ページ 537 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
PHX18NQ11T,127	NXP	MOSFET N-CH 110V 12.5A SOT186A FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 110V Current - Continuous Drain (Id) @ 25°C: 12.5A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 21nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 635pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 31.2W (Tc) Rds On (Max) @ Id, Vgs: 90 mOhm @ 9A, 10V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220-3 Package / Case: TO-220-3 Full Pack, Isolated Tab	パッケージ: TO-220-3 Full Pack, Isolated Tab	在庫4,224
BC856T,115	NXP	TRANS PNP 65V 0.1A SC-75 Transistor Type: PNP Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 65V Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 125 @ 2mA, 5V Power - Max: 150mW Frequency - Transition: 100MHz Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-75, SOT-416 Supplier Device Package: SC-75	パッケージ: SC-75, SOT-416	在庫4,512
PZM3.9NB2,115	NXP	DIODE ZENER 3.9V 300MW SMT3 Voltage - Zener (Nom) (Vz): 3.9V Tolerance: ±2% Power - Max: 300mW Impedance (Max) (Zzt): 90 Ohms Current - Reverse Leakage @ Vr: 3µA @ 1V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫4,160
MC13892JVLR2	NXP	IC PMU I.MX51/37/35/27 186MAPBGA Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply Current - Supply: - Voltage - Supply: - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 186-LFBGA Supplier Device Package: 186-PBGA (12x12)	パッケージ: 186-LFBGA	在庫17,016
74LV573N,112	NXP	IC OCTAL D TRANSP LATCH 20-DIP Logic Type: D-Type Transparent Latch Circuit: 8:8 Output Type: Tri-State Voltage - Supply: 1 V ~ 5.5 V Independent Circuits: 1 Delay Time - Propagation: 24ns Current - Output High, Low: 16mA, 16mA Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	パッケージ: 20-DIP (0.300", 7.62mm)	在庫4,080
74ABT573AD,112	NXP	IC OCTAL D TRANSP LATCH 20SOIC Logic Type: D-Type Transparent Latch Circuit: 8:8 Output Type: Tri-State Voltage - Supply: 4.5 V ~ 5.5 V Independent Circuits: 1 Delay Time - Propagation: 3.3ns Current - Output High, Low: 32mA, 64mA Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	パッケージ: 20-SOIC (0.295", 7.50mm Width)	在庫4,112
74LV374DB,112	NXP	IC D-TYPE POS TRG SNGL 20SSOP Function: Standard Type: D-Type Output Type: Tri-State, Non-Inverted Number of Elements: 1 Number of Bits per Element: 8 Clock Frequency: 77MHz Max Propagation Delay @ V, Max CL: 19ns @ 5V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 16mA, 16mA Voltage - Supply: 1 V ~ 5.5 V Current - Quiescent (Iq): 160µA Input Capacitance: 3.5pF Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 20-SSOP (0.209", 5.30mm Width)	パッケージ: 20-SSOP (0.209", 5.30mm Width)	在庫6,208
MB2244BB,557	NXP	IC BUFF/DRVR 3-ST 16-BIT 52-QFP Logic Type: Buffer, Non-Inverting Number of Elements: 4 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 52-QFP Supplier Device Package: 52-QFP (10x10)	パッケージ: 52-QFP	在庫5,280
MC34017A-3P	NXP	IC PHONE TONE RINGER 500HZ 8-DIP Function: Tone Ringer Interface: - Number of Circuits: 1 Voltage - Supply: 5V Current - Supply: 20mA Power (Watts): 1W Operating Temperature: -20°C ~ 60°C Mounting Type: Through Hole Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	パッケージ: 8-DIP (0.300", 7.62mm)	在庫5,920
TDA8026ET/C2,551	NXP	IC SMART CARD SLOT 64TFBGA Applications: - Interface: I2C Voltage - Supply: 2.7 V ~ 5.5 V Package / Case: 64-TFBGA Supplier Device Package: 64-TFBGA Mounting Type: Surface Mount	パッケージ: 64-TFBGA	在庫20,484
PCA9670PW,118	NXP	IC I/O EXPANDER I2C 8B 16TSSOP Number of I/O: 8 Interface: I2C Interrupt Output: No Features: POR Output Type: Push-Pull Current - Output Source/Sink: 100µA, 25mA Clock Frequency: 1MHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	パッケージ: 16-TSSOP (0.173", 4.40mm Width)	在庫4,064
PCA9672D,518	NXP	IC I/O EXPANDER I2C 8B 16SOIC Number of I/O: 8 Interface: I2C Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 100µA, 25mA Clock Frequency: 1MHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SO	パッケージ: 16-SOIC (0.295", 7.50mm Width)	在庫5,664
