ページ 31 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
PSMN035-100LS,115	NXP	MOSFET N-CH QFN3333 FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 100V Current - Continuous Drain (Id) @ 25°C: 27A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 23nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 1350pF @ 50V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 65W (Tc) Rds On (Max) @ Id, Vgs: 32 mOhm @ 10A, 10V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 8-DFN3333 (3.3x3.3) Package / Case: 8-VDFN Exposed Pad	パッケージ: 8-VDFN Exposed Pad	在庫2,992
2N7002PM,315	NXP	MOSFET N-CH 60V 0.3A SOT-883 FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 60V Current - Continuous Drain (Id) @ 25°C: 300mA (Ta) Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs(th) (Max) @ Id: - Gate Charge (Qg) (Max) @ Vgs: - Input Capacitance (Ciss) (Max) @ Vds: - Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 250mW (Ta) Rds On (Max) @ Id, Vgs: - Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Supplier Device Package: DFN1006-3 Package / Case: SC-101, SOT-883	パッケージ: SC-101, SOT-883	在庫7,616
BFG310/XR,215	NXP	TRANS NPN 4.5V 18GHZ SOT143R Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 6V Frequency - Transition: 14GHz Noise Figure (dB Typ @ f): 1dB @ 2GHz Gain: 18dB Power - Max: 60mW DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 3V Current - Collector (Ic) (Max): 10mA Operating Temperature: 175°C (TJ) Mounting Type: Surface Mount Package / Case: SOT-143R Supplier Device Package: SOT-143R	パッケージ: SOT-143R	在庫7,760
LD6816CX4/22P,315	NXP	IC REG LINEAR 2.2V 150MA 4WLCSP Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 2.2V Voltage - Output (Max): - Voltage Dropout (Max): 0.075V @ 150mA Current - Output: 150mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature, Transient Voltage Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-XFBGA, WLCSP Supplier Device Package: 4-WLCSP (0.76x0.76)	パッケージ: 4-XFBGA, WLCSP	在庫5,616
SE97TP/S900,547	NXP	IC TEMP SENSOR DIMM 3.3V 8-HWSON Function: Temp Monitoring System (Sensor), DIMM DDR Memory Sensor Type: Internal Sensing Temperature: -40°C ~ 125°C Accuracy: ±3°C Topology: ADC (Sigma Delta), Comparator, Register Bank Output Type: 2-Wire Serial, I2C/SMBUS Output Alarm: Yes Output Fan: Yes Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-WFDFN Exposed Pad Supplier Device Package: 8-HWSON (2x3)	パッケージ: 8-WFDFN Exposed Pad	在庫7,712
74HCT540N-Q100U	NXP	IC INVERTER 8-INPUT 20DIP Logic Type: Buffer, Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 6mA, 6mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	パッケージ: 20-DIP (0.300", 7.62mm)	在庫2,688
74ALVT162241DGG,11	NXP	IC BUFF DVR TRI-ST 16BIT 48TSSOP Logic Type: Buffer, Non-Inverting Number of Elements: 4 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 12mA, 12mA Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 48-TSSOP	パッケージ: 48-TFSOP (0.240", 6.10mm Width)	在庫2,928
74ABT544PW,118	NXP	IC TRANSCVR 3ST 8BIT INV 24TSSOP Logic Type: Transceiver, Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP	パッケージ: 24-TSSOP (0.173", 4.40mm Width)	在庫3,328
UJA1079ATW/5V0WD,1	NXP	IC SBC LIN 5.0V 32HTSSOP Applications: Automotive Interface: SPI Serial Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	パッケージ: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	在庫5,904
MC145011P	NXP	IC SMOKE DETECT PHOTOELEC 16-DIP Type: Smoke Detector Input Type: Photoelectric Output Type: Voltage Interface: - Current - Supply: 12µA Operating Temperature: -10°C ~ 60°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-PDIP	パッケージ: 16-DIP (0.300", 7.62mm)	在庫4,640
NX3L1T5157GM,115	NXP	IC ANALOG SWITCH XSON6 Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Number of Circuits: 1 On-State Resistance (Max): 750 mOhm Channel-to-Channel Matching (ΔRon): 20 mOhm Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V Voltage - Supply, Dual (V±): - Switch Time (Ton, Toff) (Max): 40ns, 20ns -3db Bandwidth: 60MHz Charge Injection: 15pC Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Crosstalk: - Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 6-XFDFN Supplier Device Package: 6-XSON, SOT886 (1.45x1)	パッケージ: 6-XFDFN	在庫7,632
