ページ 61 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
MRF19030LR3	NXP	FET RF 65V 1.96GHZ NI-400 Transistor Type: LDMOS Frequency: 1.96GHz Gain: 13dB Voltage - Test: 26V Current Rating: - Noise Figure: - Current - Test: 300mA Power - Output: 30W Voltage - Rated: 65V Package / Case: NI-400 Supplier Device Package: NI-400	パッケージ: NI-400	在庫4,352
PCF8566T/1,118	NXP	IC LCD DVR UNVRSL LOW-MUX 40VSOP Display Type: LCD Configuration: 7 Segment + DP, 14 Segment (24 Segment) Interface: I2C Digits or Characters: 6 Characters, 12 Digits, 96 Elements Current - Supply: 30µA Voltage - Supply: 2.5 V ~ 6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 40-BSOP (0.295", 7.50mm Width) Supplier Device Package: 40-VSOP	パッケージ: 40-BSOP (0.295", 7.50mm Width)	在庫44,400
N74F399D,602	NXP	IC REGISTER QUAD 2PORT 16SOIC Type: Multiplexer Circuit: 4 x 2:1 Independent Circuits: 1 Current - Output High, Low: 1mA, 20mA Voltage Supply Source: Single Supply Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	パッケージ: 16-SOIC (0.154", 3.90mm Width)	在庫6,960
HEF4557BP,652	NXP	IC SHIFT REGISTER 1-64BIT 16DIP Logic Type: Shift Register Output Type: Complementary Number of Elements: 1 Number of Bits per Element: 64 Function: Universal Voltage - Supply: 4.5 V ~ 15.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	パッケージ: 16-DIP (0.300", 7.62mm)	在庫2,976
74LVC623ADB,118	NXP	IC TRANSCVR 8BIT N-INV 20SSOP Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 24mA, 24mA Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 20-SSOP (0.209", 5.30mm Width) Supplier Device Package: 20-SSOP	パッケージ: 20-SSOP (0.209", 5.30mm Width)	在庫5,616
TDA9886HN/V5,118	NXP	IC IF-PLL DEMOD I2C-BUS 32-HVQFN Type: Demodulator Applications: TV Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	パッケージ: 32-VFQFN Exposed Pad	在庫5,856
TDA9886TS/V5,112	NXP	IC IF-PLL DEMOD I2C-BUS 24-SSOP Type: Demodulator Applications: TV Mounting Type: Surface Mount Package / Case: 24-SSOP (0.209", 5.30mm Width) Supplier Device Package: 24-SSOP	パッケージ: 24-SSOP (0.209", 5.30mm Width)	在庫3,424
NCX2220GU,115	NXP	IC COMPARATOR LOW VOLT 8-HXSON Type: General Purpose Number of Elements: 2 Output Type: Rail-to-Rail Voltage - Supply, Single/Dual (±): 1.3 V ~ 5.5 V Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA Current - Output (Typ): - Current - Quiescent (Max): 5µA CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Propagation Delay (Max): 0.8µs Hysteresis: 20mV Operating Temperature: -40°C ~ 85°C Package / Case: 8-XFDFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 8-HXSON (1.35x1.7)	パッケージ: 8-XFDFN Exposed Pad	在庫33,066
NX3L2267GM-Q100X	NXP	IC SWITCH ANLG SPDT 10XQFN Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Number of Circuits: 2 On-State Resistance (Max): 750 mOhm Channel-to-Channel Matching (ΔRon): 90 mOhm Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V Voltage - Supply, Dual (V±): - Switch Time (Ton, Toff) (Max): 40ns, 20ns -3db Bandwidth: 60MHz Charge Injection: 37pC Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Crosstalk: -90dB @ 100kHz Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 10-XFQFN Supplier Device Package: 10-XQFN (1.55x2)	パッケージ: 10-XFQFN	在庫6,352
HEF4067BP,652	NXP	IC MUX/DEMUX 4X16 24DIP Switch Circuit: - Multiplexer/Demultiplexer Circuit: 16:1 Number of Circuits: 1 On-State Resistance (Max): 155 Ohm Channel-to-Channel Matching (ΔRon): 5 Ohm Voltage - Supply, Single (V+): 3 V ~ 15 V Voltage - Supply, Dual (V±): - Switch Time (Ton, Toff) (Max): - -3db Bandwidth: 70MHz Charge Injection: - Channel Capacitance (CS(off), CD(off)): 7.5pF Current - Leakage (IS(off)) (Max): 200nA Crosstalk: -50dB @ 1MHz Operating Temperature: -40°C ~ 85°C (TA) Package / Case: 24-DIP (0.600", 15.24mm) Supplier Device Package: 24-DIP	パッケージ: 24-DIP (0.600", 15.24mm)	在庫3,200
