ページ 578 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
PHD108NQ03LT,118	NXP	MOSFET N-CH 25V 75A DPAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 25V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs(th) (Max) @ Id: 2V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 16.3nC @ 4.5V Input Capacitance (Ciss) (Max) @ Vds: 1375pF @ 12V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 187W (Tc) Rds On (Max) @ Id, Vgs: 6 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: DPAK Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63	パッケージ: TO-252-3, DPak (2 Leads + Tab), SC-63	在庫6,624
BLC8G24LS-240AVJ	NXP	TRANS RF 240W 65V LDMOS SOT1252 Transistor Type: LDMOS (Dual) Frequency: 2.3GHz ~ 2.4GHz Gain: 15dB Voltage - Test: 30V Current Rating: - Noise Figure: - Current - Test: 800mA Power - Output: 63W Voltage - Rated: 65V Package / Case: SOT-1252-1 Supplier Device Package: SOT1252-1	パッケージ: SOT-1252-1	在庫4,096
MRF8P8300HSR5	NXP	FET RF 2CH 70V 820MHZ NI1230S Transistor Type: LDMOS (Dual) Frequency: 820MHz Gain: 20.9dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 2A Power - Output: 96W Voltage - Rated: 70V Package / Case: NI-1230S Supplier Device Package: NI-1230S	パッケージ: NI-1230S	在庫2,192
AFT23S160W02SR3	NXP	FET RF 65V 2.4GHZ NI780S-2 Transistor Type: LDMOS Frequency: 2.4GHz Gain: 17.9dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.1A Power - Output: 45W Voltage - Rated: 65V Package / Case: NI-780S Supplier Device Package: NI-780S	パッケージ: NI-780S	在庫7,792
BZX284-C3V0,115	NXP	DIODE ZENER 3V 400MW SOD2 Voltage - Zener (Nom) (Vz): 3V Tolerance: ±5% Power - Max: 400mW Impedance (Max) (Zzt): 95 Ohms Current - Reverse Leakage @ Vr: 10µA @ 1V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SOD-110 Supplier Device Package: SOD110	パッケージ: SOD-110	在庫7,744
BB145,115	NXP	DIODE VAR CAP 6V SOD-523 Capacitance @ Vr, F: 3.25pF @ 4V, 1MHz Capacitance Ratio: 2 Capacitance Ratio Condition: C1/C4 Voltage - Peak Reverse (Max): 6V Diode Type: Single Q @ Vr, F: - Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-79, SOD-523 Supplier Device Package: SOD-523	パッケージ: SC-79, SOD-523	在庫2,704
MC33887PNBR2	NXP	IC MOTOR DRIVER PAR 36PQFN Motor Type - Stepper: - Motor Type - AC, DC: Brushed DC Function: Driver - Fully Integrated, Control and Power Stage Output Configuration: Half Bridge (2) Interface: Parallel Technology: Power MOSFET Step Resolution: - Applications: General Purpose Current - Output: 5A Voltage - Supply: 5 V ~ 28 V Voltage - Load: 5 V ~ 28 V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 36-PowerQFN Supplier Device Package: 36-PWR QFN (9x9)	パッケージ: 36-PowerQFN	在庫52,272
SL2S2001AC3,118	NXP	IC I-CODE SLI FCS2 Applications: - Interface: - Voltage - Supply: - Package / Case: - Supplier Device Package: - Mounting Type: -	パッケージ: -	在庫5,616
MPC8544VTAQGA	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫6,544
KMPC8272CVRTIEA	NXP	IC MPU MPC82XX 400MHZ 516BGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	パッケージ: 516-BBGA	在庫2,288
MPC862TVR66B	NXP	IC MPU MPC8XX 66MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	パッケージ: 357-BBGA	在庫3,296
MPC855TZQ66D4	NXP	IC MPU MPC8XX 66MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	パッケージ: 357-BBGA	在庫47,088
LPC2292FBD144,551	NXP	IC MCU 32BIT 256KB FLASH 144LQFP Core Processor: ARM7? Core Size: 16/32-Bit Speed: 60MHz Connectivity: CAN, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 112 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫7,104