MPC8313ECVRADDB	NXP	IC MPU MPC83XX 267MHZ 516BGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 267MHz Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27x27)	パッケージ: 516-BBGA Exposed Pad	在庫4,976
XPC823ECVR66B2	NXP	IC MPU MPC8XX 66MHZ 256BGA Core Processor: PowerPC Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Video Ethernet: 10 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Security Features: - Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	パッケージ: 256-BBGA	在庫3,680
KXPC8240LVV200E	NXP	IC MPU MPC82XX 200MHZ 352TBGA Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: - RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35x35)	パッケージ: 352-LBGA	在庫7,600
MCF51JM32EVLK	NXP	IC MCU 32BIT 32KB FLASH 80LQFP Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: CAN, I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Number of I/O: 66 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (14x14)	パッケージ: 80-LQFP	在庫4,832
SPC5602DF1MLH4R	NXP	IC MCU 32BIT 256KB FLASH 64LQFP Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 45 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 16 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫4,320
MC9S08LH64CLK	NXP	IC MCU 8BIT 64KB FLASH 80LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: LCD, LVD, PWM, WDT Number of I/O: 39 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (14x14)	パッケージ: 80-LQFP	在庫4,064
LPC2194HBD64/01,15	NXP	IC MCU 32BIT 256KB FLASH 64LQFP Core Processor: ARM7? Core Size: 16/32-Bit Speed: 60MHz Connectivity: CAN, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 46 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫6,420
PCK2002PD,112	NXP	IC CLK BUFFER 1:4 533MHZ 8SO Type: Fanout Buffer (Distribution) Number of Circuits: 1 Ratio - Input:Output: 1:4 Differential - Input:Output: No/No Input: LVTTL Output: LVTTL Frequency - Max: 533MHz Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	パッケージ: 8-SOIC (0.154", 3.90mm Width)	在庫2,192
MCIMX6Y7DVM09AB	NXP	I.MX6ULL ROM PERF ENHAN Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 900MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 OTG + PHY (2) Voltage - I/O: 1.8V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Package / Case: 289-LFBGA Supplier Device Package: 289-MAPBGA (14x14)	パッケージ: 289-LFBGA	在庫5,392
SPC5646CCK0VLU1	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Speed: 80MHz/120MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 147 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 27x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	パッケージ: 176-LQFP	在庫2,048
FS32R274VCK2MMM	NXP	NXP 32 BIT MCU 2M FLASH 1.5MB Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit Tri-Core Speed: 180MHz, 240MHz Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 1.5M x 8 Voltage - Supply (Vcc/Vdd): 1.19 V ~ 5.5 V Data Converters: A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 257-LFBGA Supplier Device Package: 257-MAPBGA (14x14)	パッケージ: 257-LFBGA	在庫2,448
S912XD128F2VAA	NXP	16-BIT MCU S12X CORE 128KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CANbus, I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b, 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	パッケージ: 80-QFP	在庫5,328
MC9S08AW48CFGER	NXP	S08AW 8-BIT MCU S08 CORE 48KB Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	パッケージ: 44-LQFP	在庫6,656
S9S08RN60W1VLH	NXP	8-BIT MCU S08 CORE 60KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 55 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫6,112
S9S12GA64J0MLF	NXP	IC MCU 16BIT 64KB FLASH 48LQFP Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: -	Request a Quote
UBA2080P-1-112	NXP	IC DRIVER HALF BRIDGE 8DIP Type: - Frequency: - Voltage - Supply: - Current - Supply: - Current - Output Source/Sink: - Dimming: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote

