ページ 786 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
PSMN005-25D,118	NXP	MOSFET N-CH 25V 75A DPAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 25V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs(th) (Max) @ Id: 2V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 60nC @ 5V Input Capacitance (Ciss) (Max) @ Vds: 3500pF @ 20V Vgs (Max): ±15V FET Feature: - Power Dissipation (Max): 125W (Tc) Rds On (Max) @ Id, Vgs: 5.8 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: DPAK Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63	パッケージ: TO-252-3, DPak (2 Leads + Tab), SC-63	在庫5,024
BUK652R1-30C,127	NXP	MOSFET N-CH 30V 120A TO220AB FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 2.8V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 168nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 10918pF @ 25V Vgs (Max): ±16V FET Feature: - Power Dissipation (Max): 263W (Tc) Rds On (Max) @ Id, Vgs: 2.4 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220AB Package / Case: TO-220-3	パッケージ: TO-220-3	在庫5,504
MRF8S19260HR6	NXP	FET RF 2CH 65V 1.99GHZ NI1230-8 Transistor Type: LDMOS (Dual) Frequency: 1.99GHz Gain: 18.2dB Voltage - Test: 30V Current Rating: - Noise Figure: - Current - Test: 1.6A Power - Output: 74W Voltage - Rated: 65V Package / Case: SOT-1110A Supplier Device Package: NI1230-8	パッケージ: SOT-1110A	在庫7,472
PDTC123JK,115	NXP	TRANS PREBIAS NPN 250MW SMT3 Transistor Type: NPN - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 2.2k Resistor - Emitter Base (R2) (Ohms): 47k DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: - Power - Max: 250mW Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫6,400
BZX284-C5V1,115	NXP	DIODE ZENER 5.1V 400MW SOD2 Voltage - Zener (Nom) (Vz): 5.1V Tolerance: ±5% Power - Max: 400mW Impedance (Max) (Zzt): 60 Ohms Current - Reverse Leakage @ Vr: 2µA @ 2V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SOD-110 Supplier Device Package: SOD110	パッケージ: SOD-110	在庫3,168
LD6805K/20H,115	NXP	IC REG LIN 2V 150MA DFN1010C-4 Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 2V Voltage - Output (Max): - Voltage Dropout (Max): 0.25V @ 150mA Current - Output: 150mA Current - Quiescent (Iq): - Current - Supply (Max): 35µA ~ 150µA PSRR: 75dB (1kHz) Control Features: Enable Protection Features: Over Current, Transient Voltage Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-UDFN Exposed Pad Supplier Device Package: DFN1010C-4	パッケージ: 4-UDFN Exposed Pad	在庫4,480
MCZ33927EK	NXP	IC FET PRE-DRIVER 3PH 54-SOIC Motor Type - Stepper: - Motor Type - AC, DC: - Function: Controller - Commutation, Direction Management Output Configuration: Pre-Driver - Half Bridge (3) Interface: SPI Technology: Power MOSFET Step Resolution: - Applications: - Current - Output: - Voltage - Supply: 8 V ~ 40 V Voltage - Load: - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP	パッケージ: 54-SSOP (0.295", 7.50mm Width) Exposed Pad	在庫6,960
N74F27D,602	NXP	IC GATE NOR 3CH 3-INP 14-SO Logic Type: NOR Gate Number of Circuits: 3 Number of Inputs: 3 Features: - Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Max): - Current - Output High, Low: 1mA, 20mA Logic Level - Low: 0.8V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Supplier Device Package: 14-SO Package / Case: 14-SOIC (0.154", 3.90mm Width)	パッケージ: 14-SOIC (0.154", 3.90mm Width)	在庫5,456
SA5232D/01,112	NXP	IC OPAMP GP 2.5MHZ RRO 8SO Amplifier Type: General Purpose Number of Circuits: 2 Output Type: Rail-to-Rail Slew Rate: 0.8 V/µs Gain Bandwidth Product: - -3db Bandwidth: 2.5MHz Current - Input Bias: 90nA Voltage - Input Offset: 200µV Current - Supply: 1.4mA Current - Output / Channel: 12mA Voltage - Supply, Single/Dual (±): 2 V ~ 5.5 V, ±1 V ~ 2.75 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	パッケージ: 8-SOIC (0.154", 3.90mm Width)	在庫4,240
TDA8025HN/C1,518	NXP	IC SMART CARD INTERFACE 32-HVQFN Applications: - Interface: Analog Voltage - Supply: 1.2V, 1.8V, 3V Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5) Mounting Type: Surface Mount	パッケージ: 32-VFQFN Exposed Pad	在庫4,368
MPC8548PXATGB	NXP	IC MPU MPC85XX 1.2GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫3,040
MPC8544EAVTALF	NXP	IC MPU MPC85XX 667MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫4,368
