ページ 725 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
AFT21S230-12SR3	NXP	FET RF 65V 2.11GHZ NI780-2L2L Transistor Type: LDMOS Frequency: 2.11GHz Gain: 16.7dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.5A Power - Output: 50W Voltage - Rated: 65V Package / Case: NI-780S Supplier Device Package: NI-780S	パッケージ: NI-780S	在庫3,200
BF992,215	NXP	MOSFET NCH DUAL GATE 20V SOT143B Transistor Type: N-Channel Dual Gate Frequency: 200MHz Gain: - Voltage - Test: 10V Current Rating: 40mA Noise Figure: 1.2dB Current - Test: 15mA Power - Output: - Voltage - Rated: 20V Package / Case: TO-253-4, TO-253AA Supplier Device Package: SOT-143B	パッケージ: TO-253-4, TO-253AA	在庫28,770
74LV00N,112	NXP	IC GATE NAND 4CH 2-INP 14-DIP Logic Type: NAND Gate Number of Circuits: 4 Number of Inputs: 2 Features: - Voltage - Supply: 1 V ~ 5.5 V Current - Quiescent (Max): 40µA Current - Output High, Low: 12mA, 12mA Logic Level - Low: 0.3 V ~ 0.8 V Logic Level - High: 0.9 V ~ 2 V Max Propagation Delay @ V, Max CL: 6.5ns @ 5V, 50pF Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Supplier Device Package: 14-DIP Package / Case: 14-DIP (0.300", 7.62mm)	パッケージ: 14-DIP (0.300", 7.62mm)	在庫4,672
74ALVT16241DGG,518	NXP	IC BUFF DVR TRI-ST 16BIT 48TSSOP Logic Type: Buffer, Non-Inverting Number of Elements: 4 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 48-TSSOP	パッケージ: 48-TFSOP (0.240", 6.10mm Width)	在庫5,872
TDA9984AHW15C184,5	NXP	HDMI TRANSMITTER 1080P 80HTQFP Type: HDMI 1.3 Transmitter Applications: Set-Top Boxes, Video Players, Recorders Mounting Type: Surface Mount Package / Case: 80-TQFP Exposed Pad Supplier Device Package: 80-HTQFP (12x12)	パッケージ: 80-TQFP Exposed Pad	在庫4,112
TDA19971AHN/C181E	NXP	IC HDMI RECEIVER SGL 72HVQFN Type: Receiver Applications: TV Mounting Type: Surface Mount Package / Case: - Supplier Device Package: -	パッケージ: -	在庫3,248
BGD812,112	NXP	IC AMP GAIN PWR 860MHZ SOT115J Applications: CATV Output Type: - Number of Circuits: 1 -3db Bandwidth: - Slew Rate: - Current - Supply: 395mA Current - Output / Channel: - Voltage - Supply, Single/Dual (±): - Mounting Type: - Package / Case: SOT-115J Supplier Device Package: SOT115J	パッケージ: SOT-115J	在庫6,352
MPC8535BVTAKGA	NXP	IC MPU MPC85XX 600MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (1) USB: USB 2.0 (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫2,240
MPC8543VJANGD	NXP	IC MPU MPC85XX 800MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫3,120
P1022NSE2MHB	NXP	IC MPU Q OR IQ 1.055GHZ 689TBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.055GHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	パッケージ: 689-BBGA Exposed Pad	在庫5,248
MC68302CAG16VC	NXP	IC MPU M683XX 16MHZ 144LQFP Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 16MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫5,664
MC9328MX21SCVM	NXP	IC MPU I.MX21 266MHZ 289MAPBGA Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD Ethernet: - SATA: - USB: USB 1.x (2) Voltage - I/O: 1.8V, 3.0V Operating Temperature: -40°C ~ 85°C (TA) Security Features: - Package / Case: 289-LFBGA Supplier Device Package: -	パッケージ: 289-LFBGA	在庫62,940
MCIMX6Q5EYM10AD	NXP	IC MPU I.MX6Q 1.0GHZ 624FCBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	パッケージ: 624-FBGA, FCBGA	在庫51,120
PCF51JM64EVLK	NXP	IC MCU 32BIT 64KB FLASH 80LQFP Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: CAN, I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Number of I/O: 66 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (14x14)	パッケージ: 80-LQFP	在庫3,776
MM908E621ACDWB	NXP	IC QUAD HALF BRDG TRPL SW 54SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP	パッケージ: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad	在庫4,128
MMA1260EGR2	NXP	ACCELEROMETER 1.55G ANAL 16SOIC Type: Analog Axis: Z Acceleration Range: ±1.55g Sensitivity (LSB/g): - Sensitivity (mV/g): 1200 Bandwidth: 50Hz Output Type: Analog Voltage Voltage - Supply: 4.75 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	パッケージ: 16-SOIC (0.295", 7.50mm Width)	在庫8,028
MC35FS6503CAER2	NXP	FS6500 Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP Exposed Pad	在庫5,280
T1013NSN7PQA	NXP	QORIQ 1XCPU 64-BIT PWR ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫2,160
LPC802M001JDH16FP	NXP	32-BIT ARM CORTEX-M0+ Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 15MHz Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 13 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	パッケージ: 16-TSSOP (0.173", 4.40mm Width)	在庫19,452
SPC5644CF0VLU8R	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Speed: 80MHz/120MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 147 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 27x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	パッケージ: 176-LQFP	在庫3,040
SPC5606EEF2VMCR	NXP	ETHERNET CAMERA MCU Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, WDT Number of I/O: 39 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 121-LFBGA Supplier Device Package: 121-MAPBGA (8x8)	パッケージ: 121-LFBGA	在庫3,616
SPC5746CK1AMKU2R	NXP	32 BIT DUAL CORE 3M FLASH 384 Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	パッケージ: 176-LQFP Exposed Pad	在庫7,840
SP5745BBK1AMMH6R	NXP	32 BIT,SINGLE CORE,2M FL Core Processor: e200z4 Core Size: 32-Bit Speed: 160MHz Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, I²S, POR, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LBGA Supplier Device Package: 100-MAPBGA (11x11)	パッケージ: 100-LBGA	在庫2,672
S9S08AW48E5VPUE	NXP	8-BIT MCU S08 CORE 48KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫3,136
S9S12ZVLS1F0CFM	NXP	MAGNIV 16-BIT MCU S12Z CORE 16 Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: I²C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 19 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN-EP (5x5)	パッケージ: 32-VFQFN Exposed Pad	在庫6,304
FS32K146HRT0MLHR	NXP	IC MCU 32BIT 1MB FLASH 64LQFP Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 80MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 58 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: -	Request a Quote
TJA1057BT-0Z	NXP	IC TRANSCEIVER HI SPEED 8SO Type: Transceiver Protocol: CANbus Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 300 mV Data Rate: 5Mbps Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	パッケージ: -	在庫11,400
MPF5030BMBA0ES	NXP	PMIC 3 BUCKS 2 LDO A1 DIE Applications: System Basis Chip Current - Supply: - Voltage - Supply: 3.3V ~ 5.25V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-PowerVFQFN Supplier Device Package: 40-HVQFN (6x6)	パッケージ: -	Request a Quote

