQ 1.055GHZ 689TBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.055GHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: LCD
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

パッケージ: 689-BBGA Exposed Pad

MC908GR8ACDWE

NXP

IC MCU 8BIT 7.5KB FLASH 28SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 17
• Program Memory Size: 7.5KB (7.5K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 384 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

パッケージ: 28-SOIC (0.295", 7.50mm Width)

MC705X32VFUE

NXP

IC MCU 8BIT 32KB OTP 64QFP

• Core Processor: HC05
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: CAN, SCI
• Peripherals: POR, WDT
• Number of I/O: 24
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: OTP
• EEPROM Size: 256 x 8
• RAM Size: 528 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

パッケージ: 64-QFP

MC9S12KG128CFUE

NXP

IC MCU 16BIT 128KB FLASH 80QFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

パッケージ: 80-QFP

MC908GZ32VFUE

NXP

IC MCU 8BIT 32KB FLASH 64QFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 53
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1.5K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

パッケージ: 64-QFP

SP5744PFK1AMLQ8R

NXP

32-BIT MCU DUAL CORE POWER ARCH

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

パッケージ: -

MC908QT2AMDWE

NXP

IC MCU 8BIT 1.5KB FLASH 8SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 5
• Program Memory Size: 1.5KB (1.5K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 8-SOIC (0.209", 5.30mm Width)
• Supplier Device Package: 8-SOIC

パッケージ: 8-SOIC (0.209", 5.30mm Width)

MK40DX128VLH7

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 18x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

LPC1316FBD48,551

NXP

IC MCU 32BIT 48KB FLASH 48LQFP

• Core Processor: ARM? Cortex?-M3
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 40
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP

LPC3220FET296/01,5

NXP

IC MCU 32BIT ROMLESS 296TFBGA

• Core Processor: ARM9?
• Core Size: 16/32-Bit
• Speed: 266MHz
• Connectivity: EBI/EMI, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT
• Number of I/O: 51
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 0.9 V ~ 3.6 V
• Data Converters: A/D 3x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 296-TFBGA
• Supplier Device Package: 296-TFBGA (15x15)

パッケージ: 296-TFBGA

SAA7706H/N107S,518

NXP

IC DSP CAR RADIO 80QFP

• Type: Car Signal Processor
• Interface: I2C, I2S, LSB, SPDIF
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 80-BQFP
• Supplier Device Package: 80-PQFP (14x20)

パッケージ: 80-BQFP

MC144110DW

NXP

IC HEX SERIAL D/A CONV 20-SOIC

• Number of Bits: 6
• Number of D/A Converters: 6
• Settling Time: -
• Output Type: Voltage - Buffered
• Differential Output: Yes
• Data Interface: SPI
• Reference Type: Supply
• Voltage - Supply, Analog: 4.5 V ~ 15 V
• Voltage - Supply, Digital: 4.5 V ~ 15 V
• INL/DNL (LSB): -
• Architecture: R-2R
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC
• Mounting Type: -

パッケージ: 20-SOIC (0.295", 7.50mm Width)

MPX2100A

NXP

SENSOR ABS PRESS 14.5PSI MAX

• Pressure Type: Absolute
• Operating Pressure: 14.5 PSI (100 kPa)
• Output Type: Wheatstone Bridge
• Output: 0 mV ~ 40 mV (10V)
• Accuracy: -
• Voltage - Supply: 10 V ~ 16 V
• Port Size: -
• Port Style: No Port
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 58.02 PSI (400 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 4-SIP Module
• Supplier Device Package: -

パッケージ: 4-SIP Module

T2081NSN8MQB

NXP

QORIQ 64B POWER ARCH 8X 1.2GHZ

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

パッケージ: -

SPC5606BF1VLQ6R

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 121
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 80K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 15x10b, 5x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

S912XEQ384BCAGR

NXP

16-BIT MCU S12X CORE 384KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 119
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 24K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

MKV46F256VLH16R

NXP

KINETIS KV46: 168MHZ M4F REAL-TI

• Core Processor: ARM® Cortex®-M4
• Core Size: 32-Bit
• Speed: 168MHz
• Connectivity: CANbus, I²C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 48
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 29x12b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

FS32K148UGT0VLQT

NXP

S32K148 ARM CORTEX-M4F, 112 MHZ,

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 112MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
• Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
• Number of I/O: 128
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 32x12b SAR; D/A 1x8b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

パッケージ: -

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MPF5023CMBA0ES

NXP

POWER MANAGEMENT IC, PRE-PROG, 3

• Applications: High Performance i.MX 8, S32x Processor Based
• Current - Supply: 200µA
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-HVQFN (6x6)

パッケージ: -

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MIMXRT1171DVMAA

NXP

IC MCU 32BIT EXT MEM 289MAPBGA

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit Single-Core
• Speed: 800MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
• Number of I/O: 13
• Program Memory Size: -
• Program Memory Type: External Program Memory
• EEPROM Size: -
• RAM Size: 2M x 8
• Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
• Data Converters: A/D 20x12b SAR; D/A 1x12b
• Oscillator Type: External, Internal
• Operating Temperature: 0°C ~ 95°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-LFBGA (14x14)

パッケージ: -

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