ページ 781 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
BUK9Y11-30B/C1,115	NXP	MOSFET N-CH LFPAK Transistor Type: - Current - Collector (Ic) (Max): - Voltage - Collector Emitter Breakdown (Max): - Vce Saturation (Max) @ Ib, Ic: - Current - Collector Cutoff (Max): - DC Current Gain (hFE) (Min) @ Ic, Vce: - Power - Max: - Frequency - Transition: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫3,328
MC44BS374T1AEF	NXP	IC AUDIO/VIDEO MODULATOR 16-SOIC Type: NTSC/PAL Modulator Applications: Audio/Video, VCR's, Set-Top Boxes Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SOIC	パッケージ: 16-SOIC (0.154", 3.90mm Width)	在庫5,680
MC34703PNB	NXP	IC POWER SUPPLY QUICC 33-QFN Applications: Power Supplies Current - Supply: 60mA Voltage - Supply: 2.8 V ~ 13.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 33-PowerQFN Supplier Device Package: 33-PQFN (10x10)	パッケージ: 33-PowerQFN	在庫2,544
MC34709VK	NXP	IC PWR MGMT IMX50/53 130MAPBGA Applications: Processor Current - Supply: 370µA Voltage - Supply: 3 V ~ 4.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 130-LFBGA Supplier Device Package: 130-MAPBGA (8x8)	パッケージ: 130-LFBGA	在庫5,824
PCF8576CT/1,118	NXP	IC LCD DVR UNVRSL LOW-MUX 56VSOP Display Type: LCD Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Interface: I2C, 2-Wire Serial Digits or Characters: 10 Characters, 20 Characters, 160 Elements Current - Supply: 120µA Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 56-BSOP (0.435", 11.05mm Width) Supplier Device Package: 56-VSOP	パッケージ: 56-BSOP (0.435", 11.05mm Width)	在庫3,728
74LVC646ADB,118	NXP	IC TRANSCVR 8BIT N-INV 24SSOP Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 24mA, 24mA Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 24-SSOP (0.209", 5.30mm Width) Supplier Device Package: 24-SSOP	パッケージ: 24-SSOP (0.209", 5.30mm Width)	在庫4,112
74ABT16827ADGG,118	NXP	IC BUFF DVR TRI-ST 20BIT 56TSSOP Logic Type: Buffer, Non-Inverting Number of Elements: 2 Number of Bits per Element: 10 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 56-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 56-TSSOP	パッケージ: 56-TFSOP (0.240", 6.10mm Width)	在庫5,904
PCA9518AD,118	NXP	IC I2C BUS HUB 5-CH 20SOIC Applications: Buffer Interface: I2C, SMBus Voltage - Supply: 3 V ~ 3.6 V Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO Mounting Type: Surface Mount	パッケージ: 20-SOIC (0.295", 7.50mm Width)	在庫3,776
CBTL08GP053EVAZ	NXP	IC MUX CROSSBAR SW USB VFBGA40 Applications: USB Multiplexer/Demultiplexer Circuit: - Switch Circuit: - Number of Channels: - On-State Resistance (Max): 10 Ohm Voltage - Supply, Single (V+): 1.8V Voltage - Supply, Dual (V±): - -3db Bandwidth: 8.5GHz Features: - Operating Temperature: -40°C ~ 105°C (TA) Package / Case: 40-VFBGA Supplier Device Package: 40-VFBGA (4.75x3.25)	パッケージ: 40-VFBGA	在庫6,592
MPC8536AVTAVL	NXP	IC MPU MPC85XX 1.5GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.5GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 (3) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 90°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫10,620
KMPC8360VVAJDGA	NXP	IC MPU MPC83XX 533MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	パッケージ: 740-LBGA	在庫2,816
P5010NSN7MMB	NXP	IC MPU Q OR IQ 2.0GHZ 1295FCBGA Core Processor: PowerPC e5500 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 2.0GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (5), 10 Gbps (1) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5)	パッケージ: 1295-BBGA, FCBGA	在庫6,144
MPC8555EVTAQF	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫4,512
MC9RS08LE4CWL	NXP	IC MCU 8BIT 4KB FLASH 28SOIC Core Processor: RS08 Core Size: 8-Bit Speed: 20MHz Connectivity: SCI Peripherals: LCD, LVD, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC	パッケージ: 28-SOIC (0.295", 7.50mm Width)	在庫53,664