T2081NXE7PTB	NXP	IC SOC 64BIT 8X1.5GHZ 780FCBGA Core Processor: PowerPC e6500 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.8GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (8), 2.5 Gbps (4), 10 Gbps (4) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Volatile key Storage Package / Case: 780-FBGA, FCBGA Supplier Device Package: 780-FCPBGA (23x23)	パッケージ: 780-FBGA, FCBGA	在庫5,280
MPC8548EPXAQGB	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫5,360
KMPC862TVR100B	NXP	IC MPU MPC8XX 100MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 100MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	パッケージ: 357-BBGA	在庫4,016
KMPC8540CVT667JB	NXP	IC MPU MPC85XX 667MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: - RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 784-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 784-BBGA, FCBGA	在庫7,648
XPC850DEVR66BUR2	NXP	IC MPU MPC8XX 66MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	パッケージ: 256-BBGA	在庫7,184
MC8610TPX800GB	NXP	IC MPU MPC86XX 800MHZ 783FCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: DIU, LCD Ethernet: - SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫2,848
MC908EY8MFAER	NXP	IC MCU 8BIT 8KB FLASH 32LQFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: LIN, SCI, SPI Peripherals: POR, PWM Number of I/O: 24 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	パッケージ: 32-LQFP	在庫7,296
MCHC908MR8MFAE	NXP	IC MCU 8BIT 8KB FLASH 32LQFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI Peripherals: LVD, POR, PWM Number of I/O: 16 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 7x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	パッケージ: 32-LQFP	在庫3,168
PCF7961ETT/M1AE160	NXP	IC TRANSPONDER ENTRY 20TSSOP Frequency: 315MHz, 434MHz Applications: Remote Keyless Entry Modulation or Protocol: ASK, FSK Data Rate (Max): 20kbps Power - Output: - Current - Transmitting: - Data Interface: PCB, Surface Mount Antenna Connector: PCB, Surface Mount Memory Size: 16KB Features: Programmable Voltage - Supply: 2.1 V ~ 3.6 V Operating Temperature: - Package / Case: -	パッケージ: -	在庫7,002
MML20242HT1	NXP	IC LNA AMP E-PHEMT 12QFN Frequency: 1.4GHz ~ 2.8GHz P1dB: 24dBm Gain: 34dB Noise Figure: 0.57dB RF Type: LTE, TDS-CDMA, W-CDMA Voltage - Supply: 5V Current - Supply: 160mA Test Frequency: 1.95GHz Package / Case: 12-VFQFN Exposed Pad Supplier Device Package: 12-QFN (3x3)	パッケージ: 12-VFQFN Exposed Pad	在庫2,340
MCF54452VR266R	NXP	MCF5445X 32-BIT MPU COLDFIRE V4 Core Processor: Coldfire V4 Core Size: 32-Bit Speed: 266MHz Connectivity: I²C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 360-BBGA Supplier Device Package: 360-PBGA (23x23)	パッケージ: 360-BBGA	在庫11,652
SPC5605BF1VLU6R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 149 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 29x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	パッケージ: 176-LQFP	在庫8,004
S9S12HY32J0CLHR	NXP	16-BIT MCU S12 CORE 32KB FLASH Core Processor: HCS12 Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 50 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫5,776
S9S12G48BCLCR	NXP	S12 CORE,48K FLASH,AU Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	パッケージ: 32-LQFP	在庫3,904
LPC55S04JBD64E	NXP	IC MCU 32BIT 128KB FLASH 64HTQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 96MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 45 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 9x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-TQFP Exposed Pad Supplier Device Package: 64-HTQFP (10x10)	パッケージ: -	在庫480
LTA1302RTS-1H	NXP	IC Type: - Protocol: - Number of Drivers/Receivers: - Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
TDF19988AHN-C137Y	NXP	AUTOMOTIVE, 165MHZ HDMI 1.4B TRA Type: - Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
MC35FS4508NAE	NXP	SYSTEM BASIS CHIP, LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	パッケージ: -	Request a Quote

