ページ 259 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
PIP3104-P,127	NXP	TOPFET LOGIC LVL 50V TO220AB Switch Type: General Purpose Number of Outputs: 1 Ratio - Input:Output: 1:1 Output Configuration: Low Side Output Type: N-Channel Interface: On/Off Voltage - Load: 50V (Max) Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 8A Rds On (Typ): 68 mOhm Input Type: Non-Inverting Features: - Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage Operating Temperature: - Package / Case: TO-220-3 Supplier Device Package: TO-220AB	パッケージ: TO-220-3	在庫4,272
MC17XSF400EK	NXP	IC SWITCH HIGH SIDE 32SOIC Switch Type: General Purpose Number of Outputs: 4 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 7 V ~ 18 V Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Current - Output (Max): 5.5A Rds On (Typ): 17 mOhm Input Type: - Features: Slew Rate Controlled Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP	パッケージ: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad	在庫6,816
MC33937APEKR2	NXP	IC FET PRE-DRIVER 3PH 54SOIC Motor Type - Stepper: - Motor Type - AC, DC: Brushless DC (BLDC) Function: Controller - Commutation, Direction Management Output Configuration: Pre-Driver - Half Bridge (3) Interface: SPI Technology: NMOS Step Resolution: - Applications: Automotive Current - Output: - Voltage - Supply: 6 V ~ 58 V Voltage - Load: - Operating Temperature: -40°C ~ 135°C (TA) Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC W EP	パッケージ: 54-SSOP (0.295", 7.50mm Width) Exposed Pad	在庫7,440
CBTS3253D,112	NXP	IC 2BIT 1:4 FET MUX/DEMUX 16SOIC Type: Multiplexer/Demultiplexer Circuit: 2 x 4:1 Independent Circuits: 1 Current - Output High, Low: - Voltage Supply Source: Single Supply Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	パッケージ: 16-SOIC (0.154", 3.90mm Width)	在庫7,728
PCA8550D,118	NXP	IC I2C EEPROM DIP SWITCH 16SOIC Type: Multiplexer Circuit: 1 x 4:4 Independent Circuits: 1 Current - Output High, Low: 2mA, 2mA Voltage Supply Source: Single Supply Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	パッケージ: 16-SOIC (0.154", 3.90mm Width)	在庫43,104
74ALVCH162244DGG:5	NXP	IC BUFF DVR TRI-ST 16BIT 48TSSOP Logic Type: Buffer, Non-Inverting Number of Elements: 4 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 12mA, 12mA Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 48-TSSOP	パッケージ: 48-TFSOP (0.240", 6.10mm Width)	在庫6,384
TFA9887UK/N2BZ	NXP	IC AUDIO AMP CLASS D 29WLCSP Type: Class D Output Type: 1-Channel (Mono) Max Output Power x Channels @ Load: 2.65W x 1 @ 4 Ohm Voltage - Supply: 2.5 V ~ 5.5 V Features: Depop, Short-Circuit and Thermal Protection Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 29-WLCSP (3.19x2.07) Package / Case: 29-UFBGA, WLCSP	パッケージ: 29-UFBGA, WLCSP	在庫4,416
SC16C852LIBS,151	NXP	IC UART DUAL W/FIFO 32-HVQFN Features: - Number of Channels: 2, DUART FIFO's: 128 Byte Protocol: RS485 Data Rate (Max): 5Mbps Voltage - Supply: 1.8V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	パッケージ: 32-VFQFN Exposed Pad	在庫3,536
M86203G12	NXP	IC C2K 1.2GHZ 8CH VOIP 625BGA Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫2,832
MCZ33199EFR2	NXP	IC SERIAL LINK DVR AUTO 14-SOIC Applications: Diagnostic Interface: Serial Voltage - Supply: 4.5 V ~ 5.5 V Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SOIC Mounting Type: Surface Mount	パッケージ: 14-SOIC (0.154", 3.90mm Width)	在庫60,612
P2040NSE1HLB	NXP	IC MPU Q OR IQ 800MHZ 780FCBGA Core Processor: PowerPC e500mc Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Security; SEC 4.2 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (5) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox Package / Case: - Supplier Device Package: 780-FCPBGA (23x23)	パッケージ: -	在庫7,368
MPC860PVR80D4R2	NXP	IC MPU MPC8XX 80MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	パッケージ: 357-BBGA	在庫3,792
