ページ 733 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
BC337-40,412	NXP	TRANS NPN 45V 0.5A TO-92 Transistor Type: NPN Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 45V Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 250 @ 100mA, 1V Power - Max: 625mW Frequency - Transition: 100MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) Supplier Device Package: TO-92-3	パッケージ: TO-226-3, TO-92-3 (TO-226AA)	在庫5,088
BFG540,215	NXP	TRANS RF 15V 9GHZ SOT143B Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 15V Frequency - Transition: 9GHz Noise Figure (dB Typ @ f): 1.3dB ~ 1.8dB @ 900MHz Gain: - Power - Max: 400mW DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 40mA, 8V Current - Collector (Ic) (Max): 120mA Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-253-4, TO-253AA Supplier Device Package: SOT-143B	パッケージ: TO-253-4, TO-253AA	在庫5,600
MC33887VWR2	NXP	IC MOTOR DRIVER PAR 20HSOP Motor Type - Stepper: - Motor Type - AC, DC: Brushed DC Function: Driver - Fully Integrated, Control and Power Stage Output Configuration: Half Bridge (2) Interface: Parallel Technology: Power MOSFET Step Resolution: - Applications: General Purpose Current - Output: 5A Voltage - Supply: 5 V ~ 28 V Voltage - Load: 5 V ~ 28 V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Supplier Device Package: 20-HSOP	パッケージ: 20-SOIC (0.433", 11.00mm Width) Exposed Pad	在庫5,504
SC16C550BIB48,157	NXP	IC UART SINGLE W/FIFO 48-LQFP Features: - Number of Channels: 1, UART FIFO's: 16 Byte Protocol: - Data Rate (Max): 3Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: - With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP	在庫4,576
CBTL01023GM,115	NXP	IC MUX/DEMUX 1CH 10-XQFN Applications: DisplayPort, PCIe, USB Multiplexer/Demultiplexer Circuit: 2:1 Switch Circuit: - Number of Channels: 1 On-State Resistance (Max): 6 Ohm (Typ) Voltage - Supply, Single (V+): 3 V ~ 3.6 V Voltage - Supply, Dual (V±): - -3db Bandwidth: 9GHz Features: Bi-Directional, SATA Operating Temperature: -40°C ~ 85°C (TA) Package / Case: 10-XFQFN Supplier Device Package: 10-XQFN (1.55x2)	パッケージ: 10-XFQFN	在庫80,706
MPC8544EAVTAQG	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫7,376
KMPC8555VTAPF	NXP	IC MPU MPC85XX 833MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 833MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫7,424
MPC8358EVVAGDGA	NXP	IC MPU MPC83XX 400MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	パッケージ: 740-LBGA	在庫4,560
MPC8377EVRALGA	NXP	IC MPU MPC83XX 667MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	パッケージ: 689-BBGA Exposed Pad	在庫4,400
MC9S08RE8CFJER	NXP	IC MCU 8BIT 8KB FLASH 32LQFP Core Processor: S08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI Peripherals: LVD, POR, PWM, WDT Number of I/O: 25 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	パッケージ: 32-LQFP	在庫4,288
P87C52X2FA,512	NXP	IC MCU 8BIT 8KB OTP 44PLCC Core Processor: 8051 Core Size: 8-Bit Speed: 33MHz Connectivity: EBI/EMI, UART/USART Peripherals: POR Number of I/O: 32 Program Memory Size: 8KB (8K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	パッケージ: 44-LCC (J-Lead)	在庫5,040
MCHC908QT1MDWE	NXP	IC MCU 8BIT 1.5KB FLASH 8SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 5 Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 8-SOIC (0.209", 5.30mm Width) Supplier Device Package: 8-SOIC	パッケージ: 8-SOIC (0.209", 5.30mm Width)	在庫4,000
MK60DX256ZVLQ10	NXP	IC MCU 32BIT 256KB FLASH 144LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 100 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 42x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫11,400