MPC8544EAVTARJ	NXP	IC MPU MPC85XX 1.067GHZ 783BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.067GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫6,464
MPC8349VVAJD	NXP	IC MPU MPC83XX 533MHZ 672TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 672-LBGA Supplier Device Package: 672-TBGA (35x35)	パッケージ: 672-LBGA	在庫3,056
MCIMX31LCVMN4C	NXP	IC MPU I.MX31 400MHZ 473MAPBGA Core Processor: ARM1136JF-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP RAM Controllers: DDR Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, Keypad, LCD Ethernet: - SATA: - USB: USB 2.0 (3) Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory Package / Case: 473-LFBGA Supplier Device Package: -	パッケージ: 473-LFBGA	在庫4,192
MCS12GC64MFUE	NXP	IC MCU 16BIT 64KB FLASH 80QFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 60 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	パッケージ: 80-QFP	在庫6,656
MCF5474VR200	NXP	IC MCU 32BIT ROMLESS 388PBGA Core Processor: Coldfire V4E Core Size: 32-Bit Speed: 200MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Number of I/O: 99 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 388-BBGA Supplier Device Package: 388-PBGA (27x27)	パッケージ: 388-BBGA	在庫3,536
SPC5746CHK0AMMH6	NXP	IC MCU 32BIT 3MB FLASH 256MAPBGA Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: - Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPPBGA (17x17)	パッケージ: 256-LBGA	在庫2,896
SPC5602BK0MLL6	NXP	IC MCU 32BIT 256KB FLASH 100LQFP Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 16 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 28x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: 100-LQFP	在庫6,528
MSC8101VT1375F	NXP	IC DSP 16BIT 250MHZ 332FCBGA Type: SC140 Core Interface: Communications Processor Module (CPM) Clock Rate: 275MHz Non-Volatile Memory: External On-Chip RAM: 512kB Voltage - I/O: 3.30V Voltage - Core: 1.60V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 332-BFBGA, FCPBGA Supplier Device Package: 332-FCBGA (17x17)	パッケージ: 332-BFBGA, FCPBGA	在庫5,072
NT3H1201W0FHKH	NXP	IC SMART TAG Type: RFID Transponder Frequency: 13.56MHz Standards: ISO 14443 Interface: I2C Voltage - Supply: 1.7 V ~ 3.6 V Operating Temperature: -40°C ~ 95°C Package / Case: 8-XFQFN Exposed Pad Supplier Device Package: 8-XQFN (1.6x1.6)	パッケージ: 8-XFQFN Exposed Pad	在庫29,964
MIMXRT1064CVL5A	NXP	I.MXRT1064 MPU 196MAPBGA Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: 196-LFBGA Supplier Device Package: 196-MAPBGA (10x10)	パッケージ: 196-LFBGA	在庫2,224
SPC5646CK0MMJ1	NXP	3M FLASH256K RAM120MHZ Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Speed: 80MHz/120MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 199 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 33x10b, 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	パッケージ: 256-LBGA	在庫4,096
S32G398ASCK1VUCT	NXP	8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1 Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 2.5Gbps (3) SATA: - USB: USB 2.0 OTG (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	パッケージ: -	Request a Quote
MC33FS4505NAER2	NXP	SYSTEM BASIS CHIP, LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	パッケージ: -	Request a Quote
MVR5510AMDA0ES	NXP	IC PMIC VR5510 ASIL-D Applications: - Current - Supply: 15mA Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	パッケージ: -	在庫2,340
S9S12G64J0MLHR	NXP	S12 CORE 64K FLASH Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: -	Request a Quote
TEA2209T-1J	NXP	IC ACTIVE BRIDGE CTRL SO16 Applications: Desktop, Notebook PCs Current - Supply: 2mA Voltage - Supply: 440V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	パッケージ: -	Request a Quote
K32L2B21VFT0A	NXP	IC MCU 32BIT 128KB FLASH 48QFN Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Speed: 48MHz Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Number of I/O: - Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.2V Data Converters: - Oscillator Type: Internal Operating Temperature: - Mounting Type: Surface Mount Package / Case: 48-UFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	パッケージ: -	Request a Quote

