ページ 659 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
PH3830L,115	NXP	MOSFET N-CH 30V 98A LFPAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 98A (Tc) Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs(th) (Max) @ Id: 2V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 33nC @ 5V Input Capacitance (Ciss) (Max) @ Vds: 3190pF @ 10V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 62.5W (Tc) Rds On (Max) @ Id, Vgs: 3.8 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Supplier Device Package: LFPAK56, Power-SO8 Package / Case: SC-100, SOT-669	パッケージ: SC-100, SOT-669	在庫6,784
MPSA42,116	NXP	TRANS NPN 300V 0.1A SOT54 Transistor Type: NPN Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 300V Vce Saturation (Max) @ Ib, Ic: 500mV @ 2mA, 20mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 10V Power - Max: 500mW Frequency - Transition: 50MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	パッケージ: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	在庫2,800
BUK1M200-50SGTD,51	NXP	MOSFET N-CH 50V 20SOIC Switch Type: General Purpose Number of Outputs: 4 Ratio - Input:Output: 1:1 Output Configuration: Low Side Output Type: N-Channel Interface: On/Off Voltage - Load: 50V (Max) Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 2.7A Rds On (Typ): 150 mOhm Input Type: Non-Inverting Features: - Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage Operating Temperature: 150°C (TJ) Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	パッケージ: 20-SOIC (0.295", 7.50mm Width)	在庫7,424
74HCT423BQ,115	NXP	IC DUAL RETRIG MULTVIB 16DHVQFN Logic Type: Monostable Independent Circuits: 2 Schmitt Trigger Input: No Propagation Delay: 22ns Current - Output High, Low: 4mA, 4mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-VFQFN Exposed Pad Supplier Device Package: 16-DHVQFN (2.5x3.5)	パッケージ: 16-VFQFN Exposed Pad	在庫2,608
74HCT20N,652	NXP	IC GATE NAND 2CH 4-INP 14-DIP Logic Type: NAND Gate Number of Circuits: 2 Number of Inputs: 4 Features: - Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Max): 2µA Current - Output High, Low: 4mA, 4mA Logic Level - Low: 0.8V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 28ns @ 4.5V, 50pF Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Supplier Device Package: 14-DIP Package / Case: 14-DIP (0.300", 7.62mm)	パッケージ: 14-DIP (0.300", 7.62mm)	在庫2,176
TJA1040T/VM,112	NXP	IC CAN TXRX HI-SPEED 8-SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 70mV Data Rate: - Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	パッケージ: 8-SOIC (0.154", 3.90mm Width)	在庫6,928
MPC8572ELPXAVND	NXP	IC MPU MPC85XX 1.5GHZ 1023FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.5GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 1023-BFBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33x33)	パッケージ: 1023-BFBGA, FCBGA	在庫5,936
KMPC8360EVVALFG	NXP	IC MPU MPC83XX 667MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	パッケージ: 740-LBGA	在庫7,456
MPC8272CZQMIBA	NXP	IC MPU MPC82XX 266MHZ 516BGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	パッケージ: 516-BBGA	在庫7,044
S912ZVMC12F1MKH	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	パッケージ: 64-LQFP Exposed Pad	在庫4,032
MC68HC908LB8VDWE	NXP	IC MCU 8BIT 8KB FLASH 20SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVR, POR, PWM Number of I/O: 18 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 7x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC	パッケージ: 20-SOIC (0.295", 7.50mm Width)	在庫5,856
MPC5554MZP132	NXP	IC MCU 32BIT 2MB FLASH 416BGA Core Processor: e200z6 Core Size: 32-Bit Speed: 132MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 256 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	パッケージ: 416-BBGA	在庫5,696
S912XEQ512J3MAG	NXP	IC MCU 16BIT 512KB FLASH 144LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫6,656
