ページ 693 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
BSS84AKT,115	NXP	MOSFET P-CH 50V SC-75 FET Type: P-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 50V Current - Continuous Drain (Id) @ 25°C: 150mA (Ta) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 2.1V @ 250µA Gate Charge (Qg) (Max) @ Vgs: 0.35nC @ 5V Input Capacitance (Ciss) (Max) @ Vds: 36pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 250mW (Ta), 770mW (Tc) Rds On (Max) @ Id, Vgs: 7.5 Ohm @ 100mA, 10V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Supplier Device Package: SC-75 Package / Case: SC-75, SOT-416	パッケージ: SC-75, SOT-416	在庫4,400
BF1105WR,135	NXP	MOSFET N-CH 7V DUAL SOT343R Transistor Type: N-Channel Dual Gate Frequency: 800MHz Gain: 20dB Voltage - Test: 5V Current Rating: 30mA Noise Figure: 1.7dB Current - Test: - Power - Output: - Voltage - Rated: 7V Package / Case: SC-82A, SOT-343 Supplier Device Package: CMPAK-4	パッケージ: SC-82A, SOT-343	在庫6,992
BC517,116	NXP	TRANS NPN DARL 30V 0.5A TO-92 Transistor Type: NPN - Darlington Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 30V Vce Saturation (Max) @ Ib, Ic: 1V @ 100µA, 100mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 30000 @ 20mA, 2V Power - Max: 625mW Frequency - Transition: 220MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	パッケージ: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	在庫3,712
SC16C850LIBS,115	NXP	IC UART SINGLE W/FIFO 32-HVQFN Features: - Number of Channels: 1, UART FIFO's: 128 Byte Protocol: RS485 Data Rate (Max): 5Mbps Voltage - Supply: 1.8V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	パッケージ: 32-VFQFN Exposed Pad	在庫7,680
MCZ33903B3EK	NXP	IC SBC CAN HS 3.3V 32SOIC Applications: System Basis Chip Interface: CAN Voltage - Supply: 5.5 V ~ 28 V Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Mounting Type: Surface Mount	パッケージ: 32-SSOP (0.295", 7.50mm Width) Exposed Pad	在庫5,600
MC33794DWB	NXP	IC SENSOR ELECTRIC FIELD 54-SOIC Type: Sensor Interface Input Type: Logic Output Type: Logic Interface: ISO9141 Current - Supply: 7mA Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC W EP	パッケージ: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad	在庫2,192
PPC8535AVTATH	NXP	IC MPU MPC85XX 1.25GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.25GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (1) USB: USB 2.0 (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 90°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫6,928
MPC860SRVR80D4	NXP	IC MPU MPC8XX 80MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	パッケージ: 357-BBGA	在庫2,752
MPC857TCVR66B	NXP	IC MPU MPC8XX 66MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 115°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	パッケージ: 357-BBGA	在庫5,568
MPC8347VVAGDB	NXP	IC MPU MPC83XX 400MHZ 620BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: - RAM Controllers: DDR Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-PBGA (29x29)	パッケージ: 620-BBGA Exposed Pad	在庫10,920
MVF60NN151CMK40	NXP	IC MCU 32BIT ROMLESS 364MAPBGA Core Processor: ARM? Cortex?-A5 + Cortex?-M4 Core Size: 32-Bit Dual-Core Speed: 400MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, WDT Number of I/O: - Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1.5MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D Dual x 12b, D/A Dual x 12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 364-LFBGA Supplier Device Package: 364-MAPBGA (17x17)	パッケージ: 364-LFBGA	在庫2,816
P89LPC985FA,529	NXP	IC MCU 8BIT 8KB FLASH 28PLCC Core Processor: 8051 Core Size: 8-Bit Speed: 18MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 28-LCC (J-Lead) Supplier Device Package: 28-PLCC (11.51x11.51)	パッケージ: 28-LCC (J-Lead)	在庫4,464
MC908JB12DWE	NXP	IC MCU 8BIT 12KB FLASH 28SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 6MHz Connectivity: SCI, USB Peripherals: LED, LVD, POR, PWM Number of I/O: 21 Program Memory Size: 12KB (12K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 384 x 8 Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC	パッケージ: 28-SOIC (0.295", 7.50mm Width)	在庫7,212
MC9S12DB128CPV	NXP	IC MCU 16BIT 128KB FLASH 112LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: PWM, WDT Number of I/O: 91 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	パッケージ: 112-LQFP	在庫26,976
S9S12D64F0CFUE	NXP	IC MCU 16BIT 64KB FLASH 80QFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: PWM, WDT Number of I/O: 59 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	パッケージ: 80-QFP	在庫2,208
MC9S08GT8ACFDE	NXP	IC MCU 8BIT 8KB FLASH 48QFN Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	パッケージ: 48-VFQFN Exposed Pad	在庫6,448
MK20DX64VLH7	NXP	IC MCU 32BIT 64KB FLASH 64LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 72MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 24x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫11,748
MC9S08QE128CLK	NXP	IC MCU 8BIT 128KB FLASH 80LQFP Core Processor: S08 Core Size: 8-Bit Speed: 50MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 70 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 24x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (14x14)	パッケージ: 80-LQFP	在庫4,640
LPC1114JHI33/303E	NXP	IC MCU 32BIT 32KB FLASH 33HVQFN Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 28 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	パッケージ: 32-VFQFN Exposed Pad	在庫21,792
MW7IC2750GNR1	NXP	IC PWR AMP RF 2700MHZ TO-270-14 Frequency: 2.3GHz ~ 2.7GHz P1dB: 47dBm (50W) Gain: 26dB Noise Figure: - RF Type: WiMax Voltage - Supply: 28V Current - Supply: 550mA Test Frequency: 2.7GHz Package / Case: TO-270-14 Variant, Gull Wing Supplier Device Package: TO-270 WB-14 GULL	パッケージ: TO-270-14 Variant, Gull Wing	在庫3,852
SP5748GBK0AMMJ6R	NXP	TRIPLE CORE 6M FLASH 768K RAM Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPPBGA (17x17)	パッケージ: 256-LBGA	在庫3,520
SPC5605BK0CLU4	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 149 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 29x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	パッケージ: 176-LQFP	在庫2,448
S32K310NHT0MPAST	NXP	IC Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Number of I/O: 84 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 112K x 8 Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 100-QFP Supplier Device Package: 100-MaxQFP (10x10)	パッケージ: -	Request a Quote
MC33FS6527LAE	NXP	SYSTEM BASIS CHIP, DCDC 2.2A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	パッケージ: -	Request a Quote
S9S12VR48AACLC	NXP	IC MCU 16BIT 48KB FLASH 32LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Data Converters: A/D 2x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	パッケージ: -	Request a Quote
SAF775DHV-N208W-KK	NXP	CAR RADIO TUNER & AUDIO DSP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
S32G398ASAK1VUCT	NXP	8XA53 - 1.0GHZ, 3XM7 - 400MHZ, 1 Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 2.5Gbps (3) SATA: - USB: USB 2.0 OTG (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, TRNG Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	パッケージ: -	Request a Quote
PCA9421BSZ	NXP	IC PMIC HVQFN24 Applications: Microcontroller, MCU Current - Supply: 5.5µA Voltage - Supply: 3.3V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (3x3)	パッケージ: -	在庫4,200

