ページ 689 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
MRF6S21060MR1	NXP	FET RF 68V 2.12GHZ TO270-4 Transistor Type: LDMOS Frequency: 2.12GHz Gain: 15.5dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 610mA Power - Output: 14W Voltage - Rated: 68V Package / Case: TO-270-4 Supplier Device Package: TO-270 WB-4	パッケージ: TO-270-4	在庫2,096
BC635-16,126	NXP	TRANS NPN 45V 1A TO-92 Transistor Type: NPN Current - Collector (Ic) (Max): 1A Voltage - Collector Emitter Breakdown (Max): 45V Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 2V Power - Max: 830mW Frequency - Transition: 180MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	パッケージ: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	在庫6,832
DC6M602X6/1518A,13	NXP	IC REG BUCK PROG 0.65A 6WLCSP Function: Step-Down Output Configuration: Positive Topology: Buck Output Type: Programmable Number of Outputs: 1 Voltage - Input (Min): 2.3V Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 1.5V, 1.8V Voltage - Output (Max): - Current - Output: 650mA Frequency - Switching: 6MHz Synchronous Rectifier: Yes Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 6-XFBGA, WLCSP Supplier Device Package: 6-WLCSP (1.36x0.96)	パッケージ: 6-XFBGA, WLCSP	在庫6,544
74HCT161DB,118	NXP	IC SYNC 4BIT BINARY COUNT 16SSOP Logic Type: Binary Counter Direction: Up Number of Elements: 1 Number of Bits per Element: 4 Reset: Asynchronous Timing: Synchronous Count Rate: 41MHz Trigger Type: Positive Edge Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SSOP (0.209", 5.30mm Width) Supplier Device Package: 16-SSOP	パッケージ: 16-SSOP (0.209", 5.30mm Width)	在庫6,656
PCA9541D/02,118	NXP	IC I2C 2:1 SELECTOR 16-SOIC Applications: 2-Channel I2C Multiplexer Interface: I2C, SMBus Voltage - Supply: 2.3 V ~ 5.5 V Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO Mounting Type: Surface Mount	パッケージ: 16-SOIC (0.154", 3.90mm Width)	在庫4,624
TJA1021T/10/CM,118	NXP	IC TRANSCEIVER LIN 8SOIC Type: Transceiver Protocol: LIN Number of Drivers/Receivers: 1/1 Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: 5.5 V ~ 27 V Operating Temperature: - Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	パッケージ: 8-SOIC (0.154", 3.90mm Width)	在庫19,236
T2080NSE7MQB	NXP	IC SOC 64BIT 8X1.2GHZ 896FCBGA Core Processor: PowerPC e6500 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.8GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (8), 2.5 Gbps (4), 10 Gbps (4) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage Package / Case: 896-FBGA, FCBGA Supplier Device Package: 896-FCPBGA (25x25)	パッケージ: 896-FBGA, FCBGA	在庫6,848
MPC8535ECVTATHA	NXP	IC MPU MPC85XX 1.25GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.25GHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (1) USB: USB 2.0 (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫4,672
PPC8572EPXATLC	NXP	IC MPU MPC85XX 1.2GHZ 1023FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 1023-BFBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33x33)	パッケージ: 1023-BFBGA, FCBGA	在庫5,248
P2010NSE2MFC	NXP	IC MPU Q OR IQ 1.2GHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	パッケージ: 689-BBGA Exposed Pad	在庫6,640
P1014NXN5FFB	NXP	IC MPU Q OR IQ 800MHZ 425TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 425-FBGA Supplier Device Package: 425-TEPBGA I (19x19)	パッケージ: 425-FBGA	在庫5,952
MC9S12XDT256CAAR	NXP	IC MCU 16BIT 256KB FLASH 80QFP Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	パッケージ: 80-QFP	在庫5,232
MC9S08DV96CLH	NXP	IC MCU 8BIT 96KB FLASH 64LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 53 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫7,280
MC9S12XEQ384CAL	NXP	IC MCU 16BIT 384KB FLASH 112LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	パッケージ: 112-LQFP	在庫13,632
MC9S08PA8AVWJ	NXP	IC MCU 8BIT 8KB FLASH 20SOIC Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 18 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC	パッケージ: 20-SOIC (0.295", 7.50mm Width)	在庫4,512