MRF19030LR3

NXP

FET RF 65V 1.96GHZ NI-400

Transistor Type: LDMOS
Frequency: 1.96GHz
Gain: 13dB
Voltage - Test: 26V
Current Rating: -
Noise Figure: -
Current - Test: 300mA
Power - Output: 30W
Voltage - Rated: 65V
Package / Case: NI-400
Supplier Device Package: NI-400

パッケージ: NI-400

在庫4,352

PCF8566T/1,118

NXP

IC LCD DVR UNVRSL LOW-MUX 40VSOP

Display Type: LCD
Configuration: 7 Segment + DP, 14 Segment (24 Segment)
Interface: I2C
Digits or Characters: 6 Characters, 12 Digits, 96 Elements
Current - Supply: 30µA
Voltage - Supply: 2.5 V ~ 6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 40-BSOP (0.295", 7.50mm Width)
Supplier Device Package: 40-VSOP

パッケージ: 40-BSOP (0.295", 7.50mm Width)

在庫44,400

N74F399D,602

NXP

IC REGISTER QUAD 2PORT 16SOIC

Type: Multiplexer
Circuit: 4 x 2:1
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

パッケージ: 16-SOIC (0.154", 3.90mm Width)

在庫6,960

HEF4557BP,652

NXP

IC SHIFT REGISTER 1-64BIT 16DIP

Logic Type: Shift Register
Output Type: Complementary
Number of Elements: 1
Number of Bits per Element: 64
Function: Universal
Voltage - Supply: 4.5 V ~ 15.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

パッケージ: 16-DIP (0.300", 7.62mm)

在庫2,976

74LVC623ADB,118

NXP

IC TRANSCVR 8BIT N-INV 20SSOP

Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.2 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 20-SSOP

パッケージ: 20-SSOP (0.209", 5.30mm Width)

在庫5,616

TDA9886HN/V5,118

NXP

IC IF-PLL DEMOD I2C-BUS 32-HVQFN

Type: Demodulator
Applications: TV
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

パッケージ: 32-VFQFN Exposed Pad

在庫5,856

TDA9886TS/V5,112

NXP

IC IF-PLL DEMOD I2C-BUS 24-SSOP

Type: Demodulator
Applications: TV
Mounting Type: Surface Mount
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 24-SSOP

パッケージ: 24-SSOP (0.209", 5.30mm Width)

在庫3,424

NCX2220GU,115

NXP

IC COMPARATOR LOW VOLT 8-HXSON

Type: General Purpose
Number of Elements: 2
Output Type: Rail-to-Rail
Voltage - Supply, Single/Dual (±): 1.3 V ~ 5.5 V
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): -
Current - Quiescent (Max): 5µA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Propagation Delay (Max): 0.8µs
Hysteresis: 20mV
Operating Temperature: -40°C ~ 85°C
Package / Case: 8-XFDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 8-HXSON (1.35x1.7)

パッケージ: 8-XFDFN Exposed Pad

在庫33,066

NX3L2267GM-Q100X

NXP

IC SWITCH ANLG SPDT 10XQFN

Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Number of Circuits: 2
On-State Resistance (Max): 750 mOhm
Channel-to-Channel Matching (ΔRon): 90 mOhm
Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
Voltage - Supply, Dual (V±): -
Switch Time (Ton, Toff) (Max): 40ns, 20ns
-3db Bandwidth: 60MHz
Charge Injection: 37pC
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Crosstalk: -90dB @ 100kHz
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 10-XFQFN
Supplier Device Package: 10-XQFN (1.55x2)

パッケージ: 10-XFQFN

在庫6,352

HEF4067BP,652

NXP

IC MUX/DEMUX 4X16 24DIP

Switch Circuit: -
Multiplexer/Demultiplexer Circuit: 16:1
Number of Circuits: 1
On-State Resistance (Max): 155 Ohm
Channel-to-Channel Matching (ΔRon): 5 Ohm
Voltage - Supply, Single (V+): 3 V ~ 15 V
Voltage - Supply, Dual (V±): -
Switch Time (Ton, Toff) (Max): -
-3db Bandwidth: 70MHz
Charge Injection: -
Channel Capacitance (CS(off), CD(off)): 7.5pF
Current - Leakage (IS(off)) (Max): 200nA
Crosstalk: -50dB @ 1MHz
Operating Temperature: -40°C ~ 85°C (TA)
Package / Case: 24-DIP (0.600", 15.24mm)
Supplier Device Package: 24-DIP

