ページ 551 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
BC337-40,116	NXP	TRANS NPN 45V 0.5A TO-92 Transistor Type: NPN Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 45V Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 250 @ 100mA, 1V Power - Max: 625mW Frequency - Transition: 100MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	パッケージ: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	在庫3,552
BB179,115	NXP	DIODE UHF VAR CAP 30V SOD523 Capacitance @ Vr, F: 2.225pF @ 28V, 1MHz Capacitance Ratio: 10.9 Capacitance Ratio Condition: C1/C28 Voltage - Peak Reverse (Max): 30V Diode Type: Single Q @ Vr, F: - Operating Temperature: -55°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: SC-79, SOD-523 Supplier Device Package: SOD-523	パッケージ: SC-79, SOD-523	在庫6,160
LD6938CX6/1215PLJ	NXP	IC REG LINEAR 1.2V/1.5V 6WLCSP Output Configuration: Positive Output Type: Fixed Number of Regulators: 2 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 1.2V, 1.5V Voltage - Output (Max): - Voltage Dropout (Max): 0.4V @ 300mA, 0.4V @ 300mA Current - Output: 300mA, 300mA Current - Quiescent (Iq): - Current - Supply (Max): 75µA PSRR: 80dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature, Soft Start Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 6-XFBGA, WLCSP Supplier Device Package: 6-WLCSP (1.2x0.80)	パッケージ: 6-XFBGA, WLCSP	在庫4,736
SSL2102T/N1,518	NXP	IC LED DRIVER OFFL DIM 2A 20SO Type: AC DC Offline Switcher Topology: Flyback, Step-Down (Buck) Internal Switch(s): Yes Number of Outputs: 1 Voltage - Supply (Min): 8.5V Voltage - Supply (Max): 40V Voltage - Output: - Current - Output / Channel: 2A (Switch) Frequency: 100kHz Dimming: Triac Applications: - Operating Temperature: -40°C ~ 100°C (TA) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	パッケージ: 20-SOIC (0.295", 7.50mm Width)	在庫3,872
74LVC109D,112	NXP	IC JK TYPE POS TRG DUAL 16SOIC Function: Set(Preset) and Reset Type: JK Type Output Type: Differential Number of Elements: 2 Number of Bits per Element: 1 Clock Frequency: 330MHz Max Propagation Delay @ V, Max CL: 6.8ns @ 3.3V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 24mA, 24mA Voltage - Supply: 1.65 V ~ 3.6 V Current - Quiescent (Iq): 10µA Input Capacitance: 5pF Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width)	パッケージ: 16-SOIC (0.154", 3.90mm Width)	在庫4,848
74LVTH322245EC,557	NXP	IC BUS TRSCVR 3-ST 32BIT 96LFBGA Logic Type: Transceiver, Non-Inverting Number of Elements: 4 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 12mA, 12mA Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 96-LFBGA Supplier Device Package: 96-LFBGA (13.5x5.5)	パッケージ: 96-LFBGA	在庫6,528
74LV241PW,112	NXP	IC BUFF/DVR TRI-ST DUAL 20TSSOP Logic Type: Buffer, Non-Inverting Number of Elements: 2 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 8mA, 8mA Voltage - Supply: 1 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	パッケージ: 20-TSSOP (0.173", 4.40mm Width)	在庫4,928
BGD885,112	NXP	IC AMP GAIN PWR 860MHZ SFM9 Applications: CATV Output Type: - Number of Circuits: 1 -3db Bandwidth: - Slew Rate: - Current - Supply: 450mA Current - Output / Channel: - Voltage - Supply, Single/Dual (±): - Mounting Type: Chassis Mount Package / Case: SOT-115D Supplier Device Package: SFM9	パッケージ: SOT-115D	在庫5,312
PCAL6408AEXX	NXP	IC I/O EXPANDER 8BIT 16XFBGA Number of I/O: 8 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Open Drain, Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 1.65 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-XFBGA Supplier Device Package: 16-XFBGA (1.6x1.6)	パッケージ: 16-XFBGA	在庫6,512
MCIMX508CZK8B	NXP	IC MPU I.MX50 800MHZ 416POBGA Core Processor: ARM? Cortex?-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: EPDC, LCD Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Secure JTAG Package / Case: 416-VFBGA Supplier Device Package: -	パッケージ: 416-VFBGA	在庫12,576
P1012NXN2FFB	NXP	IC MPU Q OR IQ 800MHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	パッケージ: 689-BBGA Exposed Pad	在庫6,240
MPC8536ECVTAQGA	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 (3) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫4,576
