ページ 81 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
MRFE6S9160HSR5	NXP	FET RF 66V 880MHZ NI-780S Transistor Type: LDMOS Frequency: 880MHz Gain: 21dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.2A Power - Output: 35W Voltage - Rated: 66V Package / Case: NI-780S Supplier Device Package: NI-780S	パッケージ: NI-780S	在庫3,056
MPC18730EP	NXP	IC PMIC PROGR 5-OUTPUTS 64-QFN Applications: Handheld/Mobile Devices Current - Supply: 9mA Voltage - Supply: 0.9 V ~ 4.2 V Operating Temperature: -10°C ~ 65°C Mounting Type: Surface Mount Package / Case: 64-WFQFN Supplier Device Package: 64-QFN (9x9)	パッケージ: 64-WFQFN	在庫4,320
GTL2005PW,112	NXP	IC XLATR QUAD BI-DIREC 14-TSSOP Translator Type: Mixed Signal Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 4 Voltage - VCCA: - Voltage - VCCB: - Input Signal: GTL Output Signal: LVTTL, TTL Output Type: Non-Inverted Data Rate: - Operating Temperature: -40°C ~ 85°C (TA) Features: - Mounting Type: Surface Mount Package / Case: 14-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 14-TSSOP	パッケージ: 14-TSSOP (0.173", 4.40mm Width)	在庫6,160
SSTV16859EC,518	NXP	IC BUFFER DDR 13BIT 96-LFBGA Logic Type: Registered Buffer with SSTL_2 Compatible I/O for DDR Supply Voltage: 2.3 V ~ 2.7 V Number of Bits: 13, 26 Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 96-LFBGA Supplier Device Package: 96-LFBGA (13.5x5.5)	パッケージ: 96-LFBGA	在庫3,360
N74F166D,602	NXP	IC SHIFT REGISTER 8BIT 16-SOIC Logic Type: Register, Bidirectional Output Type: Push-Pull Number of Elements: 1 Number of Bits per Element: 8 Function: Universal Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	パッケージ: 16-SOIC (0.154", 3.90mm Width)	在庫3,840
HEF4081BT/AUJ	NXP	IC GATE AND 4CH 2-INP 14-SO Logic Type: AND Gate Number of Circuits: 4 Number of Inputs: 2 Features: - Voltage - Supply: 3 V ~ 15 V Current - Quiescent (Max): 1µA Current - Output High, Low: 3.4mA, 3.4mA Logic Level - Low: 1.5 V ~ 4 V Logic Level - High: 3.5 V ~ 11 V Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Supplier Device Package: 14-SO Package / Case: 14-SOIC (0.154", 3.90mm Width)	パッケージ: 14-SOIC (0.154", 3.90mm Width)	在庫2,096
74LVTN16245BBQ,518	NXP	TXRX 16BIT 3.3V 3ST 60HXQFN Logic Type: Transceiver, Non-Inverting Number of Elements: 2 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 60-XFQFN Dual Rows, Exposed Pad Supplier Device Package: 60-HXQFN (4x6)	パッケージ: 60-XFQFN Dual Rows, Exposed Pad	在庫3,872
BGD816L,112	NXP	IC AMP GAIN PWR 860MHZ SOT115J Applications: CATV Output Type: - Number of Circuits: 1 -3db Bandwidth: - Slew Rate: - Current - Supply: 360mA Current - Output / Channel: - Voltage - Supply, Single/Dual (±): - Mounting Type: - Package / Case: SOT-115J Supplier Device Package: SOT115J	パッケージ: SOT-115J	在庫7,792
TDA8922BJ/N2,112	NXP	IC AMP AUDIO PWR 88W STER 23SIL Type: Class D Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Max Output Power x Channels @ Load: 88W x 1 @ 6 Ohm; 50W x 2 @ 6 Ohm Voltage - Supply: ±12.5 V ~ 30 V Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Through Hole Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: DBS23P Package / Case: 23-SIP Formed Leads	パッケージ: 23-SIP Formed Leads	在庫5,616
SC28L91A1A,512	NXP	IC UART SINGLE W/FIFO 44-PLCC Features: Configurable GPIO, Internal Oscillator, Timer/Counter Number of Channels: 1, UART FIFO's: 16 Byte Protocol: - Data Rate (Max): 1Mbps Voltage - Supply: 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: - With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	パッケージ: 44-LCC (J-Lead)	在庫4,080
UJA1168TK/FDJ	NXP	IC SBC CAN MINI HS 14HVSON Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Full Receiver Hysteresis: 200mV Data Rate: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 14-VDFN Exposed Pad Supplier Device Package: 14-HVSON (3x4.5)	パッケージ: 14-VDFN Exposed Pad	在庫4,896
KMPC8360EVVAHFH	NXP	IC MPU MPC83XX 500MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 500MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	パッケージ: 740-LBGA	在庫3,120
