NXP 製品

PH4830L,115

NXP

MOSFET N-CH 30V 84A LFPAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 30V
• Current - Continuous Drain (Id) @ 25°C: 84A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2.15V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 22.9nC @ 4.5V
• Input Capacitance (Ciss) (Max) @ Vds: 2786pF @ 12V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 62.5W (Tc)
• Rds On (Max) @ Id, Vgs: 4.8 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: LFPAK56, Power-SO8
• Package / Case: SC-100, SOT-669

パッケージ: SC-100, SOT-669

BF909WR,135

NXP

MOSFET N-CH 7V 40MA SOT343

• Transistor Type: N-Channel Dual Gate
• Frequency: 800MHz
• Gain: -
• Voltage - Test: 5V
• Current Rating: 40mA
• Noise Figure: 2dB
• Current - Test: 15mA
• Power - Output: -
• Voltage - Rated: 7V
• Package / Case: SC-82A, SOT-343
• Supplier Device Package: CMPAK-4

パッケージ: SC-82A, SOT-343

MC15XS3400DHFK

NXP

IC SWITCH HIGH SIDE QUAD 24PQFN

• Switch Type: General Purpose
• Number of Outputs: 4
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 6 V ~ 20 V
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Current - Output (Max): 6A
• Rds On (Typ): 15 mOhm
• Input Type: -
• Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 24-PowerQFN
• Supplier Device Package: 24-PQFN (12x12)

パッケージ: 24-PowerQFN

MC17XS6400BEKR2

NXP

IC SWITCH HIGH SIDE 32SOIC

• Switch Type: General Purpose
• Number of Outputs: 4
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 7 V ~ 18 V
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Current - Output (Max): 5.5A
• Rds On (Typ): 17 mOhm
• Input Type: -
• Features: Slew Rate Controlled
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP

パッケージ: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

SSTUG32868ET/G,518

NXP

IC BUFFER 1.8V 25BIT 176-LFBGA

• Logic Type: 1:2 Configurable Registered Buffer with Parity
• Supply Voltage: 1.7 V ~ 2 V
• Number of Bits: 28
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 176-TFBGA
• Supplier Device Package: 176-TFBGA (6x15)

パッケージ: 176-TFBGA

CBTD16212DGG,118

NXP

IC FET BUS EXCH SWCH 56-TSSOP

• Type: Bus FET Exchange Switch
• Circuit: 12 x 2:2
• Independent Circuits: 1
• Current - Output High, Low: -
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 56-TSSOP

パッケージ: 56-TFSOP (0.240", 6.10mm Width)

74ABT652AD,118

NXP

IC TRANSCEIVER 8BIT N-INV 24SOIC

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

パッケージ: 24-SOIC (0.295", 7.50mm Width)

SAA6752HS/V103,557

NXP

IC AUD/VID ENCODER MPEG 208-SQFP

• Type: Audio/Video Encoder
• Applications: DVD
• Voltage - Supply, Analog: 2.3 V ~ 2.7 V
• Voltage - Supply, Digital: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-SQFP (28x28)

パッケージ: 208-BFQFP

MC8641DTVU1250HC

NXP

IC MPU MPC86XX 1.25GHZ 1023BGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.25GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1023-BCBGA, FCCBGA
• Supplier Device Package: 1023-FCCBGA (33x33)

パッケージ: 1023-BCBGA, FCCBGA

KMC68360VR33L

NXP

IC MPU M683XX 33MHZ 357BGA

• Core Processor: CPU32+
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 33MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

パッケージ: 357-BBGA

MPC8569ECVJAQLJB

NXP

IC MPU MPC85XX 1.067GHZ 783BGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.067GHz
• Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
• RAM Controllers: DDR2, DDR3, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (8), 1 Gbps (4)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

P1024NSN5DFB

NXP

IC MPU Q OR IQ 667MHZ 561TEBGA1

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 125°C (TA)
• Security Features: -
• Package / Case: 561-FBGA
• Supplier Device Package: 561-TEPBGA1 (23x23)