MC9S12GC64MFUE	NXP	IC MCU 16BIT 64KB FLASH 80QFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 60 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	パッケージ: 80-QFP	在庫4,832
MSC8144TVT800B	NXP	ENCRYPTION PACSUN R2.1 783FCBGA Type: SC3400 Core Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA Clock Rate: 800MHz Non-Volatile Memory: External On-Chip RAM: 10.5MB Voltage - I/O: 3.30V Voltage - Core: 1.00V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫2,096
ADC1015S125HN/C1:5	NXP	ADC 10BIT 125MSPS 40HVQFN Number of Bits: 10 Sampling Rate (Per Second): 125M Number of Inputs: 1 Input Type: Differential, Single Ended Data Interface: LVDS - Parallel, Parallel Configuration: S/H-ADC Ratio - S/H:ADC: 1:1 Number of A/D Converters: 1 Architecture: Pipelined Reference Type: External, Internal Voltage - Supply, Analog: 2.85 V ~ 3.4 V, 5V Voltage - Supply, Digital: 1.65 V ~ 3.6 V Features: - Operating Temperature: -40°C ~ 85°C Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6) Mounting Type: -	パッケージ: 40-VFQFN Exposed Pad	在庫7,600
MPL115A2T1	NXP	IC BAROMETER I2C DGTL MINI 8-LGA Pressure Type: Absolute Operating Pressure: 7.25 PSI ~ 16.68 PSI (50 kPa ~ 115 kPa) Output Type: I2C Output: 10 b Accuracy: ±0.145 PSI (±1 kPa) Voltage - Supply: 2.375 V ~ 5.5 V Port Size: - Port Style: No Port Features: Shutdown Mode, Standby Mode Termination Style: PCB Maximum Pressure: 145.04 PSI (1000 kPa) Operating Temperature: -40°C ~ 105°C Package / Case: 8-TLGA Supplier Device Package: 8-LGA	パッケージ: 8-TLGA	在庫101,676
MW7IC18100NR1	NXP	IC PWR AMP RF LDMOS TO270-14 Frequency: 1.805GHz ~ 2.05GHz P1dB: 51.93dBm (155.955W) Gain: 30dB Noise Figure: - RF Type: GSM, EDGE Voltage - Supply: 24 V ~ 32 V Current - Supply: 1.18A Test Frequency: 1.9GHz Package / Case: TO-270-14 Variant, Flat Leads Supplier Device Package: TO-270 WB-14	パッケージ: TO-270-14 Variant, Flat Leads	在庫5,454
MC33FS6511CAER2	NXP	SYSTEM BASIS CHIP DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP Exposed Pad	在庫5,552
S9KEAZN8AVFK	NXP	KINETIS E 32-BIT MCU ARM CORTEX Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 22 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-QFN (4x4)	パッケージ: 24-VFQFN Exposed Pad	在庫4,576
PNX9531E/V120,557	NXP	IC MEDIA PROCESSOR Applications: Multimedia Core Processor: TriMedia™ Program Memory Type: - Controller Series: Nexperia RAM Size: - Interface: GPIO, Host Interface, I²C, PCI, USB, XIO Number of I/O: 8 Voltage - Supply: 1.16V ~ 1.24V, 3.15V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 456-BGA Supplier Device Package: 456-PBGA (27x27)	パッケージ: 456-BGA	在庫5,904
LPC5516JEV59E	NXP	IC MCU 32BIT 256KB FLASH 59BGA Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 37 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 59-VFBGA Supplier Device Package: 59-VFBGA (4x4)	パッケージ: -	Request a Quote
MIMX8QP6CVUFFAB	NXP	MPU I.MX8 QUAD PLUS Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
MPF7100BVBA4ESR2	NXP	POWER MANAGEMENT IC, I.MX 8DX/8D Applications: i.MX Processors Current - Supply: 10µA Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	パッケージ: -	Request a Quote
MFS2300BMBA0EPR2	NXP	IC Applications: System Basis Chip Current - Supply: 40µA Voltage - Supply: 5.5V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	パッケージ: -	Request a Quote
SAF4000EL-103Q534K	NXP	IC Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
MIMX8MM5DVTLZCA	NXP	IC Architecture: MPU Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Flash Size: - RAM Size: 288KB Peripherals: DMA, PWM, WDT Connectivity: AC'97, I2C, I2S, MMC/SD, PCIe, SAI, SDHC, SPDIF, SPI, TDM, UART Speed: 1.8GHz, 400MHz Primary Attributes: - Operating Temperature: 0°C ~ 95°C (TJ) Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14x14)	パッケージ: -	Request a Quote
MC34PF8100EPEPR2	NXP	POWER MANAGEMENT IC I.MX8 PRE-PR Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	パッケージ: -	Request a Quote