BSS84AKT,115

NXP

MOSFET P-CH 50V SC-75

FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 50V
Current - Continuous Drain (Id) @ 25°C: 150mA (Ta)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs(th) (Max) @ Id: 2.1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs: 0.35nC @ 5V
Input Capacitance (Ciss) (Max) @ Vds: 36pF @ 25V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Rds On (Max) @ Id, Vgs: 7.5 Ohm @ 100mA, 10V
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: SC-75
Package / Case: SC-75, SOT-416

パッケージ: SC-75, SOT-416

在庫4,400

BF1105WR,135

NXP

MOSFET N-CH 7V DUAL SOT343R

Transistor Type: N-Channel Dual Gate
Frequency: 800MHz
Gain: 20dB
Voltage - Test: 5V
Current Rating: 30mA
Noise Figure: 1.7dB
Current - Test: -
Power - Output: -
Voltage - Rated: 7V
Package / Case: SC-82A, SOT-343
Supplier Device Package: CMPAK-4

パッケージ: SC-82A, SOT-343

在庫6,992

BC517,116

NXP

TRANS NPN DARL 30V 0.5A TO-92

Transistor Type: NPN - Darlington
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 30V
Vce Saturation (Max) @ Ib, Ic: 1V @ 100µA, 100mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 30000 @ 20mA, 2V
Power - Max: 625mW
Frequency - Transition: 220MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Supplier Device Package: TO-92-3

パッケージ: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

在庫3,712

SC16C850LIBS,115

NXP

IC UART SINGLE W/FIFO 32-HVQFN

Features: -
Number of Channels: 1, UART
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 5Mbps
Voltage - Supply: 1.8V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

パッケージ: 32-VFQFN Exposed Pad

在庫7,680

MCZ33903B3EK

NXP

IC SBC CAN HS 3.3V 32SOIC

Applications: System Basis Chip
Interface: CAN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP
Mounting Type: Surface Mount

パッケージ: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

在庫5,600

MC33794DWB

NXP

IC SENSOR ELECTRIC FIELD 54-SOIC

Type: Sensor Interface
Input Type: Logic
Output Type: Logic
Interface: ISO9141
Current - Supply: 7mA
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-SOIC W EP

パッケージ: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad

在庫2,192

PPC8535AVTATH

NXP

IC MPU MPC85XX 1.25GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.25GHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (1)
USB: USB 2.0 (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 90°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫6,928

MPC860SRVR80D4

NXP

IC MPU MPC8XX 80MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 80MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