パッケージ: 561-FBGA

P1014NXE5HHB

NXP

IC MPU Q OR IQ 800MHZ 425TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Security; SEC 4.4
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
• Package / Case: 425-FBGA
• Supplier Device Package: 425-TEPBGA I (19x19)

パッケージ: 425-FBGA

PXAS37KBBE,557

NXP

IC MCU 16BIT 32KB OTP 80LQFP

• Core Processor: XA
• Core Size: 16-Bit
• Speed: 30MHz
• Connectivity: EBI/EMI, I2C, UART/USART
• Peripherals: PWM, WDT
• Number of I/O: 50
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (12x12)

パッケージ: 80-LQFP

MC56F8027VLHR

NXP

IC MCU 16BIT 32KB FLASH 64LQFP

• Core Processor: 56800E
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

MC68HC908QT4VPE

NXP

IC MCU 8BIT 4KB FLASH 8DIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 5
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

パッケージ: 8-DIP (0.300", 7.62mm)

MCF51JM128VLH

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: CAN, I2C, SCI, SPI, USB OTG
• Peripherals: LVD, PWM, WDT
• Number of I/O: 51
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

MK20DX256VLH7

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 24x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

MPXV2010DP

NXP

SENSOR INTEG SILICON PRESSURE

• Pressure Type: Differential
• Operating Pressure: 1.45 PSI (10 kPa)
• Output Type: Wheatstone Bridge
• Output: 0 mV ~ 25 mV (10V)
• Accuracy: ±1%
• Voltage - Supply: 10 V ~ 16 V
• Port Size: Male - 0.13" (3.3mm) Tube, Dual
• Port Style: Barbed
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 10.88 PSI (75 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SMD Module
• Supplier Device Package: -

パッケージ: 8-SMD Module

MC33493DTBR2

NXP

IC RF TRANSMITTER UHF 14-TSSOP

• Frequency: 315 ~ 434MHz, 868 ~ 928MHz
• Applications: General Data Transfer
• Modulation or Protocol: FSK, OOK
• Data Rate (Max): 10 kbps
• Power - Output: -3dBm
• Current - Transmitting: 11.6mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Memory Size: -
• Features: -
• Voltage - Supply: 1.9 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)

パッケージ: 14-TSSOP (0.173", 4.40mm Width)

T4080NSN7QTB

NXP

QORIQ 64B POWER ARCH 8X 1.67GH

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

パッケージ: -

LS2088AXN7V1B

NXP

LS2088A XT 2000 R1.1

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

パッケージ: -

FS32K116LAT0MLFT

NXP

MCU S32K116 M0+ 128K 48LQFP

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

パッケージ: -

SPC5643AF0MLU2

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 84
• Program Memory Size: 3MB (3M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 192K x 8
• Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.25 V
• Data Converters: A/D 40x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP
• Supplier Device Package: 176-LQFP (24x24)

パッケージ: 176-LQFP

S912XEQ384ACAL

NXP

16-BIT MCU S12X CORE 384KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 24K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

パッケージ: 112-LQFP

MIMX9321DVXXMAB

NXP

IC

• Architecture: -
• Core Processor: -
• Flash Size: -
• RAM Size: -
• Peripherals: -
• Connectivity: -
• Speed: -
• Primary Attributes: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

パッケージ: -

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MIMXRT1061XVN5B

NXP

IC MCU 32BIT 128KB ROM 225MAPBGA

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit
• Speed: 500MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
• Number of I/O: 149
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: ROM
• EEPROM Size: -
• RAM Size: 1M x 8
• Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
• Data Converters: A/D 20x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 225-LFBGA
• Supplier Device Package: 225-MAPBGA (13x13)

パッケージ: -

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LX2160XE72232B

NXP

IC MPU QORLQ 2.2GHZ 1517FCPBGA

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 16 Core, 64-Bit
• Speed: 2.2GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: -
• Ethernet: 100Gbps (2)
• SATA: SATA 3.0 (4)
• USB: USB 3.0 (2) + PHY (2)
• Voltage - I/O: 1.2V, 1.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Security Features: Secure Boot, TrustZone®
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCPBGA (40x40)

パッケージ: -

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