パッケージ: 24-DIP (0.600", 15.24mm)

在庫3,200

T2081NXE7PTB

NXP

IC SOC 64BIT 8X1.5GHZ 780FCBGA

Core Processor: PowerPC e6500
Number of Cores/Bus Width: 4 Core, 64-Bit
Speed: 1.8GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (8), 2.5 Gbps (4), 10 Gbps (4)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Volatile key Storage
Package / Case: 780-FBGA, FCBGA
Supplier Device Package: 780-FCPBGA (23x23)

パッケージ: 780-FBGA, FCBGA

在庫5,280

MPC8548EPXAQGB

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫5,360

KMPC862TVR100B

NXP

IC MPU MPC8XX 100MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 100MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (4), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

パッケージ: 357-BBGA

在庫4,016

KMPC8540CVT667JB

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: -
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 784-BBGA, FCBGA

在庫7,648

XPC850DEVR66BUR2

NXP

IC MPU MPC8XX 66MHZ 256BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 256-BBGA
Supplier Device Package: 256-PBGA (23x23)

パッケージ: 256-BBGA

在庫7,184

MC8610TPX800GB

NXP

IC MPU MPC86XX 800MHZ 783FCBGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: DIU, LCD
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫2,848

MC908EY8MFAER

NXP

IC MCU 8BIT 8KB FLASH 32LQFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: LIN, SCI, SPI
Peripherals: POR, PWM
Number of I/O: 24
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

パッケージ: 32-LQFP

在庫7,296

MCHC908MR8MFAE

NXP

IC MCU 8BIT 8KB FLASH 32LQFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI
Peripherals: LVD, POR, PWM
Number of I/O: 16
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 7x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

パッケージ: 32-LQFP

在庫3,168

PCF7961ETT/M1AE160

NXP

IC TRANSPONDER ENTRY 20TSSOP

Frequency: 315MHz, 434MHz
Applications: Remote Keyless Entry
Modulation or Protocol: ASK, FSK
Data Rate (Max): 20kbps
Power - Output: -
Current - Transmitting: -
Data Interface: PCB, Surface Mount
Antenna Connector: PCB, Surface Mount
Memory Size: 16KB
Features: Programmable
Voltage - Supply: 2.1 V ~ 3.6 V
Operating Temperature: -
Package / Case: -

パッケージ: -

在庫7,002

MML20242HT1

NXP

IC LNA AMP E-PHEMT 12QFN

Frequency: 1.4GHz ~ 2.8GHz
P1dB: 24dBm
Gain: 34dB
Noise Figure: 0.57dB
RF Type: LTE, TDS-CDMA, W-CDMA
Voltage - Supply: 5V
Current - Supply: 160mA
Test Frequency: 1.95GHz
Package / Case: 12-VFQFN Exposed Pad
Supplier Device Package: 12-QFN (3x3)

パッケージ: 12-VFQFN Exposed Pad

在庫2,340

MCF54452VR266R

NXP

MCF5445X 32-BIT MPU COLDFIRE V4

Core Processor: Coldfire V4
Core Size: 32-Bit
Speed: 266MHz
Connectivity: I²C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Number of I/O: 132
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.35 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 360-BBGA
Supplier Device Package: 360-PBGA (23x23)

パッケージ: 360-BBGA

在庫11,652

SPC5605BF1VLU6R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 149
Program Memory Size: 768KB (768K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 29x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

パッケージ: 176-LQFP

在庫8,004

S9S12HY32J0CLHR

NXP

16-BIT MCU S12 CORE 32KB FLASH

Core Processor: HCS12
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Number of I/O: 50
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 6x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫5,776

S9S12G48BCLCR

NXP

S12 CORE,48K FLASH,AU

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

パッケージ: 32-LQFP

在庫3,904

LPC55S04JBD64E

NXP

IC MCU 32BIT 128KB FLASH 64HTQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 96MHz
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 45
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 9x16b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Supplier Device Package: 64-HTQFP (10x10)

パッケージ: -

在庫480

LTA1302RTS-1H

NXP

IC

Type: -
Protocol: -
Number of Drivers/Receivers: -
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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TDF19988AHN-C137Y

NXP

AUTOMOTIVE, 165MHZ HDMI 1.4B TRA

Type: -
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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MC35FS4508NAE

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

パッケージ: -

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