パッケージ: 357-BBGA

在庫2,752

MPC857TCVR66B

NXP

IC MPU MPC8XX 66MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 115°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

パッケージ: 357-BBGA

在庫5,568

MPC8347VVAGDB

NXP

IC MPU MPC83XX 400MHZ 620BGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: -
RAM Controllers: DDR
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 620-BBGA Exposed Pad
Supplier Device Package: 620-PBGA (29x29)

パッケージ: 620-BBGA Exposed Pad

在庫10,920

MVF60NN151CMK40

NXP

IC MCU 32BIT ROMLESS 364MAPBGA

Core Processor: ARM? Cortex?-A5 + Cortex?-M4
Core Size: 32-Bit Dual-Core
Speed: 400MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, WDT
Number of I/O: -
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 1.5MB
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D Dual x 12b, D/A Dual x 12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 364-LFBGA
Supplier Device Package: 364-MAPBGA (17x17)

パッケージ: 364-LFBGA

在庫2,816

P89LPC985FA,529

NXP

IC MCU 8BIT 8KB FLASH 28PLCC

Core Processor: 8051
Core Size: 8-Bit
Speed: 18MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 28-LCC (J-Lead)
Supplier Device Package: 28-PLCC (11.51x11.51)

パッケージ: 28-LCC (J-Lead)

在庫4,464

MC908JB12DWE

NXP

IC MCU 8BIT 12KB FLASH 28SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 6MHz
Connectivity: SCI, USB
Peripherals: LED, LVD, POR, PWM
Number of I/O: 21
Program Memory Size: 12KB (12K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 384 x 8
Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SOIC

パッケージ: 28-SOIC (0.295", 7.50mm Width)

在庫7,212

MC9S12DB128CPV

NXP

IC MCU 16BIT 128KB FLASH 112LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: PWM, WDT
Number of I/O: 91
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

パッケージ: 112-LQFP

在庫26,976

S9S12D64F0CFUE

NXP

IC MCU 16BIT 64KB FLASH 80QFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: PWM, WDT
Number of I/O: 59
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

パッケージ: 80-QFP

在庫2,208

MC9S08GT8ACFDE

NXP

IC MCU 8BIT 8KB FLASH 48QFN

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN-EP (7x7)

パッケージ: 48-VFQFN Exposed Pad

在庫6,448

MK20DX64VLH7

NXP

IC MCU 32BIT 64KB FLASH 64LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 72MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 24x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫11,748

MC9S08QE128CLK

NXP

IC MCU 8BIT 128KB FLASH 80LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 50MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, PWM, WDT
Number of I/O: 70
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 24x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (14x14)

パッケージ: 80-LQFP

在庫4,640

LPC1114JHI33/303E

NXP

IC MCU 32BIT 32KB FLASH 33HVQFN

Core Processor: ARM? Cortex?-M0
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 28
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

パッケージ: 32-VFQFN Exposed Pad

在庫21,792

MW7IC2750GNR1

NXP

IC PWR AMP RF 2700MHZ TO-270-14

Frequency: 2.3GHz ~ 2.7GHz
P1dB: 47dBm (50W)
Gain: 26dB
Noise Figure: -
RF Type: WiMax
Voltage - Supply: 28V
Current - Supply: 550mA
Test Frequency: 2.7GHz
Package / Case: TO-270-14 Variant, Gull Wing
Supplier Device Package: TO-270 WB-14 GULL

パッケージ: TO-270-14 Variant, Gull Wing

在庫3,852

SP5748GBK0AMMJ6R

NXP

TRIPLE CORE 6M FLASH 768K RAM

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 178
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPPBGA (17x17)

パッケージ: 256-LBGA

在庫3,520

SPC5605BK0CLU4

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 149
Program Memory Size: 768KB (768K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 29x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

パッケージ: 176-LQFP

在庫2,448

S32K310NHT0MPAST

NXP

IC

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Number of I/O: 84
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 112K x 8
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Data Converters: A/D 24x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-QFP
Supplier Device Package: 100-MaxQFP (10x10)

パッケージ: -

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MC33FS6527LAE

NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

パッケージ: -

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S9S12VR48AACLC

NXP

IC MCU 16BIT 48KB FLASH 32LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 16
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Data Converters: A/D 2x10b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

パッケージ: -

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SAF775DHV-N208W-KK

NXP

CAR RADIO TUNER & AUDIO DSP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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S32G398ASAK1VUCT

NXP

8XA53 - 1.0GHZ, 3XM7 - 400MHZ, 1

Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
Speed: 400MHz, 1GHz
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 2.5Gbps (3)
SATA: -
USB: USB 2.0 OTG (1)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: ARM TZ, Boot Security, TRNG
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

パッケージ: -

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PCA9421BSZ

NXP

IC PMIC HVQFN24

Applications: Microcontroller, MCU
Current - Supply: 5.5µA
Voltage - Supply: 3.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-HVQFN (3x3)

パッケージ: -

在庫4,200