AFT21S230-12SR3

NXP

FET RF 65V 2.11GHZ NI780-2L2L

Transistor Type: LDMOS
Frequency: 2.11GHz
Gain: 16.7dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.5A
Power - Output: 50W
Voltage - Rated: 65V
Package / Case: NI-780S
Supplier Device Package: NI-780S

パッケージ: NI-780S

在庫3,200

BF992,215

NXP

MOSFET NCH DUAL GATE 20V SOT143B

Transistor Type: N-Channel Dual Gate
Frequency: 200MHz
Gain: -
Voltage - Test: 10V
Current Rating: 40mA
Noise Figure: 1.2dB
Current - Test: 15mA
Power - Output: -
Voltage - Rated: 20V
Package / Case: TO-253-4, TO-253AA
Supplier Device Package: SOT-143B

パッケージ: TO-253-4, TO-253AA

在庫28,770

74LV00N,112

NXP

IC GATE NAND 4CH 2-INP 14-DIP

Logic Type: NAND Gate
Number of Circuits: 4
Number of Inputs: 2
Features: -
Voltage - Supply: 1 V ~ 5.5 V
Current - Quiescent (Max): 40µA
Current - Output High, Low: 12mA, 12mA
Logic Level - Low: 0.3 V ~ 0.8 V
Logic Level - High: 0.9 V ~ 2 V
Max Propagation Delay @ V, Max CL: 6.5ns @ 5V, 50pF
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Supplier Device Package: 14-DIP
Package / Case: 14-DIP (0.300", 7.62mm)

パッケージ: 14-DIP (0.300", 7.62mm)

在庫4,672

74ALVT16241DGG,518

NXP

IC BUFF DVR TRI-ST 16BIT 48TSSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 48-TSSOP

パッケージ: 48-TFSOP (0.240", 6.10mm Width)

在庫5,872

TDA9984AHW15C184,5

NXP

HDMI TRANSMITTER 1080P 80HTQFP

Type: HDMI 1.3 Transmitter
Applications: Set-Top Boxes, Video Players, Recorders
Mounting Type: Surface Mount
Package / Case: 80-TQFP Exposed Pad
Supplier Device Package: 80-HTQFP (12x12)

パッケージ: 80-TQFP Exposed Pad

在庫4,112

TDA19971AHN/C181E

NXP

IC HDMI RECEIVER SGL 72HVQFN

Type: Receiver
Applications: TV
Mounting Type: Surface Mount
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫3,248

BGD812,112

NXP

IC AMP GAIN PWR 860MHZ SOT115J

Applications: CATV
Output Type: -
Number of Circuits: 1
-3db Bandwidth: -
Slew Rate: -
Current - Supply: 395mA
Current - Output / Channel: -
Voltage - Supply, Single/Dual (±): -
Mounting Type: -
Package / Case: SOT-115J
Supplier Device Package: SOT115J