PSMN035-100LS,115

NXP

MOSFET N-CH QFN3333

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 27A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs(th) (Max) @ Id: 4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 23nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds: 1350pF @ 50V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 65W (Tc)
Rds On (Max) @ Id, Vgs: 32 mOhm @ 10A, 10V
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Package / Case: 8-VDFN Exposed Pad

パッケージ: 8-VDFN Exposed Pad

在庫2,992

2N7002PM,315

NXP

MOSFET N-CH 60V 0.3A SOT-883

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 300mA (Ta)
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs(th) (Max) @ Id: -
Gate Charge (Qg) (Max) @ Vgs: -
Input Capacitance (Ciss) (Max) @ Vds: -
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 250mW (Ta)
Rds On (Max) @ Id, Vgs: -
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: DFN1006-3
Package / Case: SC-101, SOT-883

パッケージ: SC-101, SOT-883

在庫7,616

BFG310/XR,215

NXP

TRANS NPN 4.5V 18GHZ SOT143R

Transistor Type: NPN
Voltage - Collector Emitter Breakdown (Max): 6V
Frequency - Transition: 14GHz
Noise Figure (dB Typ @ f): 1dB @ 2GHz
Gain: 18dB
Power - Max: 60mW
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 3V
Current - Collector (Ic) (Max): 10mA
Operating Temperature: 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SOT-143R
Supplier Device Package: SOT-143R

パッケージ: SOT-143R

在庫7,760

LD6816CX4/22P,315

NXP

IC REG LINEAR 2.2V 150MA 4WLCSP

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 2.2V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.075V @ 150mA
Current - Output: 150mA
Current - Quiescent (Iq): -
Current - Supply (Max): 100µA ~ 250µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature, Transient Voltage
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 4-XFBGA, WLCSP
Supplier Device Package: 4-WLCSP (0.76x0.76)

パッケージ: 4-XFBGA, WLCSP

在庫5,616

SE97TP/S900,547

NXP

IC TEMP SENSOR DIMM 3.3V 8-HWSON

Function: Temp Monitoring System (Sensor), DIMM DDR Memory
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Accuracy: ±3°C
Topology: ADC (Sigma Delta), Comparator, Register Bank
Output Type: 2-Wire Serial, I2C/SMBUS
Output Alarm: Yes
Output Fan: Yes
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 8-WFDFN Exposed Pad
Supplier Device Package: 8-HWSON (2x3)

パッケージ: 8-WFDFN Exposed Pad

在庫7,712

74HCT540N-Q100U

NXP

IC INVERTER 8-INPUT 20DIP

Logic Type: Buffer, Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 6mA, 6mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)
Supplier Device Package: 20-DIP

パッケージ: 20-DIP (0.300", 7.62mm)

在庫2,688

74ALVT162241DGG,11

NXP

IC BUFF DVR TRI-ST 16BIT 48TSSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 48-TSSOP

パッケージ: 48-TFSOP (0.240", 6.10mm Width)

在庫2,928

74ABT544PW,118

NXP

IC TRANSCVR 3ST 8BIT INV 24TSSOP

Logic Type: Transceiver, Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 24-TSSOP

パッケージ: 24-TSSOP (0.173", 4.40mm Width)

在庫3,328

UJA1079ATW/5V0WD,1

NXP

IC SBC LIN 5.0V 32HTSSOP

Applications: Automotive
Interface: SPI Serial
Voltage - Supply: 4.5 V ~ 28 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

パッケージ: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

在庫5,904

MC145011P

NXP

IC SMOKE DETECT PHOTOELEC 16-DIP

Type: Smoke Detector
Input Type: Photoelectric
Output Type: Voltage
Interface: -
Current - Supply: 12µA
Operating Temperature: -10°C ~ 60°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-PDIP

パッケージ: 16-DIP (0.300", 7.62mm)