MPC8358CVVAGDGA	NXP	IC MPU MPC83XX 400MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	パッケージ: 740-LBGA	在庫5,552
P87C52SFBB,557	NXP	IC MCU 8BIT 8KB OTP 44QFP Core Processor: 8051 Core Size: 8-Bit Speed: 16MHz Connectivity: EBI/EMI, UART/USART Peripherals: POR Number of I/O: 32 Program Memory Size: 8KB (8K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-QFP Supplier Device Package: 44-PQFP (10x10)	パッケージ: 44-QFP	在庫3,296
MCF52277CVM160	NXP	IC MCU 32BIT ROMLESS 196MAPBGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 166.67MHz Connectivity: CAN, EBI/EMI, I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, LCD, PWM, WDT Number of I/O: 55 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15)	パッケージ: 196-LBGA	在庫4,768
MCF5212CAE66	NXP	IC MCU 32BIT 256KB FLASH 64LQFP Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 66MHz Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 55 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫10,620
LPC1768FBD100,551	NXP	IC MCU 32BIT 512KB FLASH 100LQFP Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 8x12b, D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: 100-LQFP	在庫109,182
MPXM2102AST1	NXP	SENS PRESSURE 14.5 PSI MAX MPAK Pressure Type: Absolute Operating Pressure: 14.5 PSI (100 kPa) Output Type: Wheatstone Bridge Output: 0 mV ~ 40 mV (10V) Accuracy: - Voltage - Supply: 10 V ~ 16 V Port Size: Male - 0.12" (2.97mm) Tube Port Style: Barbless Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 5-SMD Module Supplier Device Package: 5-MPAK	パッケージ: 5-SMD Module	在庫7,506
MMA5148NDKGCWR2	NXP	ACCELEROMETER PSI5 16QFN Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫7,596
MC33FS6503NAER2	NXP	SYSTEM BASIS CHIP DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP Exposed Pad	在庫4,432
MC32PF1510A2EP	NXP	PF1510 Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Current - Supply: - Voltage - Supply: 3.8 V ~ 7 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-QFN (5x5)	パッケージ: 40-VFQFN Exposed Pad	在庫3,136
MCIMX6X1CVO08AC	NXP	I.MX6SX ROM PERF ENHAN Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 200MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17x17)	パッケージ: 400-LFBGA	在庫3,904
SPC5644BF0MLU1R	NXP	NXP 32-BIT MCU POWER ARCH 1.5M Core Processor: e200z4d Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 147 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 27x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	パッケージ: 176-LQFP	在庫7,552
FS32K144MNT0VLHR	NXP	S32K144 32-BIT MCU ARM Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫2,656
S912ZVC64F0VLF	NXP	MAGNIV 16-BIT MCU S12Z CORE 64 Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 28 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V Data Converters: A/D 10x10b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP	在庫4,432
LX2120XN72029B	NXP	IC MPU QORLQ LX2 2GHZ 1517FCPBGA Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 12 Core, 64-Bit Speed: 2GHz Co-Processors/DSP: - RAM Controllers: DDR4 Graphics Acceleration: Yes Display & Interface Controllers: - Ethernet: 100Gbps (2) SATA: SATA 3.0 (4) USB: USB 3.0 (2) + PHY (2) Voltage - I/O: 1.2V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: Secure Boot, TrustZone® Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCPBGA (40x40)	パッケージ: -	Request a Quote
TJF1441AT-0Z	NXP	IC TRANSCEIVER HALF 1/1 8SO Type: Transceiver Protocol: CANbus Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 50 mV Data Rate: 5Mbps Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	パッケージ: -	在庫8,802
SPC5745BBK1AVKU6	NXP	IC MCU 32BIT 2MB FLASH 176LQFP Core Processor: e200z4 Core Size: 32-Bit Single-Core Speed: 160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	パッケージ: -	Request a Quote