パッケージ: SOT-115J

在庫6,352

MPC8535BVTAKGA

NXP

IC MPU MPC85XX 600MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 600MHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (1)
USB: USB 2.0 (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫2,240

MPC8543VJANGD

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫3,120

P1022NSE2MHB

NXP

IC MPU Q OR IQ 1.055GHZ 689TBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.055GHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

パッケージ: 689-BBGA Exposed Pad

在庫5,248

MC68302CAG16VC

NXP

IC MPU M683XX 16MHZ 144LQFP

Core Processor: M68000
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Speed: 16MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫5,664

MC9328MX21SCVM

NXP

IC MPU I.MX21 266MHZ 289MAPBGA

Core Processor: ARM926EJ-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: -
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Ethernet: -
SATA: -
USB: USB 1.x (2)
Voltage - I/O: 1.8V, 3.0V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: -
Package / Case: 289-LFBGA
Supplier Device Package: -

パッケージ: 289-LFBGA

在庫62,940

MCIMX6Q5EYM10AD

NXP

IC MPU I.MX6Q 1.0GHZ 624FCBGA

Core Processor: ARM? Cortex?-A9
Number of Cores/Bus Width: 4 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -20°C ~ 105°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-FBGA, FCBGA
Supplier Device Package: 624-FCBGA (21x21)

パッケージ: 624-FBGA, FCBGA

在庫51,120

PCF51JM64EVLK

NXP

IC MCU 32BIT 64KB FLASH 80LQFP

Core Processor: Coldfire V1
Core Size: 32-Bit
Speed: 50MHz
Connectivity: CAN, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Number of I/O: 66
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (14x14)

パッケージ: 80-LQFP

在庫3,776

MM908E621ACDWB

NXP

IC QUAD HALF BRDG TRPL SW 54SOIC

Applications: Automotive Mirror Control
Core Processor: HC08
Program Memory Type: FLASH (16 kB)
Controller Series: 908E
RAM Size: 512 x 8
Interface: SCI, SPI
Number of I/O: 12
Voltage - Supply: 9 V ~ 16 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-SOICW-EP

パッケージ: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad

在庫4,128

MMA1260EGR2

NXP

ACCELEROMETER 1.55G ANAL 16SOIC

Type: Analog
Axis: Z
Acceleration Range: ±1.55g
Sensitivity (LSB/g): -
Sensitivity (mV/g): 1200
Bandwidth: 50Hz
Output Type: Analog Voltage
Voltage - Supply: 4.75 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

パッケージ: 16-SOIC (0.295", 7.50mm Width)

在庫8,028

MC35FS6503CAER2

NXP

FS6500

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP Exposed Pad

在庫5,280

T1013NSN7PQA

NXP

QORIQ 1XCPU 64-BIT PWR ARCH 1.

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫2,160

LPC802M001JDH16FP

NXP

32-BIT ARM CORTEX-M0+

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 15MHz
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O: 13
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

パッケージ: 16-TSSOP (0.173", 4.40mm Width)

在庫19,452

SPC5644CF0VLU8R

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 147
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 27x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

パッケージ: 176-LQFP

在庫3,040

SPC5606EEF2VMCR

NXP

ETHERNET CAMERA MCU

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, WDT
Number of I/O: 39
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 4x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 121-LFBGA
Supplier Device Package: 121-MAPBGA (8x8)

パッケージ: 121-LFBGA

在庫3,616

SPC5746CK1AMKU2R

NXP

32 BIT DUAL CORE 3M FLASH 384

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 129
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

パッケージ: 176-LQFP Exposed Pad

在庫7,840

SP5745BBK1AMMH6R

NXP

32 BIT,SINGLE CORE,2M FL

Core Processor: e200z4
Core Size: 32-Bit
Speed: 160MHz
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, I²S, POR, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 36x10b, 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 100-LBGA
Supplier Device Package: 100-MAPBGA (11x11)

パッケージ: 100-LBGA

在庫2,672

S9S08AW48E5VPUE

NXP

8-BIT MCU S08 CORE 48KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫3,136

S9S12ZVLS1F0CFM

NXP

MAGNIV 16-BIT MCU S12Z CORE 16

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: I²C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 19
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 128 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
Data Converters: A/D 6x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-QFN-EP (5x5)

パッケージ: 32-VFQFN Exposed Pad

在庫6,304

FS32K146HRT0MLHR

NXP

IC MCU 32BIT 1MB FLASH 64LQFP

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit Single-Core
Speed: 80MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 58
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b SAR; D/A1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: -

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TJA1057BT-0Z

NXP

IC TRANSCEIVER HI SPEED 8SO

Type: Transceiver
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 300 mV
Data Rate: 5Mbps
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

パッケージ: -

在庫11,400

MPF5030BMBA0ES

NXP

PMIC 3 BUCKS 2 LDO A1 DIE

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 3.3V ~ 5.25V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-PowerVFQFN
Supplier Device Package: 40-HVQFN (6x6)

パッケージ: -

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