在庫4,640

NX3L1T5157GM,115

NXP

IC ANALOG SWITCH XSON6

Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Number of Circuits: 1
On-State Resistance (Max): 750 mOhm
Channel-to-Channel Matching (ΔRon): 20 mOhm
Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
Voltage - Supply, Dual (V±): -
Switch Time (Ton, Toff) (Max): 40ns, 20ns
-3db Bandwidth: 60MHz
Charge Injection: 15pC
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Crosstalk: -
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 6-XFDFN
Supplier Device Package: 6-XSON, SOT886 (1.45x1)

パッケージ: 6-XFDFN

在庫7,632

MPC8544EAVTARJ

NXP

IC MPU MPC85XX 1.067GHZ 783BGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.067GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫6,464

MPC8349VVAJD

NXP

IC MPU MPC83XX 533MHZ 672TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 533MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 672-LBGA
Supplier Device Package: 672-TBGA (35x35)

パッケージ: 672-LBGA

在庫3,056

MCIMX31LCVMN4C

NXP

IC MPU I.MX31 400MHZ 473MAPBGA

Core Processor: ARM1136JF-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Ethernet: -
SATA: -
USB: USB 2.0 (3)
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Package / Case: 473-LFBGA
Supplier Device Package: -

パッケージ: 473-LFBGA

在庫4,192

MCS12GC64MFUE

NXP

IC MCU 16BIT 64KB FLASH 80QFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 60
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

パッケージ: 80-QFP

在庫6,656

MCF5474VR200

NXP

IC MCU 32BIT ROMLESS 388PBGA

Core Processor: Coldfire V4E
Core Size: 32-Bit
Speed: 200MHz
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Number of I/O: 99
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 388-BBGA
Supplier Device Package: 388-PBGA (27x27)

パッケージ: 388-BBGA

在庫3,536

SPC5746CHK0AMMH6

NXP

IC MCU 32BIT 3MB FLASH 256MAPBGA

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz/160MHz
Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: -
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPPBGA (17x17)

パッケージ: 256-LBGA

在庫2,896

SPC5602BK0MLL6

NXP

IC MCU 32BIT 256KB FLASH 100LQFP

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 79
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 16
RAM Size: 24K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 28x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

在庫6,528

MSC8101VT1375F

NXP

IC DSP 16BIT 250MHZ 332FCBGA

Type: SC140 Core
Interface: Communications Processor Module (CPM)
Clock Rate: 275MHz
Non-Volatile Memory: External
On-Chip RAM: 512kB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 332-BFBGA, FCPBGA
Supplier Device Package: 332-FCBGA (17x17)

パッケージ: 332-BFBGA, FCPBGA

在庫5,072

NT3H1201W0FHKH

NXP

IC SMART TAG

Type: RFID Transponder
Frequency: 13.56MHz
Standards: ISO 14443
Interface: I2C
Voltage - Supply: 1.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 95°C
Package / Case: 8-XFQFN Exposed Pad
Supplier Device Package: 8-XQFN (1.6x1.6)

パッケージ: 8-XFQFN Exposed Pad

在庫29,964

MIMXRT1064CVL5A

NXP

I.MXRT1064 MPU 196MAPBGA

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: 196-LFBGA
Supplier Device Package: 196-MAPBGA (10x10)

パッケージ: 196-LFBGA

在庫2,224

SPC5646CK0MMJ1

NXP

3M FLASH256K RAM120MHZ

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 199
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 33x10b, 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

パッケージ: 256-LBGA

在庫4,096

S32G398ASCK1VUCT

NXP

8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1

Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
Speed: 400MHz, 1.3GHz
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 2.5Gbps (3)
SATA: -
USB: USB 2.0 OTG (1)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

パッケージ: -

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MC33FS4505NAER2

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

パッケージ: -

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MVR5510AMDA0ES

NXP

IC PMIC VR5510 ASIL-D

Applications: -
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

パッケージ: -

在庫2,340

S9S12G64J0MLHR

NXP

S12 CORE 64K FLASH

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: -

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TEA2209T-1J

NXP

IC ACTIVE BRIDGE CTRL SO16

Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Voltage - Supply: 440V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

パッケージ: -

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K32L2B21VFT0A

NXP

IC MCU 32BIT 128KB FLASH 48QFN

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Speed: 48MHz
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Number of I/O: -
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.2V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 48-UFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

パッケージ: -

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