MC68HC908QY1CPE	NXP	IC MCU 8BIT 1.5KB FLASH 16DIP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	パッケージ: 16-DIP (0.300", 7.62mm)	在庫5,008
MCHC11F1VFNE4R	NXP	IC MCU 8BIT ROMLESS 68PLCC Core Processor: HC11 Core Size: 8-Bit Speed: 4MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 30 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25)	パッケージ: 68-LCC (J-Lead)	在庫2,464
S912ZVLA96F0CLC	NXP	IC MCU 16BIT 96KB FLASH 32LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: I2C, IrDA, LIN, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 19 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	パッケージ: 32-LQFP	在庫2,832
KTY83/121,153	NXP	IC TEMPERATURE SENSOR DO-34 Resistance in Ohms @ 25°C: 990 Resistance Tolerance: - Operating Temperature: -55°C ~ 175°C Power - Max: - Mounting Type: Through Hole Package / Case: DO-204AG, DO-34, Axial Supplier Device Package: DO-34	パッケージ: DO-204AG, DO-34, Axial	在庫8,442
MPXV2202GP	NXP	SENSOR GAUGE PRESS 29PSI MAX Pressure Type: Vented Gauge Operating Pressure: 29.01 PSI (200 kPa) Output Type: Wheatstone Bridge Output: 0 mV ~ 40 mV (10V) Accuracy: - Voltage - Supply: 10 V ~ 16 V Port Size: Male - 0.13" (3.17mm) Tube Port Style: Barbed Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-SMD, Gull Wing, Side Port Supplier Device Package: 8-SOP	パッケージ: 8-SMD, Gull Wing, Side Port	在庫43,056
TEF6621T/V1,512	NXP	IC TUNER CAR RADIO 32SO Frequency: - Sensitivity: - Data Rate (Max): - Modulation or Protocol: AM, FM Applications: AM/FM Radio Receiver Current - Receiving: - Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: - Voltage - Supply: 8.5V Operating Temperature: -20°C ~ 85°C Package / Case: 32-SOIC (0.295", 7.50mm Width) Supplier Device Package: 32-SO	パッケージ: 32-SOIC (0.295", 7.50mm Width)	在庫3,294
SPC5746CK1AMKU2	NXP	32 BIT DUAL CORE 3M FLASH 384 Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	パッケージ: 176-LQFP Exposed Pad	在庫2,592
S9S12GN32BVTJ	NXP	16-BIT32K FLASH2K RAM Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	パッケージ: 20-TSSOP (0.173", 4.40mm Width)	在庫4,496
FS32K142HAT0MLFT	NXP	IC MCU 32BIT 256KB FLASH 48LQFP Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 80MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 43 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: -	在庫3,750
MVR5510AMMAHES	NXP	IC PMIC VR5510 QM Applications: - Current - Supply: 15mA Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	パッケージ: -	Request a Quote
MC33665ATF4AER2	NXP	HIGH SPEED TRANSCEIVER WITH CAN Function: Power Management Battery Chemistry: - Number of Cells: 1 Fault Protection: - Interface: CAN, I2C Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	パッケージ: -	Request a Quote
SP5748CBK0AMMJ6R	NXP	IC MCU 32BIT 6MB FLASH 256LBGA Core Processor: e200z2, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz, 160MHz Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI Peripherals: DMA, I2S, LVD/HVD, POR, WDT Number of I/O: 178 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: 128K x 8 RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 4.5V ~ 5.5V Data Converters: A/D 64x10b, 80x12b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-MAPPBGA (17x17)	パッケージ: -	Request a Quote
MC33GD3100A3EK	NXP	IGBT GATE DRIVE IC Driven Configuration: Half-Bridge Channel Type: Single Number of Drivers: 1 Gate Type: IGBT, N-Channel MOSFET Voltage - Supply: 3.3V Logic Voltage - VIL, VIH: - Current - Peak Output (Source, Sink): 15A, 15A Input Type: - High Side Voltage - Max (Bootstrap): - Rise / Fall Time (Typ): - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 32-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 32-SOIC	パッケージ: -	在庫5,823
S9S12ZVL16F0MLFR	NXP	S12Z CPU, 16K FLASH Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote

BUK9Y11-30B/C1,115

NXP

MOSFET N-CH LFPAK

Transistor Type: -
Current - Collector (Ic) (Max): -
Voltage - Collector Emitter Breakdown (Max): -
Vce Saturation (Max) @ Ib, Ic: -
Current - Collector Cutoff (Max): -
DC Current Gain (hFE) (Min) @ Ic, Vce: -
Power - Max: -
Frequency - Transition: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫3,328

MC44BS374T1AEF

NXP

IC AUDIO/VIDEO MODULATOR 16-SOIC

Type: NTSC/PAL Modulator
Applications: Audio/Video, VCR's, Set-Top Boxes
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SOIC

パッケージ: 16-SOIC (0.154", 3.90mm Width)

在庫5,680

MC34703PNB

NXP

IC POWER SUPPLY QUICC 33-QFN

Applications: Power Supplies
Current - Supply: 60mA
Voltage - Supply: 2.8 V ~ 13.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 33-PowerQFN
Supplier Device Package: 33-PQFN (10x10)

パッケージ: 33-PowerQFN

在庫2,544

MC34709VK

NXP

IC PWR MGMT IMX50/53 130MAPBGA

Applications: Processor
Current - Supply: 370µA
Voltage - Supply: 3 V ~ 4.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 130-LFBGA
Supplier Device Package: 130-MAPBGA (8x8)

パッケージ: 130-LFBGA

在庫5,824

PCF8576CT/1,118

NXP

IC LCD DVR UNVRSL LOW-MUX 56VSOP

Display Type: LCD
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: I2C, 2-Wire Serial
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Current - Supply: 120µA
Voltage - Supply: 2 V ~ 6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 56-BSOP (0.435", 11.05mm Width)
Supplier Device Package: 56-VSOP

パッケージ: 56-BSOP (0.435", 11.05mm Width)

在庫3,728

74LVC646ADB,118

NXP

IC TRANSCVR 8BIT N-INV 24SSOP

Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.2 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 24-SSOP

パッケージ: 24-SSOP (0.209", 5.30mm Width)

在庫4,112

74ABT16827ADGG,118

NXP

IC BUFF DVR TRI-ST 20BIT 56TSSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Number of Bits per Element: 10
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 56-TSSOP

パッケージ: 56-TFSOP (0.240", 6.10mm Width)

在庫5,904

PCA9518AD,118

NXP

IC I2C BUS HUB 5-CH 20SOIC

Applications: Buffer
Interface: I2C, SMBus
Voltage - Supply: 3 V ~ 3.6 V
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO
Mounting Type: Surface Mount

パッケージ: 20-SOIC (0.295", 7.50mm Width)

在庫3,776

CBTL08GP053EVAZ

NXP

IC MUX CROSSBAR SW USB VFBGA40

Applications: USB
Multiplexer/Demultiplexer Circuit: -
Switch Circuit: -
Number of Channels: -
On-State Resistance (Max): 10 Ohm
Voltage - Supply, Single (V+): 1.8V
Voltage - Supply, Dual (V±): -
-3db Bandwidth: 8.5GHz
Features: -
Operating Temperature: -40°C ~ 105°C (TA)
Package / Case: 40-VFBGA
Supplier Device Package: 40-VFBGA (4.75x3.25)

パッケージ: 40-VFBGA

在庫6,592

MPC8536AVTAVL

NXP

IC MPU MPC85XX 1.5GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.5GHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 (3)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 90°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫10,620

KMPC8360VVAJDGA

NXP

IC MPU MPC83XX 533MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 533MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

パッケージ: 740-LBGA

在庫2,816

P5010NSN7MMB

NXP

IC MPU Q OR IQ 2.0GHZ 1295FCBGA

Core Processor: PowerPC e5500
Number of Cores/Bus Width: 1 Core, 64-Bit
Speed: 2.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (5), 10 Gbps (1)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 1295-BBGA, FCBGA
Supplier Device Package: 1295-FCPBGA (37.5x37.5)

パッケージ: 1295-BBGA, FCBGA

在庫6,144

MPC8555EVTAQF

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫4,512

MC9RS08LE4CWL

NXP

IC MCU 8BIT 4KB FLASH 28SOIC

Core Processor: RS08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: SCI
Peripherals: LCD, LVD, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SOIC

パッケージ: 28-SOIC (0.295", 7.50mm Width)

在庫53,664

MC68HC908QY1CPE

NXP

IC MCU 8BIT 1.5KB FLASH 16DIP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LVD, POR, PWM
Number of I/O: 13
Program Memory Size: 1.5KB (1.5K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