PHX18NQ11T,127

NXP

MOSFET N-CH 110V 12.5A SOT186A

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 110V
Current - Continuous Drain (Id) @ 25°C: 12.5A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs(th) (Max) @ Id: 4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 21nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds: 635pF @ 25V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 31.2W (Tc)
Rds On (Max) @ Id, Vgs: 90 mOhm @ 9A, 10V
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Through Hole
Supplier Device Package: TO-220-3
Package / Case: TO-220-3 Full Pack, Isolated Tab

パッケージ: TO-220-3 Full Pack, Isolated Tab

在庫4,224

BC856T,115

NXP

TRANS PNP 65V 0.1A SC-75

Transistor Type: PNP
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 65V
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 125 @ 2mA, 5V
Power - Max: 150mW
Frequency - Transition: 100MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Supplier Device Package: SC-75

パッケージ: SC-75, SOT-416

在庫4,512

PZM3.9NB2,115

NXP

DIODE ZENER 3.9V 300MW SMT3

Voltage - Zener (Nom) (Vz): 3.9V
Tolerance: ±2%
Power - Max: 300mW
Impedance (Max) (Zzt): 90 Ohms
Current - Reverse Leakage @ Vr: 3µA @ 1V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫4,160

MC13892JVLR2

NXP

IC PMU I.MX51/37/35/27 186MAPBGA

Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 186-LFBGA
Supplier Device Package: 186-PBGA (12x12)

パッケージ: 186-LFBGA

在庫17,016

74LV573N,112

NXP

IC OCTAL D TRANSP LATCH 20-DIP

Logic Type: D-Type Transparent Latch
Circuit: 8:8
Output Type: Tri-State
Voltage - Supply: 1 V ~ 5.5 V
Independent Circuits: 1
Delay Time - Propagation: 24ns
Current - Output High, Low: 16mA, 16mA
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)
Supplier Device Package: 20-DIP

パッケージ: 20-DIP (0.300", 7.62mm)

在庫4,080

74ABT573AD,112

NXP

IC OCTAL D TRANSP LATCH 20SOIC

Logic Type: D-Type Transparent Latch
Circuit: 8:8
Output Type: Tri-State
Voltage - Supply: 4.5 V ~ 5.5 V
Independent Circuits: 1
Delay Time - Propagation: 3.3ns
Current - Output High, Low: 32mA, 64mA
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO

パッケージ: 20-SOIC (0.295", 7.50mm Width)

在庫4,112

74LV374DB,112

NXP

IC D-TYPE POS TRG SNGL 20SSOP

Function: Standard
Type: D-Type
Output Type: Tri-State, Non-Inverted
Number of Elements: 1
Number of Bits per Element: 8
Clock Frequency: 77MHz
Max Propagation Delay @ V, Max CL: 19ns @ 5V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 16mA, 16mA
Voltage - Supply: 1 V ~ 5.5 V
Current - Quiescent (Iq): 160µA
Input Capacitance: 3.5pF
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.209", 5.30mm Width)

パッケージ: 20-SSOP (0.209", 5.30mm Width)

在庫6,208

MB2244BB,557

NXP

IC BUFF/DRVR 3-ST 16-BIT 52-QFP

Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 52-QFP
Supplier Device Package: 52-QFP (10x10)

パッケージ: 52-QFP

在庫5,280

MC34017A-3P

NXP

IC PHONE TONE RINGER 500HZ 8-DIP

Function: Tone Ringer
Interface: -
Number of Circuits: 1
Voltage - Supply: 5V
Current - Supply: 20mA
Power (Watts): 1W
Operating Temperature: -20°C ~ 60°C
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

パッケージ: 8-DIP (0.300", 7.62mm)

在庫5,920

TDA8026ET/C2,551

NXP

IC SMART CARD SLOT 64TFBGA

Applications: -
Interface: I2C
Voltage - Supply: 2.7 V ~ 5.5 V
Package / Case: 64-TFBGA
Supplier Device Package: 64-TFBGA
Mounting Type: Surface Mount

パッケージ: 64-TFBGA

在庫20,484

PCA9670PW,118

NXP

IC I/O EXPANDER I2C 8B 16TSSOP

Number of I/O: 8
Interface: I2C
Interrupt Output: No
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 100µA, 25mA
Clock Frequency: 1MHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

パッケージ: 16-TSSOP (0.173", 4.40mm Width)

在庫4,064

PCA9672D,518

NXP

IC I/O EXPANDER I2C 8B 16SOIC

Number of I/O: 8
Interface: I2C
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 100µA, 25mA
Clock Frequency: 1MHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SO

パッケージ: 16-SOIC (0.295", 7.50mm Width)