PIP3104-P,127

NXP

TOPFET LOGIC LVL 50V TO220AB

Switch Type: General Purpose
Number of Outputs: 1
Ratio - Input:Output: 1:1
Output Configuration: Low Side
Output Type: N-Channel
Interface: On/Off
Voltage - Load: 50V (Max)
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 8A
Rds On (Typ): 68 mOhm
Input Type: Non-Inverting
Features: -
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
Operating Temperature: -
Package / Case: TO-220-3
Supplier Device Package: TO-220AB

パッケージ: TO-220-3

在庫4,272

MC17XSF400EK

NXP

IC SWITCH HIGH SIDE 32SOIC

Switch Type: General Purpose
Number of Outputs: 4
Ratio - Input:Output: 1:1
Output Configuration: High Side
Output Type: N-Channel
Interface: SPI
Voltage - Load: 7 V ~ 18 V
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Current - Output (Max): 5.5A
Rds On (Typ): 17 mOhm
Input Type: -
Features: Slew Rate Controlled
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP

パッケージ: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

在庫6,816

MC33937APEKR2

NXP

IC FET PRE-DRIVER 3PH 54SOIC

Motor Type - Stepper: -
Motor Type - AC, DC: Brushless DC (BLDC)
Function: Controller - Commutation, Direction Management
Output Configuration: Pre-Driver - Half Bridge (3)
Interface: SPI
Technology: NMOS
Step Resolution: -
Applications: Automotive
Current - Output: -
Voltage - Supply: 6 V ~ 58 V
Voltage - Load: -
Operating Temperature: -40°C ~ 135°C (TA)
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-SOIC W EP

パッケージ: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

在庫7,440

CBTS3253D,112

NXP

IC 2BIT 1:4 FET MUX/DEMUX 16SOIC

Type: Multiplexer/Demultiplexer
Circuit: 2 x 4:1
Independent Circuits: 1
Current - Output High, Low: -
Voltage Supply Source: Single Supply
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

パッケージ: 16-SOIC (0.154", 3.90mm Width)

在庫7,728

PCA8550D,118

NXP

IC I2C EEPROM DIP SWITCH 16SOIC

Type: Multiplexer
Circuit: 1 x 4:4
Independent Circuits: 1
Current - Output High, Low: 2mA, 2mA
Voltage Supply Source: Single Supply
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

パッケージ: 16-SOIC (0.154", 3.90mm Width)

在庫43,104

74ALVCH162244DGG:5

NXP

IC BUFF DVR TRI-ST 16BIT 48TSSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 1.2 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 48-TSSOP

パッケージ: 48-TFSOP (0.240", 6.10mm Width)

在庫6,384

TFA9887UK/N2BZ

NXP

IC AUDIO AMP CLASS D 29WLCSP

Type: Class D
Output Type: 1-Channel (Mono)
Max Output Power x Channels @ Load: 2.65W x 1 @ 4 Ohm
Voltage - Supply: 2.5 V ~ 5.5 V
Features: Depop, Short-Circuit and Thermal Protection
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 29-WLCSP (3.19x2.07)
Package / Case: 29-UFBGA, WLCSP

パッケージ: 29-UFBGA, WLCSP

在庫4,416

SC16C852LIBS,151

NXP

IC UART DUAL W/FIFO 32-HVQFN

Features: -
Number of Channels: 2, DUART
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 5Mbps
Voltage - Supply: 1.8V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

パッケージ: 32-VFQFN Exposed Pad

在庫3,536

M86203G12

NXP

IC C2K 1.2GHZ 8CH VOIP 625BGA

Function: -
Interface: -
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫2,832

MCZ33199EFR2

NXP

IC SERIAL LINK DVR AUTO 14-SOIC

Applications: Diagnostic
Interface: Serial
Voltage - Supply: 4.5 V ~ 5.5 V
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SOIC
Mounting Type: Surface Mount

パッケージ: 14-SOIC (0.154", 3.90mm Width)

在庫60,612

P2040NSE1HLB

NXP

IC MPU Q OR IQ 800MHZ 780FCBGA

Core Processor: PowerPC e500mc
Number of Cores/Bus Width: 4 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (5)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Package / Case: -
Supplier Device Package: 780-FCPBGA (23x23)