MCF5474ZP266	NXP	IC MCU 32BIT ROMLESS 388PBGA Core Processor: Coldfire V4E Core Size: 32-Bit Speed: 266MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Number of I/O: 99 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 388-BBGA Supplier Device Package: 388-PBGA (27x27)	パッケージ: 388-BBGA	在庫16,068
S9KEAZN8AMFK	NXP	IC MCU 32BIT 8KB FLASH 24QFN Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 22 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-QFN (4x4)	パッケージ: 24-VFQFN Exposed Pad	在庫32,076
MSC8122VT8000	NXP	IC DSP QUAD 16B 500MHZ 431FCBGA Type: SC140 Core Interface: DSI, Ethernet, RS-232 Clock Rate: 500MHz Non-Volatile Memory: External On-Chip RAM: 1.436MB Voltage - I/O: 3.30V Voltage - Core: 1.20V Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 431-BFBGA, FCBGA Supplier Device Package: 431-FCPBGA (20x20)	パッケージ: 431-BFBGA, FCBGA	在庫3,856
TDA8787AHL/C3,157	NXP	IC INTERFACE ANLG-DGTL 48-LQFP Type: CCD (Charged Coupled Device) Number of Channels: - Resolution (Bits): 10 b Sampling Rate (Per Second): 18M Data Interface: Parallel Voltage Supply Source: Analog and Digital Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -20°C ~ 75°C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP	在庫5,840
MMA6829AKWR2	NXP	ACCELEROMETER 10BIT SPI 16QFN Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫7,308
MMA7330LT	NXP	ACCELEROMETER 4-12G ANALOG 14LGA Type: Analog Axis: X, Y, Z Acceleration Range: ±4g, 12g Sensitivity (LSB/g): - Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g) Bandwidth: 400Hz (X,Y), 300Hz (Z) Output Type: Analog Voltage Voltage - Supply: 2.2 V ~ 3.6 V Features: Selectable Scale, Sleep Mode Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 14-VFLGA Supplier Device Package: 14-LGA (3x5)	パッケージ: 14-VFLGA	在庫4,680
MC33FS6500LAER2	NXP	SYSTEM BASIS CHIP DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP Exposed Pad	在庫3,936
SPC5675KFAVMS2R	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z7d Core Size: 32-Bit Dual-Core Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V Data Converters: A/D 34x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19x19)	パッケージ: 473-LFBGA	在庫7,120
SPC5646BCK0VLU1	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z4d Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 147 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 27x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	パッケージ: 176-LQFP	在庫3,568
S912XEG128W1MALR	NXP	16-BIT MCU S12X CORE 128KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	パッケージ: 112-LQFP	在庫6,624
MGD3100BM58EK	NXP	GATE DRIVERS GATE DRIVER, HV ISO Driven Configuration: Half-Bridge Channel Type: Single Number of Drivers: 1 Gate Type: IGBT, N-Channel MOSFET Voltage - Supply: 5V Logic Voltage - VIL, VIH: - Current - Peak Output (Source, Sink): 15A, 15A Input Type: - High Side Voltage - Max (Bootstrap): - Rise / Fall Time (Typ): - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 32-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 32-SOIC	パッケージ: -	Request a Quote
MC56F81646VLF	NXP	IC DSC 64KB/12KB LQPF48 Type: - Interface: I2C, SCI, SPI Clock Rate: 100MHz Non-Volatile Memory: FLASH (64kB) On-Chip RAM: 12kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: -	Request a Quote
FS32V234BMN2VUB	NXP	IC MPU FS32V23 800MHZ 621FCPBGA Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 800MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Ethernet: GbE SATA: - USB: - Voltage - I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17x17)	パッケージ: -	Request a Quote
TDF8532HH-N2-S710Y	NXP	IC AMPLIFIER CLASS D 100HLQFP Type: Class D Output Type: 4-Channel (Quad) Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm Voltage - Supply: 5.5V ~ 25V Features: - Mounting Type: Surface Mount Operating Temperature: - Supplier Device Package: 100-HLQFP (14x14) Package / Case: 100-FQFP Exposed Pad	パッケージ: -	Request a Quote
MVR5510AMDA6ES	NXP	IC PMIC VR5510 ASIL-D Applications: - Current - Supply: 15mA Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	パッケージ: -	Request a Quote
MFS2611AMBA0AD	NXP	AUTO SBC Applications: - Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	パッケージ: -	Request a Quote