MCF5235CVM150	NXP	IC MCU 32BIT ROMLESS 256MAPBGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 150MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, WDT Number of I/O: 97 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	パッケージ: 256-LBGA	在庫4,960
XC56309VF100A	NXP	IC DSP 24BIT FIXED-POINT 196-BGA Type: Fixed Point Interface: Host Interface, SSI, SCI Clock Rate: 100MHz Non-Volatile Memory: ROM (576 B) On-Chip RAM: 24kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15)	パッケージ: 196-LBGA	在庫7,008
OM5591/MF0U10,699	NXP	MIFARE ULTRALIGHT 5 TAGS MF1S50 Type: NFC Type 2 Frequency: - For Use With/Related Products: - Supplied Contents: 5 Tags	パッケージ: -	在庫6,750
MPXY8510DK016T1	NXP	IC PRESSURE SENSOR 32QFN Frequency: 315MHz, 434MHz Applications: TPM (Tire Pressure Monitor) Modulation or Protocol: FSK, OOK Data Rate (Max): - Power - Output: - Current - Transmitting: - Data Interface: PCB, Surface Mount Antenna Connector: PCB, Surface Mount Memory Size: 8kB Flash, 512B SRAM Features: - Voltage - Supply: 2.3 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C Package / Case: 32-QFN Exposed Pad	パッケージ: 32-QFN Exposed Pad	在庫51,252
MW4IC2020NBR1	NXP	IC PWR AMP RF 26V 20W TO-272-16 Frequency: 1.6GHz ~ 2.4GHz P1dB: - Gain: 29dB Noise Figure: - RF Type: Cellular, GSM, EDGE, CDMA Voltage - Supply: 26V Current - Supply: 80mA Test Frequency: - Package / Case: TO-272-16 Variant, Flat Leads Supplier Device Package: TO-272 WB-16	パッケージ: TO-272-16 Variant, Flat Leads	在庫2,844
MML09212HT1	NXP	IC LNA AMP E-PHEMT 12QFN Frequency: 400MHz ~ 1.4GHz P1dB: 22.8dBm Gain: 37.5dB Noise Figure: 0.52dB RF Type: GSM, LTE, W-CDMA Voltage - Supply: 5V Current - Supply: 150mA Test Frequency: 900MHz Package / Case: 12-VFQFN Exposed Pad Supplier Device Package: 12-QFN (3x3)	パッケージ: 12-VFQFN Exposed Pad	在庫4,896
MC33FS6500LAE	NXP	SYSTEM BASIS CHIP DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP Exposed Pad	在庫7,860
MC33MR2001TVKR2	NXP	IC TX 77GHZ RADAR AUTO 89VFBGA Type: - Protocol: - Number of Drivers/Receivers: - Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫3,232
SPC5633MF2MLQ80	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z3 Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Number of I/O: 80 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V Data Converters: A/D 32x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫6,096
S912XEG128BVAAR	NXP	16-BIT MCU S12X CORE 128KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	パッケージ: 80-QFP	在庫2,336
TJA1051T-3-2Z	NXP	IC TRANSCEIVER 1/1 8SO Type: Transceiver Protocol: CANbus Number of Drivers/Receivers: 1/1 Duplex: - Receiver Hysteresis: 120 mV Data Rate: 5Mbps Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	パッケージ: -	Request a Quote
FS32K144UAT0VMHR	NXP	IC MCU 32B 512KB FLASH 100MAPBGA Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 112MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 89 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LFBGA Supplier Device Package: 100-MAPBGA (11x11)	パッケージ: -	Request a Quote
SPC5775KK2MMY3AR	NXP	IC MCU 4MB FLASH 356MAPBGA Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
SAF4000EL-103Q234Y	NXP	IC Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
FS32K118LFT0VLFR	NXP	IC MCU 32BIT 256KB FLASH 48LQFP Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Speed: 48MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Number of I/O: 43 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 25K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: -	Request a Quote