PH3830L,115

NXP

MOSFET N-CH 30V 98A LFPAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 98A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs(th) (Max) @ Id: 2V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 33nC @ 5V
Input Capacitance (Ciss) (Max) @ Vds: 3190pF @ 10V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 62.5W (Tc)
Rds On (Max) @ Id, Vgs: 3.8 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: LFPAK56, Power-SO8
Package / Case: SC-100, SOT-669

パッケージ: SC-100, SOT-669

在庫6,784

MPSA42,116

NXP

TRANS NPN 300V 0.1A SOT54

Transistor Type: NPN
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 300V
Vce Saturation (Max) @ Ib, Ic: 500mV @ 2mA, 20mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 10V
Power - Max: 500mW
Frequency - Transition: 50MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Supplier Device Package: TO-92-3

パッケージ: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

在庫2,800

BUK1M200-50SGTD,51

NXP

MOSFET N-CH 50V 20SOIC

Switch Type: General Purpose
Number of Outputs: 4
Ratio - Input:Output: 1:1
Output Configuration: Low Side
Output Type: N-Channel
Interface: On/Off
Voltage - Load: 50V (Max)
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 2.7A
Rds On (Typ): 150 mOhm
Input Type: Non-Inverting
Features: -
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
Operating Temperature: 150°C (TJ)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO

パッケージ: 20-SOIC (0.295", 7.50mm Width)

在庫7,424

74HCT423BQ,115

NXP

IC DUAL RETRIG MULTVIB 16DHVQFN

Logic Type: Monostable
Independent Circuits: 2
Schmitt Trigger Input: No
Propagation Delay: 22ns
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-VFQFN Exposed Pad
Supplier Device Package: 16-DHVQFN (2.5x3.5)

パッケージ: 16-VFQFN Exposed Pad

在庫2,608

74HCT20N,652

NXP

IC GATE NAND 2CH 4-INP 14-DIP

Logic Type: NAND Gate
Number of Circuits: 2
Number of Inputs: 4
Features: -
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Max): 2µA
Current - Output High, Low: 4mA, 4mA
Logic Level - Low: 0.8V
Logic Level - High: 2V
Max Propagation Delay @ V, Max CL: 28ns @ 4.5V, 50pF
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Supplier Device Package: 14-DIP
Package / Case: 14-DIP (0.300", 7.62mm)

パッケージ: 14-DIP (0.300", 7.62mm)

在庫2,176

TJA1040T/VM,112

NXP

IC CAN TXRX HI-SPEED 8-SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 70mV
Data Rate: -
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

パッケージ: 8-SOIC (0.154", 3.90mm Width)

在庫6,928

MPC8572ELPXAVND

NXP

IC MPU MPC85XX 1.5GHZ 1023FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.5GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 1023-BFBGA, FCBGA
Supplier Device Package: 1023-FCPBGA (33x33)

パッケージ: 1023-BFBGA, FCBGA

在庫5,936

KMPC8360EVVALFG

NXP

IC MPU MPC83XX 667MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

パッケージ: 740-LBGA

在庫7,456

MPC8272CZQMIBA

NXP

IC MPU MPC82XX 266MHZ 516BGA

Core Processor: PowerPC G2_LE
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 516-BBGA
Supplier Device Package: 516-FPBGA (27x27)

パッケージ: 516-BBGA

在庫7,044

S912ZVMC12F1MKH

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP EP (10x10)

パッケージ: 64-LQFP Exposed Pad

在庫4,032

MC68HC908LB8VDWE

NXP

IC MCU 8BIT 8KB FLASH 20SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LVR, POR, PWM
Number of I/O: 18
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 7x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SOIC

パッケージ: 20-SOIC (0.295", 7.50mm Width)

在庫5,856

MPC5554MZP132

NXP

IC MCU 32BIT 2MB FLASH 416BGA

Core Processor: e200z6
Core Size: 32-Bit
Speed: 132MHz
Connectivity: CAN, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 256
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
Data Converters: A/D 40x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BBGA
Supplier Device Package: 416-PBGA (27x27)

パッケージ: 416-BBGA

在庫5,696

S912XEQ512J3MAG

NXP

IC MCU 16BIT 512KB FLASH 144LQFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 119
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 24x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫6,656

MC9S12GC64MFUE

NXP

IC MCU 16BIT 64KB FLASH 80QFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 60
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

パッケージ: 80-QFP

在庫4,832

MSC8144TVT800B

NXP

ENCRYPTION PACSUN R2.1 783FCBGA

Type: SC3400 Core
Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA
Clock Rate: 800MHz
Non-Volatile Memory: External
On-Chip RAM: 10.5MB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫2,096