PSMN005-25D,118

NXP

MOSFET N-CH 25V 75A DPAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 25V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs(th) (Max) @ Id: 2V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 60nC @ 5V
Input Capacitance (Ciss) (Max) @ Vds: 3500pF @ 20V
Vgs (Max): ±15V
FET Feature: -
Power Dissipation (Max): 125W (Tc)
Rds On (Max) @ Id, Vgs: 5.8 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: DPAK
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63

パッケージ: TO-252-3, DPak (2 Leads + Tab), SC-63

在庫5,024

BUK652R1-30C,127

NXP

MOSFET N-CH 30V 120A TO220AB

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 168nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds: 10918pF @ 25V
Vgs (Max): ±16V
FET Feature: -
Power Dissipation (Max): 263W (Tc)
Rds On (Max) @ Id, Vgs: 2.4 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Supplier Device Package: TO-220AB
Package / Case: TO-220-3

パッケージ: TO-220-3

在庫5,504

MRF8S19260HR6

NXP

FET RF 2CH 65V 1.99GHZ NI1230-8

Transistor Type: LDMOS (Dual)
Frequency: 1.99GHz
Gain: 18.2dB
Voltage - Test: 30V
Current Rating: -
Noise Figure: -
Current - Test: 1.6A
Power - Output: 74W
Voltage - Rated: 65V
Package / Case: SOT-1110A
Supplier Device Package: NI1230-8

パッケージ: SOT-1110A

在庫7,472

PDTC123JK,115

NXP

TRANS PREBIAS NPN 250MW SMT3

Transistor Type: NPN - Pre-Biased
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 2.2k
Resistor - Emitter Base (R2) (Ohms): 47k
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
Frequency - Transition: -
Power - Max: 250mW
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫6,400

BZX284-C5V1,115

NXP

DIODE ZENER 5.1V 400MW SOD2

Voltage - Zener (Nom) (Vz): 5.1V
Tolerance: ±5%
Power - Max: 400mW
Impedance (Max) (Zzt): 60 Ohms
Current - Reverse Leakage @ Vr: 2µA @ 2V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-110
Supplier Device Package: SOD110

パッケージ: SOD-110

在庫3,168

LD6805K/20H,115

NXP

IC REG LIN 2V 150MA DFN1010C-4

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 2V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.25V @ 150mA
Current - Output: 150mA
Current - Quiescent (Iq): -
Current - Supply (Max): 35µA ~ 150µA
PSRR: 75dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Transient Voltage
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 4-UDFN Exposed Pad
Supplier Device Package: DFN1010C-4

パッケージ: 4-UDFN Exposed Pad

在庫4,480

MCZ33927EK

NXP

IC FET PRE-DRIVER 3PH 54-SOIC

Motor Type - Stepper: -
Motor Type - AC, DC: -
Function: Controller - Commutation, Direction Management
Output Configuration: Pre-Driver - Half Bridge (3)
Interface: SPI
Technology: Power MOSFET
Step Resolution: -
Applications: -
Current - Output: -
Voltage - Supply: 8 V ~ 40 V
Voltage - Load: -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-SOICW-EP

パッケージ: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

在庫6,960

N74F27D,602

NXP

IC GATE NOR 3CH 3-INP 14-SO

Logic Type: NOR Gate
Number of Circuits: 3
Number of Inputs: 3
Features: -
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Max): -
Current - Output High, Low: 1mA, 20mA
Logic Level - Low: 0.8V
Logic Level - High: 2V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Supplier Device Package: 14-SO
Package / Case: 14-SOIC (0.154", 3.90mm Width)

パッケージ: 14-SOIC (0.154", 3.90mm Width)

在庫5,456

SA5232D/01,112

NXP

IC OPAMP GP 2.5MHZ RRO 8SO

Amplifier Type: General Purpose
Number of Circuits: 2
Output Type: Rail-to-Rail
Slew Rate: 0.8 V/µs
Gain Bandwidth Product: -
-3db Bandwidth: 2.5MHz
Current - Input Bias: 90nA
Voltage - Input Offset: 200µV
Current - Supply: 1.4mA
Current - Output / Channel: 12mA
Voltage - Supply, Single/Dual (±): 2 V ~ 5.5 V, ±1 V ~ 2.75 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

パッケージ: 8-SOIC (0.154", 3.90mm Width)

在庫4,240

TDA8025HN/C1,518

NXP

IC SMART CARD INTERFACE 32-HVQFN

Applications: -
Interface: Analog
Voltage - Supply: 1.2V, 1.8V, 3V
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)
Mounting Type: Surface Mount