PHD108NQ03LT,118

NXP

MOSFET N-CH 25V 75A DPAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 25V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs(th) (Max) @ Id: 2V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 16.3nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds: 1375pF @ 12V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 187W (Tc)
Rds On (Max) @ Id, Vgs: 6 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: DPAK
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63

パッケージ: TO-252-3, DPak (2 Leads + Tab), SC-63

在庫6,624

BLC8G24LS-240AVJ

NXP

TRANS RF 240W 65V LDMOS SOT1252

Transistor Type: LDMOS (Dual)
Frequency: 2.3GHz ~ 2.4GHz
Gain: 15dB
Voltage - Test: 30V
Current Rating: -
Noise Figure: -
Current - Test: 800mA
Power - Output: 63W
Voltage - Rated: 65V
Package / Case: SOT-1252-1
Supplier Device Package: SOT1252-1

パッケージ: SOT-1252-1

在庫4,096

MRF8P8300HSR5

NXP

FET RF 2CH 70V 820MHZ NI1230S

Transistor Type: LDMOS (Dual)
Frequency: 820MHz
Gain: 20.9dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 2A
Power - Output: 96W
Voltage - Rated: 70V
Package / Case: NI-1230S
Supplier Device Package: NI-1230S

パッケージ: NI-1230S

在庫2,192

AFT23S160W02SR3

NXP

FET RF 65V 2.4GHZ NI780S-2

Transistor Type: LDMOS
Frequency: 2.4GHz
Gain: 17.9dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.1A
Power - Output: 45W
Voltage - Rated: 65V
Package / Case: NI-780S
Supplier Device Package: NI-780S

パッケージ: NI-780S

在庫7,792

BZX284-C3V0,115

NXP

DIODE ZENER 3V 400MW SOD2

Voltage - Zener (Nom) (Vz): 3V
Tolerance: ±5%
Power - Max: 400mW
Impedance (Max) (Zzt): 95 Ohms
Current - Reverse Leakage @ Vr: 10µA @ 1V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-110
Supplier Device Package: SOD110

パッケージ: SOD-110

在庫7,744

BB145,115

NXP

DIODE VAR CAP 6V SOD-523

Capacitance @ Vr, F: 3.25pF @ 4V, 1MHz
Capacitance Ratio: 2
Capacitance Ratio Condition: C1/C4
Voltage - Peak Reverse (Max): 6V
Diode Type: Single
Q @ Vr, F: -
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-79, SOD-523
Supplier Device Package: SOD-523

パッケージ: SC-79, SOD-523

在庫2,704

MC33887PNBR2

NXP

IC MOTOR DRIVER PAR 36PQFN

Motor Type - Stepper: -
Motor Type - AC, DC: Brushed DC
Function: Driver - Fully Integrated, Control and Power Stage
Output Configuration: Half Bridge (2)
Interface: Parallel
Technology: Power MOSFET
Step Resolution: -
Applications: General Purpose
Current - Output: 5A
Voltage - Supply: 5 V ~ 28 V
Voltage - Load: 5 V ~ 28 V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 36-PowerQFN
Supplier Device Package: 36-PWR QFN (9x9)

パッケージ: 36-PowerQFN

在庫52,272

SL2S2001AC3,118

NXP

IC I-CODE SLI FCS2

Applications: -
Interface: -
Voltage - Supply: -
Package / Case: -
Supplier Device Package: -
Mounting Type: -

パッケージ: -

在庫5,616

MPC8544VTAQGA

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫6,544

KMPC8272CVRTIEA

NXP

IC MPU MPC82XX 400MHZ 516BGA

Core Processor: PowerPC G2_LE
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 516-BBGA
Supplier Device Package: 516-FPBGA (27x27)

パッケージ: 516-BBGA

在庫2,288

MPC862TVR66B

NXP

IC MPU MPC8XX 66MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (4), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

パッケージ: 357-BBGA

在庫3,296

MPC855TZQ66D4

NXP

IC MPU MPC8XX 66MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

パッケージ: 357-BBGA

在庫47,088

LPC2292FBD144,551

NXP

IC MCU 32BIT 256KB FLASH 144LQFP

Core Processor: ARM7?
Core Size: 16/32-Bit
Speed: 60MHz
Connectivity: CAN, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 112
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫7,104