ADC1015S125HN/C1:5

NXP

ADC 10BIT 125MSPS 40HVQFN

Number of Bits: 10
Sampling Rate (Per Second): 125M
Number of Inputs: 1
Input Type: Differential, Single Ended
Data Interface: LVDS - Parallel, Parallel
Configuration: S/H-ADC
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 1
Architecture: Pipelined
Reference Type: External, Internal
Voltage - Supply, Analog: 2.85 V ~ 3.4 V, 5V
Voltage - Supply, Digital: 1.65 V ~ 3.6 V
Features: -
Operating Temperature: -40°C ~ 85°C
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)
Mounting Type: -

パッケージ: 40-VFQFN Exposed Pad

在庫7,600

MPL115A2T1

NXP

IC BAROMETER I2C DGTL MINI 8-LGA

Pressure Type: Absolute
Operating Pressure: 7.25 PSI ~ 16.68 PSI (50 kPa ~ 115 kPa)
Output Type: I2C
Output: 10 b
Accuracy: ±0.145 PSI (±1 kPa)
Voltage - Supply: 2.375 V ~ 5.5 V
Port Size: -
Port Style: No Port
Features: Shutdown Mode, Standby Mode
Termination Style: PCB
Maximum Pressure: 145.04 PSI (1000 kPa)
Operating Temperature: -40°C ~ 105°C
Package / Case: 8-TLGA
Supplier Device Package: 8-LGA

パッケージ: 8-TLGA

在庫101,676

MW7IC18100NR1

NXP

IC PWR AMP RF LDMOS TO270-14

Frequency: 1.805GHz ~ 2.05GHz
P1dB: 51.93dBm (155.955W)
Gain: 30dB
Noise Figure: -
RF Type: GSM, EDGE
Voltage - Supply: 24 V ~ 32 V
Current - Supply: 1.18A
Test Frequency: 1.9GHz
Package / Case: TO-270-14 Variant, Flat Leads
Supplier Device Package: TO-270 WB-14

パッケージ: TO-270-14 Variant, Flat Leads

在庫5,454

MC33FS6511CAER2

NXP

SYSTEM BASIS CHIP DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP Exposed Pad

在庫5,552

S9KEAZN8AVFK

NXP

KINETIS E 32-BIT MCU ARM CORTEX

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 22
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-QFN (4x4)

パッケージ: 24-VFQFN Exposed Pad

在庫4,576

PNX9531E/V120,557

NXP

IC MEDIA PROCESSOR

Applications: Multimedia
Core Processor: TriMedia™
Program Memory Type: -
Controller Series: Nexperia
RAM Size: -
Interface: GPIO, Host Interface, I²C, PCI, USB, XIO
Number of I/O: 8
Voltage - Supply: 1.16V ~ 1.24V, 3.15V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 456-BGA
Supplier Device Package: 456-PBGA (27x27)

パッケージ: 456-BGA

在庫5,904

LPC5516JEV59E

NXP

IC MCU 32BIT 256KB FLASH 59BGA

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 37
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 59-VFBGA
Supplier Device Package: 59-VFBGA (4x4)

パッケージ: -

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MIMX8QP6CVUFFAB

NXP

MPU I.MX8 QUAD PLUS

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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MPF7100BVBA4ESR2

NXP

POWER MANAGEMENT IC, I.MX 8DX/8D

Applications: i.MX Processors
Current - Supply: 10µA
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

パッケージ: -

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MFS2300BMBA0EPR2

NXP

IC

Applications: System Basis Chip
Current - Supply: 40µA
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

パッケージ: -

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SAF4000EL-103Q534K

NXP

IC

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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MIMX8MM5DVTLZCA

NXP

IC

Architecture: MPU
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Flash Size: -
RAM Size: 288KB
Peripherals: DMA, PWM, WDT
Connectivity: AC'97, I2C, I2S, MMC/SD, PCIe, SAI, SDHC, SPDIF, SPI, TDM, UART
Speed: 1.8GHz, 400MHz
Primary Attributes: -
Operating Temperature: 0°C ~ 95°C (TJ)
Package / Case: 486-LFBGA, FCBGA
Supplier Device Package: 486-LFBGA (14x14)

パッケージ: -

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MC34PF8100EPEPR2

NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

パッケージ: -

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