MM908E621ACDWBR2	NXP	IC SW QUAD HB/TRPL HISID 54-SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP	パッケージ: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad	在庫6,224
ADC1210S105HN/C1:5	NXP	ADC 12BIT SPI 105MSPS 40HVQFN Number of Bits: 12 Sampling Rate (Per Second): 105M Number of Inputs: 1 Input Type: Differential, Single Ended Data Interface: LVDS - Parallel, Parallel Configuration: S/H-ADC Ratio - S/H:ADC: 1:1 Number of A/D Converters: 1 Architecture: Pipelined Reference Type: External, Internal Voltage - Supply, Analog: 2.85 V ~ 3.4 V Voltage - Supply, Digital: 2.85 V ~ 3.4 V Features: - Operating Temperature: -40°C ~ 85°C Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6) Mounting Type: -	パッケージ: 40-VFQFN Exposed Pad	在庫3,248
PCA2002U/10AB/1,00	NXP	IC WATCH CIRCUIT 32KHZ DIE FFC PLL: No Main Purpose: Battery operated wrist watches Input: Crystal Output: - Number of Circuits: 1 Ratio - Input:Output: 1:2 Differential - Input:Output: No/No Frequency - Max: 32kHz Voltage - Supply: 1.1 V ~ 3.6 V Operating Temperature: -10°C ~ 60°C Mounting Type: Surface Mount Package / Case: Die Supplier Device Package: Die	パッケージ: Die	在庫4,000
MMA5106NDIKGWR2	NXP	ACCELEROMETER DSI2.5 16QFN Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫5,616
SL3S1014FUD/BGZ	NXP	IC UCODE G2IM TRANSPONDER DIE Type: RFID Transponder Frequency: 840MHz ~ 960MHz Standards: - Interface: - Voltage - Supply: - Operating Temperature: -40°C ~ 85°C Package / Case: Die Supplier Device Package: Wafer	パッケージ: Die	在庫3,708
OM7600/BGA2001/900	NXP	EVAL BOARD FOR BGA2001 Type: Amplifier Frequency: 1.8GHz For Use With/Related Products: BGA2001 Supplied Contents: Board	パッケージ: -	在庫6,768
UJA1132HW/FD/5V/0Y	NXP	BUCK/BOOST HS-CAN/DUAL LIN SYSTE Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫5,952
SPC5747CGK0AVKU6	NXP	DUAL CORE 4M FLASH 512K RAM F Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	パッケージ: 176-LQFP Exposed Pad	在庫6,240
SPC5602BACLH4	NXP	IC MCU 32BIT Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
MIMX9322CVXXMAB	NXP	IC Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
P3T1755DP-Q900Z	NXP	I3C, I2C-BUS INTERFACE, 0.5 C A Applications: Controllers, Notebook PC Interface: I2C, 2-Wire Serial Voltage - Supply: 1.4V ~ 3.6V Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Supplier Device Package: 8-TSSOP Mounting Type: Surface Mount	パッケージ: -	Request a Quote
LPC5534JBD100MP	NXP	IC MCU 32BIT 128KB FLSH 100HLQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0 Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 66 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 23x16b; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-HLQFP (14x14)	パッケージ: -	Request a Quote
MC33FS6506CAE	NXP	SYSTEM BASIS CHIP, DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	パッケージ: -	Request a Quote
AFT27S012NT1	NXP	RF MOSFET LDMOS 28V PLD-1.5W Transistor Type: LDMOS Frequency: 728MHz ~ 2.7GHz Gain: 20.9dB Voltage - Test: 28 V Current Rating: 10µA Noise Figure: - Current - Test: 90 mA Power - Output: 13W Voltage - Rated: 65 V Package / Case: PLD-1.5W Supplier Device Package: PLD-1.5W	パッケージ: -	Request a Quote
S32K322EHT0MPBIR	NXP	IC MCU 32BIT 2MB FLASH 172QFP Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Speed: 160MHz Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Number of I/O: 143 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 128K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 172-QFP Supplier Device Package: 172-QFP (16x16)	パッケージ: -	Request a Quote