パッケージ: 16-DIP (0.300", 7.62mm)

在庫5,008

MCHC11F1VFNE4R

NXP

IC MCU 8BIT ROMLESS 68PLCC

Core Processor: HC11
Core Size: 8-Bit
Speed: 4MHz
Connectivity: SCI, SPI
Peripherals: POR, WDT
Number of I/O: 30
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 68-LCC (J-Lead)
Supplier Device Package: 68-PLCC (25x25)

パッケージ: 68-LCC (J-Lead)

在庫2,464

S912ZVLA96F0CLC

NXP

IC MCU 16BIT 96KB FLASH 32LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: I2C, IrDA, LIN, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 19
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
Data Converters: A/D 6x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

パッケージ: 32-LQFP

在庫2,832

KTY83/121,153

NXP

IC TEMPERATURE SENSOR DO-34

Resistance in Ohms @ 25°C: 990
Resistance Tolerance: -
Operating Temperature: -55°C ~ 175°C
Power - Max: -
Mounting Type: Through Hole
Package / Case: DO-204AG, DO-34, Axial
Supplier Device Package: DO-34

パッケージ: DO-204AG, DO-34, Axial

在庫8,442

MPXV2202GP

NXP

SENSOR GAUGE PRESS 29PSI MAX

Pressure Type: Vented Gauge
Operating Pressure: 29.01 PSI (200 kPa)
Output Type: Wheatstone Bridge
Output: 0 mV ~ 40 mV (10V)
Accuracy: -
Voltage - Supply: 10 V ~ 16 V
Port Size: Male - 0.13" (3.17mm) Tube
Port Style: Barbed
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 58.02 PSI (400 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 8-SMD, Gull Wing, Side Port
Supplier Device Package: 8-SOP

パッケージ: 8-SMD, Gull Wing, Side Port

在庫43,056

TEF6621T/V1,512

NXP

IC TUNER CAR RADIO 32SO

Frequency: -
Sensitivity: -
Data Rate (Max): -
Modulation or Protocol: AM, FM
Applications: AM/FM Radio Receiver
Current - Receiving: -
Data Interface: PCB, Surface Mount
Memory Size: -
Antenna Connector: PCB, Surface Mount
Features: -
Voltage - Supply: 8.5V
Operating Temperature: -20°C ~ 85°C
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 32-SO

パッケージ: 32-SOIC (0.295", 7.50mm Width)

在庫3,294

SPC5746CK1AMKU2

NXP

32 BIT DUAL CORE 3M FLASH 384

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 129
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

パッケージ: 176-LQFP Exposed Pad

在庫2,592

S9S12GN32BVTJ

NXP

16-BIT32K FLASH2K RAM

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 14
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

パッケージ: 20-TSSOP (0.173", 4.40mm Width)

在庫4,496

FS32K142HAT0MLFT

NXP

IC MCU 32BIT 256KB FLASH 48LQFP

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit Single-Core
Speed: 80MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 43
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 16x12b SAR; D/A1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: -

在庫3,750

MVR5510AMMAHES

NXP

IC PMIC VR5510 QM

Applications: -
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

パッケージ: -

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MC33665ATF4AER2

NXP

HIGH SPEED TRANSCEIVER WITH CAN

Function: Power Management
Battery Chemistry: -
Number of Cells: 1
Fault Protection: -
Interface: CAN, I2C
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

パッケージ: -

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SP5748CBK0AMMJ6R

NXP

IC MCU 32BIT 6MB FLASH 256LBGA

Core Processor: e200z2, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz, 160MHz
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD/HVD, POR, WDT
Number of I/O: 178
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: 128K x 8
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 4.5V ~ 5.5V
Data Converters: A/D 64x10b, 80x12b SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPPBGA (17x17)

パッケージ: -

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MC33GD3100A3EK

NXP

IGBT GATE DRIVE IC

Driven Configuration: Half-Bridge
Channel Type: Single
Number of Drivers: 1
Gate Type: IGBT, N-Channel MOSFET
Voltage - Supply: 3.3V
Logic Voltage - VIL, VIH: -
Current - Peak Output (Source, Sink): 15A, 15A
Input Type: -
High Side Voltage - Max (Bootstrap): -
Rise / Fall Time (Typ): -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Supplier Device Package: 32-SOIC

パッケージ: -

在庫5,823

S9S12ZVL16F0MLFR

NXP

S12Z CPU, 16K FLASH

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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