パッケージ: 32-VFQFN Exposed Pad

在庫4,368

MPC8548PXATGB

NXP

IC MPU MPC85XX 1.2GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫3,040

MPC8544EAVTALF

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫4,368

MCF5474ZP266

NXP

IC MCU 32BIT ROMLESS 388PBGA

Core Processor: Coldfire V4E
Core Size: 32-Bit
Speed: 266MHz
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Number of I/O: 99
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 388-BBGA
Supplier Device Package: 388-PBGA (27x27)

パッケージ: 388-BBGA

在庫16,068

S9KEAZN8AMFK

NXP

IC MCU 32BIT 8KB FLASH 24QFN

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, LIN, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 22
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-QFN (4x4)

パッケージ: 24-VFQFN Exposed Pad

在庫32,076

MSC8122VT8000

NXP

IC DSP QUAD 16B 500MHZ 431FCBGA

Type: SC140 Core
Interface: DSI, Ethernet, RS-232
Clock Rate: 500MHz
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Operating Temperature: 0°C ~ 90°C (TJ)
Mounting Type: Surface Mount
Package / Case: 431-BFBGA, FCBGA
Supplier Device Package: 431-FCPBGA (20x20)

パッケージ: 431-BFBGA, FCBGA

在庫3,856

TDA8787AHL/C3,157

NXP

IC INTERFACE ANLG-DGTL 48-LQFP

Type: CCD (Charged Coupled Device)
Number of Channels: -
Resolution (Bits): 10 b
Sampling Rate (Per Second): 18M
Data Interface: Parallel
Voltage Supply Source: Analog and Digital
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -20°C ~ 75°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP

在庫5,840

MMA6829AKWR2

NXP

ACCELEROMETER 10BIT SPI 16QFN

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫7,308

MMA7330LT

NXP

ACCELEROMETER 4-12G ANALOG 14LGA

Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 12g
Sensitivity (LSB/g): -
Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g)
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Output Type: Analog Voltage
Voltage - Supply: 2.2 V ~ 3.6 V
Features: Selectable Scale, Sleep Mode
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 14-VFLGA
Supplier Device Package: 14-LGA (3x5)

パッケージ: 14-VFLGA

在庫4,680

MC33FS6500LAER2

NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP Exposed Pad

在庫3,936

SPC5675KFAVMS2R

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z7d
Core Size: 32-Bit Dual-Core
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
Data Converters: A/D 34x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 473-LFBGA
Supplier Device Package: 473-MAPBGA (19x19)

パッケージ: 473-LFBGA

在庫7,120

SPC5646BCK0VLU1

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z4d
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 147
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 27x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

パッケージ: 176-LQFP

在庫3,568

S912XEG128W1MALR

NXP

16-BIT MCU S12X CORE 128KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

パッケージ: 112-LQFP

在庫6,624

MGD3100BM58EK

NXP

GATE DRIVERS GATE DRIVER, HV ISO

Driven Configuration: Half-Bridge
Channel Type: Single
Number of Drivers: 1
Gate Type: IGBT, N-Channel MOSFET
Voltage - Supply: 5V
Logic Voltage - VIL, VIH: -
Current - Peak Output (Source, Sink): 15A, 15A
Input Type: -
High Side Voltage - Max (Bootstrap): -
Rise / Fall Time (Typ): -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Supplier Device Package: 32-SOIC

パッケージ: -

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MC56F81646VLF

NXP

IC DSC 64KB/12KB LQPF48

Type: -
Interface: I2C, SCI, SPI
Clock Rate: 100MHz
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: -

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FS32V234BMN2VUB

NXP

IC MPU FS32V23 800MHZ 621FCPBGA

Core Processor: ARM® Cortex®-A53
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Speed: 800MHz
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet: GbE
SATA: -
USB: -
Voltage - I/O: 1V, 1.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Package / Case: 621-FBGA, FCBGA
Supplier Device Package: 621-FCPBGA (17x17)

パッケージ: -

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TDF8532HH-N2-S710Y

NXP

IC AMPLIFIER CLASS D 100HLQFP

Type: Class D
Output Type: 4-Channel (Quad)
Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm
Voltage - Supply: 5.5V ~ 25V
Features: -
Mounting Type: Surface Mount
Operating Temperature: -
Supplier Device Package: 100-HLQFP (14x14)
Package / Case: 100-FQFP Exposed Pad

パッケージ: -

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MVR5510AMDA6ES

NXP

IC PMIC VR5510 ASIL-D

Applications: -
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

パッケージ: -

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MFS2611AMBA0AD

NXP

AUTO SBC

Applications: -
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

パッケージ: -

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