MKL25Z64VLK4	NXP	IC MCU 32BIT 64KB FLASH 80LQFP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Number of I/O: 66 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 14x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	パッケージ: 80-LQFP	在庫6,684
DSP56F803BU80E	NXP	IC MCU 16BIT 64KB FLASH 100LQFP Core Processor: 56800 Core Size: 16-Bit Speed: 80MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 16 Program Memory Size: 64KB (32K x 16) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 16 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: 100-LQFP	在庫30,996
ADC1207S080HW/C1:5	NXP	IC ADC 12BIT PAR 80MHZ 48-HTQFP Number of Bits: 12 Sampling Rate (Per Second): 80M Number of Inputs: 1 Input Type: Differential Data Interface: Parallel Configuration: S/H-ADC Ratio - S/H:ADC: 1:1 Number of A/D Converters: 1 Architecture: - Reference Type: Internal Voltage - Supply, Analog: 5V Voltage - Supply, Digital: 5V Features: - Operating Temperature: -40°C ~ 85°C Package / Case: 48-TQFP Exposed Pad Supplier Device Package: 48-HTQFP (7x7) Mounting Type: -	パッケージ: 48-TQFP Exposed Pad	在庫4,656
TDA8787AHL/C3,118	NXP	CCD CAMERA INTERFACE 48-LQFP Type: CCD (Charged Coupled Device) Number of Channels: - Resolution (Bits): 10 b Sampling Rate (Per Second): 18M Data Interface: Parallel Voltage Supply Source: Analog and Digital Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -20°C ~ 75°C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP	在庫5,744
PCKEP14D,118	NXP	IC CLK BUFFER 2:5 2GHZ 20SO Type: Fanout Buffer (Distribution), Multiplexer Number of Circuits: 1 Ratio - Input:Output: 2:5 Differential - Input:Output: Yes/Yes Input: ECL, HSTL, PECL Output: PECL Frequency - Max: 2GHz Voltage - Supply: 2.375 V ~ 3.8 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	パッケージ: 20-SOIC (0.295", 7.50mm Width)	在庫3,120
MPXV4115V6T1	NXP	SENSOR PRESSURE SMD 8-SOP Pressure Type: Vacuum Operating Pressure: -16.68 PSI (-115 kPa) Output Type: Analog Voltage Output: 0.2 V ~ 4.6 V Accuracy: ±1.5% Voltage - Supply: 4.75 V ~ 5.25 V Port Size: - Port Style: No Port Features: Temperature Compensated Termination Style: PCB Maximum Pressure: -58.02 PSI (-400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-SMD Module Supplier Device Package: -	パッケージ: 8-SMD Module	在庫7,182
SPC5745CBK1AMMJ6	NXP	DUAL CORE 2M FLASH 256 Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz, 160MHz Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, I²S, POR, WDT Number of I/O: 178 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPPBGA (17x17)	パッケージ: 256-LBGA	在庫5,232
SPC5606BK0MLL6R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 77 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 7x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: 100-LQFP	在庫3,472
MKV56F512VLQ24	NXP	KINETIS KV56: 220MHZ CORTEX-M7F Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Speed: 240MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 111 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 4x12b, 1x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫7,216
MFS2320BMMA0EP	NXP	IC Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
MC56F83766MLK	NXP	IC MCU 32BIT 128MB FLASH 80LQFP Core Processor: 56800EX Core Size: 32-Bit Speed: 100MHz Connectivity: CANbus, I2C, SPI Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Number of I/O: 68 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 20x12b; D/A 2x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 80-LQFP Supplier Device Package: 80-FQFP (12x12)	パッケージ: -	Request a Quote
MC35FS6515CAE	NXP	SYSTEM BASIS CHIP, DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	パッケージ: -	Request a Quote
MPF5023CVNA0ESR2	NXP	POWER MANAGEMENT IC, PRE-PROG, 3 Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 200µA Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	パッケージ: -	Request a Quote