MK51DX256CML7	NXP	IC MCU 32BIT 256KB FLASH 104BGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 72MHz Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 61 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 25x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 104-LFBGA Supplier Device Package: 104-MAPBGA (10x10)	パッケージ: 104-LFBGA	在庫5,904
MC9S08QG84CFFER	NXP	IC MCU 8BIT 8KB FLASH 16QFN Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-VQFN Exposed Pad Supplier Device Package: 16-QFN-EP (5x5)	パッケージ: 16-VQFN Exposed Pad	在庫7,552
MCF52110CEP66	NXP	IC MCU 32BIT 128KB FLASH 64QFN Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 66MHz Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 43 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-VFQFN Exposed Pad Supplier Device Package: 64-QFN Exposed Pad (9x9)	パッケージ: 64-VFQFN Exposed Pad	在庫6,304
MC9S12GC128VPBE	NXP	IC MCU 16BIT 128KB FLASH 52LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 35 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 52-LQFP Supplier Device Package: 52-LQFP (10x10)	パッケージ: 52-LQFP	在庫7,840
SPC5643LFF2MLQ1R	NXP	IC MCU 32BIT 1MB FLASH 144LQFP Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 120MHz Connectivity: CAN, FlexRay, LIN, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 32x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫7,024
MCF51JM64EVLK	NXP	IC MCU 32BIT 64KB FLASH 80LQFP Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: CAN, I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Number of I/O: 66 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (14x14)	パッケージ: 80-LQFP	在庫5,152
MCF51AC256BVPUE	NXP	IC MCU 32BIT 256KB FLASH 64LQFP Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 54 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 20x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫3,440
S9S08AW16AE0MFT	NXP	IC MCU 8BIT 16KB FLASH 48QFN Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 38 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	パッケージ: 48-VFQFN Exposed Pad	在庫4,640
NCF2972XTT/T0E080J	NXP	IC REMOTE KEYLESS ENTRY 38TSSOP Type: - Frequency: - Standards: - Interface: - Voltage - Supply: - Operating Temperature: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫7,596
OM5569/NT322ERM	NXP	NTAG 12C PLUS EXPL KIT PLUS USB Type: Near Field Communication Frequency: 13.56MHz For Use With/Related Products: NT3H1101 Supplied Contents: Board	パッケージ: -	在庫7,524
QN9080CHNY	NXP	BTLE SOC Type: TxRx + MCU RF Family/Standard: Bluetooth Protocol: Bluetooth v5.0 Modulation: - Frequency: 2.4GHz Data Rate (Max): - Power - Output: 2dBm Sensitivity: -95dBm Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM Serial Interfaces: I2C, SPI, UART, USART, USB GPIO: 35 Voltage - Supply: 1.62 V ~ 3.6 V Current - Receiving: 3.5mA Current - Transmitting: 3.5mA Operating Temperature: -40°C ~ 85°C Package / Case: 48-VFQFN Exposed Pad	パッケージ: 48-VFQFN Exposed Pad	在庫5,166
SPC5604PF1VLQ6	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Number of I/O: 108 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 40K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 30x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫2,224
MKL36Z128VLL4R	NXP	KINETIS L 32-BIT MCU ARM CORTEX Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, LVD, POR, PWM, WDT Number of I/O: 84 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D - 16bit, D/A - 12bit Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: 100-LQFP	在庫4,640
UJA1168ATK-F-0Z	NXP	IC TRANSCEIVER 1/1 14HVSON Type: Transceiver Protocol: CANbus Number of Drivers/Receivers: 1/1 Duplex: - Receiver Hysteresis: 800 mV Data Rate: 5Mbps Voltage - Supply: 3V ~ 28V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 14-VDFN Exposed Pad Supplier Device Package: 14-HVSON (3x4.5)	パッケージ: -	在庫18,000
LPC54606J512BD208K	NXP	IC MCU 32BIT 512KB FLASH 208LQFP Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Speed: 180MHz Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 171 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 200K x 8 Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 208-LQFP Supplier Device Package: 208-LQFP (28x28)	パッケージ: -	Request a Quote
FB32K144UIT0VLHT	NXP	IC MCU 32BIT 512KB FLASH 64LQFP Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote

BC337-40,116

NXP

TRANS NPN 45V 0.5A TO-92

Transistor Type: NPN
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 45V
Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 250 @ 100mA, 1V
Power - Max: 625mW
Frequency - Transition: 100MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Supplier Device Package: TO-92-3

パッケージ: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

在庫3,552

BB179,115

NXP

DIODE UHF VAR CAP 30V SOD523

Capacitance @ Vr, F: 2.225pF @ 28V, 1MHz
Capacitance Ratio: 10.9
Capacitance Ratio Condition: C1/C28
Voltage - Peak Reverse (Max): 30V
Diode Type: Single
Q @ Vr, F: -
Operating Temperature: -55°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-79, SOD-523
Supplier Device Package: SOD-523

パッケージ: SC-79, SOD-523

在庫6,160

LD6938CX6/1215PLJ

NXP

IC REG LINEAR 1.2V/1.5V 6WLCSP

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 2
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 1.2V, 1.5V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.4V @ 300mA, 0.4V @ 300mA
Current - Output: 300mA, 300mA
Current - Quiescent (Iq): -
Current - Supply (Max): 75µA
PSRR: 80dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature, Soft Start
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 6-XFBGA, WLCSP
Supplier Device Package: 6-WLCSP (1.2x0.80)

パッケージ: 6-XFBGA, WLCSP

在庫4,736

SSL2102T/N1,518

NXP

IC LED DRIVER OFFL DIM 2A 20SO

Type: AC DC Offline Switcher
Topology: Flyback, Step-Down (Buck)
Internal Switch(s): Yes
Number of Outputs: 1
Voltage - Supply (Min): 8.5V
Voltage - Supply (Max): 40V
Voltage - Output: -
Current - Output / Channel: 2A (Switch)
Frequency: 100kHz
Dimming: Triac
Applications: -
Operating Temperature: -40°C ~ 100°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO

パッケージ: 20-SOIC (0.295", 7.50mm Width)

在庫3,872

74LVC109D,112

NXP

IC JK TYPE POS TRG DUAL 16SOIC

Function: Set(Preset) and Reset
Type: JK Type
Output Type: Differential
Number of Elements: 2
Number of Bits per Element: 1
Clock Frequency: 330MHz
Max Propagation Delay @ V, Max CL: 6.8ns @ 3.3V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.65 V ~ 3.6 V
Current - Quiescent (Iq): 10µA
Input Capacitance: 5pF
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)

パッケージ: 16-SOIC (0.154", 3.90mm Width)

在庫4,848

74LVTH322245EC,557

NXP

IC BUS TRSCVR 3-ST 32BIT 96LFBGA

Logic Type: Transceiver, Non-Inverting
Number of Elements: 4
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 96-LFBGA
Supplier Device Package: 96-LFBGA (13.5x5.5)

パッケージ: 96-LFBGA

在庫6,528

74LV241PW,112

NXP

IC BUFF/DVR TRI-ST DUAL 20TSSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 8mA, 8mA
Voltage - Supply: 1 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

パッケージ: 20-TSSOP (0.173", 4.40mm Width)

在庫4,928

BGD885,112

NXP

IC AMP GAIN PWR 860MHZ SFM9

Applications: CATV
Output Type: -
Number of Circuits: 1
-3db Bandwidth: -
Slew Rate: -
Current - Supply: 450mA
Current - Output / Channel: -
Voltage - Supply, Single/Dual (±): -
Mounting Type: Chassis Mount
Package / Case: SOT-115D
Supplier Device Package: SFM9

パッケージ: SOT-115D

在庫5,312

PCAL6408AEXX

NXP

IC I/O EXPANDER 8BIT 16XFBGA

Number of I/O: 8
Interface: I2C, SMBus
Interrupt Output: Yes
Features: POR
Output Type: Open Drain, Push-Pull
Current - Output Source/Sink: 10mA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 1.65 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-XFBGA
Supplier Device Package: 16-XFBGA (1.6x1.6)

パッケージ: 16-XFBGA

在庫6,512

MCIMX508CZK8B

NXP

IC MPU I.MX50 800MHZ 416POBGA

Core Processor: ARM? Cortex?-A8
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR, LPDDR2, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, LCD
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: Boot Security, Cryptography, Secure JTAG
Package / Case: 416-VFBGA
Supplier Device Package: -

パッケージ: 416-VFBGA

在庫12,576

P1012NXN2FFB

NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

パッケージ: 689-BBGA Exposed Pad

在庫6,240

MPC8536ECVTAQGA

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 (3)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫4,576