BC337-40,412

NXP

TRANS NPN 45V 0.5A TO-92

Transistor Type: NPN
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 45V
Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 250 @ 100mA, 1V
Power - Max: 625mW
Frequency - Transition: 100MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Supplier Device Package: TO-92-3

パッケージ: TO-226-3, TO-92-3 (TO-226AA)

在庫5,088

BFG540,215

NXP

TRANS RF 15V 9GHZ SOT143B

Transistor Type: NPN
Voltage - Collector Emitter Breakdown (Max): 15V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 1.8dB @ 900MHz
Gain: -
Power - Max: 400mW
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 40mA, 8V
Current - Collector (Ic) (Max): 120mA
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-253-4, TO-253AA
Supplier Device Package: SOT-143B

パッケージ: TO-253-4, TO-253AA

在庫5,600

MC33887VWR2

NXP

IC MOTOR DRIVER PAR 20HSOP

Motor Type - Stepper: -
Motor Type - AC, DC: Brushed DC
Function: Driver - Fully Integrated, Control and Power Stage
Output Configuration: Half Bridge (2)
Interface: Parallel
Technology: Power MOSFET
Step Resolution: -
Applications: General Purpose
Current - Output: 5A
Voltage - Supply: 5 V ~ 28 V
Voltage - Load: 5 V ~ 28 V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Supplier Device Package: 20-HSOP

パッケージ: 20-SOIC (0.433", 11.00mm Width) Exposed Pad

在庫5,504

SC16C550BIB48,157

NXP

IC UART SINGLE W/FIFO 48-LQFP

Features: -
Number of Channels: 1, UART
FIFO's: 16 Byte
Protocol: -
Data Rate (Max): 3Mbps
Voltage - Supply: 2.5V, 3.3V, 5V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: -
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP

在庫4,576

CBTL01023GM,115

NXP

IC MUX/DEMUX 1CH 10-XQFN

Applications: DisplayPort, PCIe, USB
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: -
Number of Channels: 1
On-State Resistance (Max): 6 Ohm (Typ)
Voltage - Supply, Single (V+): 3 V ~ 3.6 V
Voltage - Supply, Dual (V±): -
-3db Bandwidth: 9GHz
Features: Bi-Directional, SATA
Operating Temperature: -40°C ~ 85°C (TA)
Package / Case: 10-XFQFN
Supplier Device Package: 10-XQFN (1.55x2)

パッケージ: 10-XFQFN

在庫80,706

MPC8544EAVTAQG

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫7,376

KMPC8555VTAPF

NXP

IC MPU MPC85XX 833MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 833MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫7,424

MPC8358EVVAGDGA

NXP

IC MPU MPC83XX 400MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

パッケージ: 740-LBGA

在庫4,560

MPC8377EVRALGA

NXP

IC MPU MPC83XX 667MHZ 689TEBGA

Core Processor: PowerPC e300c4s
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

パッケージ: 689-BBGA Exposed Pad

在庫4,400

MC9S08RE8CFJER

NXP

IC MCU 8BIT 8KB FLASH 32LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 25
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

パッケージ: 32-LQFP

在庫4,288

P87C52X2FA,512

NXP

IC MCU 8BIT 8KB OTP 44PLCC

Core Processor: 8051
Core Size: 8-Bit
Speed: 33MHz
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Number of I/O: 32
Program Memory Size: 8KB (8K x 8)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

パッケージ: 44-LCC (J-Lead)

在庫5,040

MCHC908QT1MDWE

NXP

IC MCU 8BIT 1.5KB FLASH 8SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LVD, POR, PWM
Number of I/O: 5
Program Memory Size: 1.5KB (1.5K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Supplier Device Package: 8-SOIC

パッケージ: 8-SOIC (0.209", 5.30mm Width)

在庫4,000

MK60DX256ZVLQ10

NXP

IC MCU 32BIT 256KB FLASH 144LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 100
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 42x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫11,400

MM908E621ACDWBR2

NXP

IC SW QUAD HB/TRPL HISID 54-SOIC

Applications: Automotive Mirror Control
Core Processor: HC08
Program Memory Type: FLASH (16 kB)
Controller Series: 908E
RAM Size: 512 x 8
Interface: SCI, SPI
Number of I/O: 12
Voltage - Supply: 9 V ~ 16 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-SOICW-EP