MRF6S21060MR1

NXP

FET RF 68V 2.12GHZ TO270-4

Transistor Type: LDMOS
Frequency: 2.12GHz
Gain: 15.5dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 610mA
Power - Output: 14W
Voltage - Rated: 68V
Package / Case: TO-270-4
Supplier Device Package: TO-270 WB-4

パッケージ: TO-270-4

在庫2,096

BC635-16,126

NXP

TRANS NPN 45V 1A TO-92

Transistor Type: NPN
Current - Collector (Ic) (Max): 1A
Voltage - Collector Emitter Breakdown (Max): 45V
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 2V
Power - Max: 830mW
Frequency - Transition: 180MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Supplier Device Package: TO-92-3

パッケージ: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

在庫6,832

DC6M602X6/1518A,13

NXP

IC REG BUCK PROG 0.65A 6WLCSP

Function: Step-Down
Output Configuration: Positive
Topology: Buck
Output Type: Programmable
Number of Outputs: 1
Voltage - Input (Min): 2.3V
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 1.5V, 1.8V
Voltage - Output (Max): -
Current - Output: 650mA
Frequency - Switching: 6MHz
Synchronous Rectifier: Yes
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 6-XFBGA, WLCSP
Supplier Device Package: 6-WLCSP (1.36x0.96)

パッケージ: 6-XFBGA, WLCSP

在庫6,544

74HCT161DB,118

NXP

IC SYNC 4BIT BINARY COUNT 16SSOP

Logic Type: Binary Counter
Direction: Up
Number of Elements: 1
Number of Bits per Element: 4
Reset: Asynchronous
Timing: Synchronous
Count Rate: 41MHz
Trigger Type: Positive Edge
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 16-SSOP

パッケージ: 16-SSOP (0.209", 5.30mm Width)

在庫6,656

PCA9541D/02,118

NXP

IC I2C 2:1 SELECTOR 16-SOIC

Applications: 2-Channel I2C Multiplexer
Interface: I2C, SMBus
Voltage - Supply: 2.3 V ~ 5.5 V
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO
Mounting Type: Surface Mount

パッケージ: 16-SOIC (0.154", 3.90mm Width)

在庫4,624

TJA1021T/10/CM,118

NXP

IC TRANSCEIVER LIN 8SOIC

Type: Transceiver
Protocol: LIN
Number of Drivers/Receivers: 1/1
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: 5.5 V ~ 27 V
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

パッケージ: 8-SOIC (0.154", 3.90mm Width)

在庫19,236

T2080NSE7MQB

NXP

IC SOC 64BIT 8X1.2GHZ 896FCBGA

Core Processor: PowerPC e6500
Number of Cores/Bus Width: 4 Core, 64-Bit
Speed: 1.8GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (8), 2.5 Gbps (4), 10 Gbps (4)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Package / Case: 896-FBGA, FCBGA
Supplier Device Package: 896-FCPBGA (25x25)

パッケージ: 896-FBGA, FCBGA

在庫6,848

MPC8535ECVTATHA

NXP

IC MPU MPC85XX 1.25GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.25GHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (1)
USB: USB 2.0 (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫4,672

PPC8572EPXATLC

NXP

IC MPU MPC85XX 1.2GHZ 1023FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 1023-BFBGA, FCBGA
Supplier Device Package: 1023-FCPBGA (33x33)

パッケージ: 1023-BFBGA, FCBGA

在庫5,248

P2010NSE2MFC

NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

パッケージ: 689-BBGA Exposed Pad

在庫6,640

P1014NXN5FFB

NXP

IC MPU Q OR IQ 800MHZ 425TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (1)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 425-FBGA
Supplier Device Package: 425-TEPBGA I (19x19)

パッケージ: 425-FBGA

在庫5,952

MC9S12XDT256CAAR

NXP

IC MCU 16BIT 256KB FLASH 80QFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 80MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 59
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

パッケージ: 80-QFP

在庫5,232

MC9S08DV96CLH

NXP

IC MCU 8BIT 96KB FLASH 64LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 53
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 24x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫7,280