在庫5,664

MPC8313ECVRADDB

NXP

IC MPU MPC83XX 267MHZ 516BGA

Core Processor: PowerPC e300c3
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 267MHz
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography
Package / Case: 516-BBGA Exposed Pad
Supplier Device Package: 516-TEPBGA (27x27)

パッケージ: 516-BBGA Exposed Pad

在庫4,976

XPC823ECVR66B2

NXP

IC MPU MPC8XX 66MHZ 256BGA

Core Processor: PowerPC
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Video
Ethernet: 10 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 95°C (TA)
Security Features: -
Package / Case: 256-BBGA
Supplier Device Package: 256-PBGA (23x23)

パッケージ: 256-BBGA

在庫3,680

KXPC8240LVV200E

NXP

IC MPU MPC82XX 200MHZ 352TBGA

Core Processor: PowerPC 603e
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 200MHz
Co-Processors/DSP: -
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 352-LBGA
Supplier Device Package: 352-TBGA (35x35)

パッケージ: 352-LBGA

在庫7,600

MCF51JM32EVLK

NXP

IC MCU 32BIT 32KB FLASH 80LQFP

Core Processor: Coldfire V1
Core Size: 32-Bit
Speed: 50MHz
Connectivity: CAN, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Number of I/O: 66
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (14x14)

パッケージ: 80-LQFP

在庫4,832

SPC5602DF1MLH4R

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 45
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 16
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫4,320

MC9S08LH64CLK

NXP

IC MCU 8BIT 64KB FLASH 80LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SPI, UART/USART
Peripherals: LCD, LVD, PWM, WDT
Number of I/O: 39
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x16b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (14x14)

パッケージ: 80-LQFP

在庫4,064

LPC2194HBD64/01,15

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

Core Processor: ARM7?
Core Size: 16/32-Bit
Speed: 60MHz
Connectivity: CAN, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 46
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V
Data Converters: A/D 4x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫6,420

PCK2002PD,112

NXP

IC CLK BUFFER 1:4 533MHZ 8SO

Type: Fanout Buffer (Distribution)
Number of Circuits: 1
Ratio - Input:Output: 1:4
Differential - Input:Output: No/No
Input: LVTTL
Output: LVTTL
Frequency - Max: 533MHz
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

パッケージ: 8-SOIC (0.154", 3.90mm Width)

在庫2,192

MCIMX6Y7DVM09AB

NXP

I.MX6ULL ROM PERF ENHAN

Core Processor: ARM® Cortex®-A7
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 900MHz
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Ethernet: 10/100 Mbps (2)
SATA: -
USB: USB 2.0 OTG + PHY (2)
Voltage - I/O: 1.8V, 2.8V, 3.3V
Operating Temperature: 0°C ~ 95°C (TJ)
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Package / Case: 289-LFBGA
Supplier Device Package: 289-MAPBGA (14x14)

パッケージ: 289-LFBGA

在庫5,392

SPC5646CCK0VLU1

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 147
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 27x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

パッケージ: 176-LQFP

在庫2,048

FS32R274VCK2MMM

NXP

NXP 32 BIT MCU 2M FLASH 1.5MB

Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit Tri-Core
Speed: 180MHz, 240MHz
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire
Peripherals: POR, PWM, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 1.5M x 8
Voltage - Supply (Vcc/Vdd): 1.19 V ~ 5.5 V
Data Converters: A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 257-LFBGA
Supplier Device Package: 257-MAPBGA (14x14)

パッケージ: 257-LFBGA

在庫2,448

S912XD128F2VAA

NXP

16-BIT MCU S12X CORE 128KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 80MHz
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 59
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b, 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

パッケージ: 80-QFP

在庫5,328

MC9S08AW48CFGER

NXP

S08AW 8-BIT MCU S08 CORE 48KB

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 44-LQFP
Supplier Device Package: 44-LQFP (10x10)

パッケージ: 44-LQFP

在庫6,656

S9S08RN60W1VLH

NXP

8-BIT MCU S08 CORE 60KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 55
Program Memory Size: 60KB (60K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫6,112

S9S12GA64J0MLF

NXP

IC MCU 16BIT 64KB FLASH 48LQFP

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: -

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UBA2080P-1-112

NXP

IC DRIVER HALF BRIDGE 8DIP

Type: -
Frequency: -
Voltage - Supply: -
Current - Supply: -
Current - Output Source/Sink: -
Dimming: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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