パッケージ: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad

在庫6,224

ADC1210S105HN/C1:5

NXP

ADC 12BIT SPI 105MSPS 40HVQFN

Number of Bits: 12
Sampling Rate (Per Second): 105M
Number of Inputs: 1
Input Type: Differential, Single Ended
Data Interface: LVDS - Parallel, Parallel
Configuration: S/H-ADC
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 1
Architecture: Pipelined
Reference Type: External, Internal
Voltage - Supply, Analog: 2.85 V ~ 3.4 V
Voltage - Supply, Digital: 2.85 V ~ 3.4 V
Features: -
Operating Temperature: -40°C ~ 85°C
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)
Mounting Type: -

パッケージ: 40-VFQFN Exposed Pad

在庫3,248

PCA2002U/10AB/1,00

NXP

IC WATCH CIRCUIT 32KHZ DIE FFC

PLL: No
Main Purpose: Battery operated wrist watches
Input: Crystal
Output: -
Number of Circuits: 1
Ratio - Input:Output: 1:2
Differential - Input:Output: No/No
Frequency - Max: 32kHz
Voltage - Supply: 1.1 V ~ 3.6 V
Operating Temperature: -10°C ~ 60°C
Mounting Type: Surface Mount
Package / Case: Die
Supplier Device Package: Die

パッケージ: Die

在庫4,000

MMA5106NDIKGWR2

NXP

ACCELEROMETER DSI2.5 16QFN

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫5,616

SL3S1014FUD/BGZ

NXP

IC UCODE G2IM TRANSPONDER DIE

Type: RFID Transponder
Frequency: 840MHz ~ 960MHz
Standards: -
Interface: -
Voltage - Supply: -
Operating Temperature: -40°C ~ 85°C
Package / Case: Die
Supplier Device Package: Wafer

パッケージ: Die

在庫3,708

OM7600/BGA2001/900

NXP

EVAL BOARD FOR BGA2001

Type: Amplifier
Frequency: 1.8GHz
For Use With/Related Products: BGA2001
Supplied Contents: Board

パッケージ: -

在庫6,768

UJA1132HW/FD/5V/0Y

NXP

BUCK/BOOST HS-CAN/DUAL LIN SYSTE

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫5,952

SPC5747CGK0AVKU6

NXP

DUAL CORE 4M FLASH 512K RAM F

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 129
Program Memory Size: 4MB (4M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

パッケージ: 176-LQFP Exposed Pad

在庫6,240

SPC5602BACLH4

NXP

IC MCU 32BIT

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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MIMX9322CVXXMAB

NXP

IC

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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P3T1755DP-Q900Z

NXP

I3C, I2C-BUS INTERFACE, 0.5 C A

Applications: Controllers, Notebook PC
Interface: I2C, 2-Wire Serial
Voltage - Supply: 1.4V ~ 3.6V
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Supplier Device Package: 8-TSSOP
Mounting Type: Surface Mount

パッケージ: -

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LPC5534JBD100MP

NXP

IC MCU 32BIT 128KB FLSH 100HLQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O: 66
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 23x16b; D/A 2x12b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Supplier Device Package: 100-HLQFP (14x14)

パッケージ: -

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MC33FS6506CAE

NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

パッケージ: -

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AFT27S012NT1

NXP

RF MOSFET LDMOS 28V PLD-1.5W

Transistor Type: LDMOS
Frequency: 728MHz ~ 2.7GHz
Gain: 20.9dB
Voltage - Test: 28 V
Current Rating: 10µA
Noise Figure: -
Current - Test: 90 mA
Power - Output: 13W
Voltage - Rated: 65 V
Package / Case: PLD-1.5W
Supplier Device Package: PLD-1.5W

パッケージ: -

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S32K322EHT0MPBIR

NXP

IC MCU 32BIT 2MB FLASH 172QFP

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Dual-Core
Speed: 160MHz
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Number of I/O: 143
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 128K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Data Converters: A/D 24x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 172-QFP
Supplier Device Package: 172-QFP (16x16)

パッケージ: -

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