MCF5235CVM150

NXP

IC MCU 32BIT ROMLESS 256MAPBGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 150MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Number of I/O: 97
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

パッケージ: 256-LBGA

在庫4,960

XC56309VF100A

NXP

IC DSP 24BIT FIXED-POINT 196-BGA

Type: Fixed Point
Interface: Host Interface, SSI, SCI
Clock Rate: 100MHz
Non-Volatile Memory: ROM (576 B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-LBGA
Supplier Device Package: 196-MAPBGA (15x15)

パッケージ: 196-LBGA

在庫7,008

OM5591/MF0U10,699

NXP

MIFARE ULTRALIGHT 5 TAGS MF1S50

Type: NFC Type 2
Frequency: -
For Use With/Related Products: -
Supplied Contents: 5 Tags

パッケージ: -

在庫6,750

MPXY8510DK016T1

NXP

IC PRESSURE SENSOR 32QFN

Frequency: 315MHz, 434MHz
Applications: TPM (Tire Pressure Monitor)
Modulation or Protocol: FSK, OOK
Data Rate (Max): -
Power - Output: -
Current - Transmitting: -
Data Interface: PCB, Surface Mount
Antenna Connector: PCB, Surface Mount
Memory Size: 8kB Flash, 512B SRAM
Features: -
Voltage - Supply: 2.3 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C
Package / Case: 32-QFN Exposed Pad

パッケージ: 32-QFN Exposed Pad

在庫51,252

MW4IC2020NBR1

NXP

IC PWR AMP RF 26V 20W TO-272-16

Frequency: 1.6GHz ~ 2.4GHz
P1dB: -
Gain: 29dB
Noise Figure: -
RF Type: Cellular, GSM, EDGE, CDMA
Voltage - Supply: 26V
Current - Supply: 80mA
Test Frequency: -
Package / Case: TO-272-16 Variant, Flat Leads
Supplier Device Package: TO-272 WB-16

パッケージ: TO-272-16 Variant, Flat Leads

在庫2,844

MML09212HT1

NXP

IC LNA AMP E-PHEMT 12QFN

Frequency: 400MHz ~ 1.4GHz
P1dB: 22.8dBm
Gain: 37.5dB
Noise Figure: 0.52dB
RF Type: GSM, LTE, W-CDMA
Voltage - Supply: 5V
Current - Supply: 150mA
Test Frequency: 900MHz
Package / Case: 12-VFQFN Exposed Pad
Supplier Device Package: 12-QFN (3x3)

パッケージ: 12-VFQFN Exposed Pad

在庫4,896

MC33FS6500LAE

NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP Exposed Pad

在庫7,860

MC33MR2001TVKR2

NXP

IC TX 77GHZ RADAR AUTO 89VFBGA

Type: -
Protocol: -
Number of Drivers/Receivers: -
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫3,232

SPC5633MF2MLQ80

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z3
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 80
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
Data Converters: A/D 32x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫6,096

S912XEG128BVAAR

NXP

16-BIT MCU S12X CORE 128KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 59
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 8x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

パッケージ: 80-QFP

在庫2,336

TJA1051T-3-2Z

NXP

IC TRANSCEIVER 1/1 8SO

Type: Transceiver
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Duplex: -
Receiver Hysteresis: 120 mV
Data Rate: 5Mbps
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

パッケージ: -

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FS32K144UAT0VMHR

NXP

IC MCU 32B 512KB FLASH 100MAPBGA

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit Single-Core
Speed: 112MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 89
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 16x12b SAR; D/A1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Supplier Device Package: 100-MAPBGA (11x11)

パッケージ: -

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SPC5775KK2MMY3AR

NXP

IC MCU 4MB FLASH 356MAPBGA

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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SAF4000EL-103Q234Y

NXP

IC

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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FS32K118LFT0VLFR

NXP

IC MCU 32BIT 256KB FLASH 48LQFP

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Speed: 48MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Number of I/O: 43
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 25K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 16x12b SAR; D/A1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: -

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