MK51DX256CML7

NXP

IC MCU 32BIT 256KB FLASH 104BGA

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 72MHz
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 61
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 25x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 104-LFBGA
Supplier Device Package: 104-MAPBGA (10x10)

パッケージ: 104-LFBGA

在庫5,904

MC9S08QG84CFFER

NXP

IC MCU 8BIT 8KB FLASH 16QFN

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 12
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-VQFN Exposed Pad
Supplier Device Package: 16-QFN-EP (5x5)

パッケージ: 16-VQFN Exposed Pad

在庫7,552

MCF52110CEP66

NXP

IC MCU 32BIT 128KB FLASH 64QFN

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 66MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 43
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-VFQFN Exposed Pad
Supplier Device Package: 64-QFN Exposed Pad (9x9)

パッケージ: 64-VFQFN Exposed Pad

在庫6,304

MC9S12GC128VPBE

NXP

IC MCU 16BIT 128KB FLASH 52LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 35
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 52-LQFP
Supplier Device Package: 52-LQFP (10x10)

パッケージ: 52-LQFP

在庫7,840

SPC5643LFF2MLQ1R

NXP

IC MCU 32BIT 1MB FLASH 144LQFP

Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Speed: 120MHz
Connectivity: CAN, FlexRay, LIN, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 32x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫7,024

MCF51JM64EVLK

NXP

IC MCU 32BIT 64KB FLASH 80LQFP

Core Processor: Coldfire V1
Core Size: 32-Bit
Speed: 50MHz
Connectivity: CAN, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Number of I/O: 66
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (14x14)

パッケージ: 80-LQFP

在庫5,152

MCF51AC256BVPUE

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

Core Processor: Coldfire V1
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Number of I/O: 54
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 20x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫3,440

S9S08AW16AE0MFT

NXP

IC MCU 8BIT 16KB FLASH 48QFN

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 38
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN-EP (7x7)

パッケージ: 48-VFQFN Exposed Pad

在庫4,640

NCF2972XTT/T0E080J

NXP

IC REMOTE KEYLESS ENTRY 38TSSOP

Type: -
Frequency: -
Standards: -
Interface: -
Voltage - Supply: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫7,596

OM5569/NT322ERM

NXP

NTAG 12C PLUS EXPL KIT PLUS USB

Type: Near Field Communication
Frequency: 13.56MHz
For Use With/Related Products: NT3H1101
Supplied Contents: Board

パッケージ: -

在庫7,524

QN9080CHNY

NXP

BTLE SOC

Type: TxRx + MCU
RF Family/Standard: Bluetooth
Protocol: Bluetooth v5.0
Modulation: -
Frequency: 2.4GHz
Data Rate (Max): -
Power - Output: 2dBm
Sensitivity: -95dBm
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Serial Interfaces: I2C, SPI, UART, USART, USB
GPIO: 35
Voltage - Supply: 1.62 V ~ 3.6 V
Current - Receiving: 3.5mA
Current - Transmitting: 3.5mA
Operating Temperature: -40°C ~ 85°C
Package / Case: 48-VFQFN Exposed Pad

パッケージ: 48-VFQFN Exposed Pad

在庫5,166

SPC5604PF1VLQ6

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 108
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 40K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 30x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫2,224

MKL36Z128VLL4R

NXP

KINETIS L 32-BIT MCU ARM CORTEX

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, LVD, POR, PWM, WDT
Number of I/O: 84
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D - 16bit, D/A - 12bit
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

在庫4,640

UJA1168ATK-F-0Z

NXP

IC TRANSCEIVER 1/1 14HVSON

Type: Transceiver
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Duplex: -
Receiver Hysteresis: 800 mV
Data Rate: 5Mbps
Voltage - Supply: 3V ~ 28V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 14-VDFN Exposed Pad
Supplier Device Package: 14-HVSON (3x4.5)

パッケージ: -

在庫18,000

LPC54606J512BD208K

NXP

IC MCU 32BIT 512KB FLASH 208LQFP

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit Single-Core
Speed: 180MHz
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O: 171
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 16K x 8
RAM Size: 200K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Data Converters: A/D 12x12b SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Supplier Device Package: 208-LQFP (28x28)

パッケージ: -

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FB32K144UIT0VLHT

NXP

IC MCU 32BIT 512KB FLASH 64LQFP

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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