パッケージ: -

在庫7,368

MPC860PVR80D4R2

NXP

IC MPU MPC8XX 80MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 80MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (4), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

パッケージ: 357-BBGA

在庫3,792

MPC8358CVVAGDGA

NXP

IC MPU MPC83XX 400MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

パッケージ: 740-LBGA

在庫5,552

P87C52SFBB,557

NXP

IC MCU 8BIT 8KB OTP 44QFP

Core Processor: 8051
Core Size: 8-Bit
Speed: 16MHz
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Number of I/O: 32
Program Memory Size: 8KB (8K x 8)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 44-QFP
Supplier Device Package: 44-PQFP (10x10)

パッケージ: 44-QFP

在庫3,296

MCF52277CVM160

NXP

IC MCU 32BIT ROMLESS 196MAPBGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 166.67MHz
Connectivity: CAN, EBI/EMI, I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Number of I/O: 55
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 196-LBGA
Supplier Device Package: 196-MAPBGA (15x15)

パッケージ: 196-LBGA

在庫4,768

MCF5212CAE66

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 66MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 55
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫10,620

LPC1768FBD100,551

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

Core Processor: ARM? Cortex?-M3
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CAN, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O: 70
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
Data Converters: A/D 8x12b, D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

在庫109,182

MPXM2102AST1

NXP

SENS PRESSURE 14.5 PSI MAX MPAK

Pressure Type: Absolute
Operating Pressure: 14.5 PSI (100 kPa)
Output Type: Wheatstone Bridge
Output: 0 mV ~ 40 mV (10V)
Accuracy: -
Voltage - Supply: 10 V ~ 16 V
Port Size: Male - 0.12" (2.97mm) Tube
Port Style: Barbless
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 58.02 PSI (400 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 5-SMD Module
Supplier Device Package: 5-MPAK

パッケージ: 5-SMD Module

在庫7,506

MMA5148NDKGCWR2

NXP

ACCELEROMETER PSI5 16QFN

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫7,596

MC33FS6503NAER2

NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP Exposed Pad

在庫4,432

MC32PF1510A2EP

NXP

PF1510

Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Current - Supply: -
Voltage - Supply: 3.8 V ~ 7 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-QFN (5x5)

パッケージ: 40-VFQFN Exposed Pad

在庫3,136

MCIMX6X1CVO08AC

NXP

I.MX6SX ROM PERF ENHAN

Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 200MHz, 800MHz
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Package / Case: 400-LFBGA
Supplier Device Package: 400-MAPBGA (17x17)

パッケージ: 400-LFBGA

在庫3,904

SPC5644BF0MLU1R

NXP

NXP 32-BIT MCU POWER ARCH 1.5M

Core Processor: e200z4d
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 147
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 27x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

パッケージ: 176-LQFP

在庫7,552

FS32K144MNT0VLHR

NXP

S32K144 32-BIT MCU ARM

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: -
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫2,656

S912ZVC64F0VLF

NXP

MAGNIV 16-BIT MCU S12Z CORE 64

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 28
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
Data Converters: A/D 10x10b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP

在庫4,432

LX2120XN72029B

NXP

IC MPU QORLQ LX2 2GHZ 1517FCPBGA

Core Processor: ARM® Cortex®-A72
Number of Cores/Bus Width: 12 Core, 64-Bit
Speed: 2GHz
Co-Processors/DSP: -
RAM Controllers: DDR4
Graphics Acceleration: Yes
Display & Interface Controllers: -
Ethernet: 100Gbps (2)
SATA: SATA 3.0 (4)
USB: USB 3.0 (2) + PHY (2)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TJ)
Security Features: Secure Boot, TrustZone®
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCPBGA (40x40)

パッケージ: -

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TJF1441AT-0Z

NXP

IC TRANSCEIVER HALF 1/1 8SO

Type: Transceiver
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 50 mV
Data Rate: 5Mbps
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

パッケージ: -

在庫8,802

SPC5745BBK1AVKU6

NXP

IC MCU 32BIT 2MB FLASH 176LQFP

Core Processor: e200z4
Core Size: 32-Bit Single-Core
Speed: 160MHz
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 129
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Data Converters: A/D 36x10b, 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

パッケージ: -

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