MC9S12XEQ384CAL

NXP

IC MCU 16BIT 384KB FLASH 112LQFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 24K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

パッケージ: 112-LQFP

在庫13,632

MC9S08PA8AVWJ

NXP

IC MCU 8BIT 8KB FLASH 20SOIC

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, LIN, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 18
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SOIC

パッケージ: 20-SOIC (0.295", 7.50mm Width)

在庫4,512

MKL25Z64VLK4

NXP

IC MCU 32BIT 64KB FLASH 80LQFP

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Number of I/O: 66
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 14x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (12x12)

パッケージ: 80-LQFP

在庫6,684

DSP56F803BU80E

NXP

IC MCU 16BIT 64KB FLASH 100LQFP

Core Processor: 56800
Core Size: 16-Bit
Speed: 80MHz
Connectivity: CAN, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 16
Program Memory Size: 64KB (32K x 16)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 16
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

在庫30,996

ADC1207S080HW/C1:5

NXP

IC ADC 12BIT PAR 80MHZ 48-HTQFP

Number of Bits: 12
Sampling Rate (Per Second): 80M
Number of Inputs: 1
Input Type: Differential
Data Interface: Parallel
Configuration: S/H-ADC
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 1
Architecture: -
Reference Type: Internal
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Features: -
Operating Temperature: -40°C ~ 85°C
Package / Case: 48-TQFP Exposed Pad
Supplier Device Package: 48-HTQFP (7x7)
Mounting Type: -

パッケージ: 48-TQFP Exposed Pad

在庫4,656

TDA8787AHL/C3,118

NXP

CCD CAMERA INTERFACE 48-LQFP

Type: CCD (Charged Coupled Device)
Number of Channels: -
Resolution (Bits): 10 b
Sampling Rate (Per Second): 18M
Data Interface: Parallel
Voltage Supply Source: Analog and Digital
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -20°C ~ 75°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP

在庫5,744

PCKEP14D,118

NXP

IC CLK BUFFER 2:5 2GHZ 20SO

Type: Fanout Buffer (Distribution), Multiplexer
Number of Circuits: 1
Ratio - Input:Output: 2:5
Differential - Input:Output: Yes/Yes
Input: ECL, HSTL, PECL
Output: PECL
Frequency - Max: 2GHz
Voltage - Supply: 2.375 V ~ 3.8 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO

パッケージ: 20-SOIC (0.295", 7.50mm Width)

在庫3,120

MPXV4115V6T1

NXP

SENSOR PRESSURE SMD 8-SOP

Pressure Type: Vacuum
Operating Pressure: -16.68 PSI (-115 kPa)
Output Type: Analog Voltage
Output: 0.2 V ~ 4.6 V
Accuracy: ±1.5%
Voltage - Supply: 4.75 V ~ 5.25 V
Port Size: -
Port Style: No Port
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: -58.02 PSI (-400 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 8-SMD Module
Supplier Device Package: -

パッケージ: 8-SMD Module

在庫7,182

SPC5745CBK1AMMJ6

NXP

DUAL CORE 2M FLASH 256

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz, 160MHz
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, I²S, POR, WDT
Number of I/O: 178
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 36x10b, 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPPBGA (17x17)

パッケージ: 256-LBGA

在庫5,232

SPC5606BK0MLL6R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 77
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 7x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

在庫3,472

MKV56F512VLQ24

NXP

KINETIS KV56: 220MHZ CORTEX-M7F

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit
Speed: 240MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 111
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 4x12b, 1x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫7,216

MFS2320BMMA0EP

NXP

IC

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

Request a Quote

MC56F83766MLK

NXP

IC MCU 32BIT 128MB FLASH 80LQFP

Core Processor: 56800EX
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CANbus, I2C, SPI
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O: 68
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Data Converters: A/D 20x12b; D/A 2x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Supplier Device Package: 80-FQFP (12x12)

パッケージ: -

Request a Quote

MC35FS6515CAE

NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

パッケージ: -

Request a Quote

MPF5023CVNA0ESR2

NXP

POWER MANAGEMENT IC, PRE-PROG, 3

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

パッケージ: -

Request a Quote