MCIMX503CVM8B	NXP	IC MPU I.MX50 800MHZ 400MAPBGA Core Processor: ARM? Cortex?-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Secure JTAG Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17x17)	パッケージ: 400-LFBGA	在庫2,080
MCF52210CEP66	NXP	IC MCU 32BIT 64KB FLASH 64QFN Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 66MHz Connectivity: I2C, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 43 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-VFQFN Exposed Pad Supplier Device Package: 64-QFN Exposed Pad (9x9)	パッケージ: 64-VFQFN Exposed Pad	在庫4,528
MC9S12GC16MFUE	NXP	IC MCU 16BIT 16KB FLASH 80QFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 60 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	パッケージ: 80-QFP	在庫3,504
LPC4088FBD144,551	NXP	IC MCU 32BIT 512KB FLASH 144LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 120MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4032 x 8 RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 8x12b, D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫7,888
MC56F84553VLH	NXP	IC MCU 32BIT 96KB FLASH 64LQFP Core Processor: 56800EX Core Size: 32-Bit Speed: 80MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 16x12b, 8x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫6,944
LPC11E36FHN33/501E	NXP	IC MCU 32BIT 96KB FLASH 33HVQFN Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 28 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-VQFN Exposed Pad Supplier Device Package: -	パッケージ: 32-VQFN Exposed Pad	在庫5,536
MFRC63002HN,157	NXP	IC CONTACTLESS READER 32HVQFN Type: RFID Reader Frequency: 13.56MHz Standards: ISO 14443, MIFARE Interface: I2C, SPI, UART Voltage - Supply: 3 V ~ 5.5 V Operating Temperature: -25°C ~ 85°C Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	パッケージ: 32-VFQFN Exposed Pad	在庫6,336
MW4IC915GNBR1	NXP	IC PWR AMP RF 26V 15W TO272-16GW Frequency: 750MHz ~ 1GHz P1dB: - Gain: 30dB Noise Figure: - RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA Voltage - Supply: 26V Current - Supply: 60mA Test Frequency: - Package / Case: TO-272-16 Variant, Gull Wing Supplier Device Package: TO-272 WB-16 GULL	パッケージ: TO-272-16 Variant, Gull Wing	在庫8,820
BGA2011,115	NXP	MMIC AMPLIFIER 900MHZ 6TSSOP Frequency: 900MHz P1dB: 10dBm (10mW) Gain: 19dB Noise Figure: 1.5dB RF Type: CDMA, DECT, PHS Voltage - Supply: 4.5V Current - Supply: 10mA ~ 20mA Test Frequency: 900MHz Package / Case: 6-TSSOP, SC-88, SOT-363 Supplier Device Package: 6-TSSOP	パッケージ: 6-TSSOP, SC-88, SOT-363	在庫5,130
MC32PF3000A8EP	NXP	POWER MANAGEMENT IC I.MX7 PRE- Applications: i.MX Processors Current - Supply: - Voltage - Supply: 2.8 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	パッケージ: 48-VFQFN Exposed Pad	在庫5,056
T1042NSN7WQB	NXP	QORIQ 4X E5500 1500MHZ DDR3L/ Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫3,664
MIMX8MD6DVAJZAB	NXP	I.MX 8MDUAL 17X17 NO LID 621FBGA Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.3GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Ethernet: GbE SATA: - USB: USB 3.0 (2) Voltage - I/O: - Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17x17)	パッケージ: 621-FBGA, FCBGA	在庫4,848
MKE14F512VLL16R	NXP	KINETIS KE14F: 160MHZ CORTEX-M4F Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫7,200
S912ZVML32F3MKHR	NXP	MAGNIV 16-BIT MCU S12Z CORE 32 Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 31 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP-EP (10x10)	パッケージ: 64-LQFP Exposed Pad	在庫6,880
S9S08RN16W2VTJ	NXP	S08 8-BIT MCU 16KB FLASH 20MHZ Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	パッケージ: 20-TSSOP (0.173", 4.40mm Width)	在庫6,544
S9S08RNA8W2VTG	NXP	8-BIT MCU S08 CORE 8KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	パッケージ: 16-TSSOP (0.173", 4.40mm Width)	在庫5,264

MRFE6S9160HSR5

NXP

FET RF 66V 880MHZ NI-780S

Transistor Type: LDMOS
Frequency: 880MHz
Gain: 21dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.2A
Power - Output: 35W
Voltage - Rated: 66V
Package / Case: NI-780S
Supplier Device Package: NI-780S

パッケージ: NI-780S

在庫3,056

MPC18730EP

NXP

IC PMIC PROGR 5-OUTPUTS 64-QFN

Applications: Handheld/Mobile Devices
Current - Supply: 9mA
Voltage - Supply: 0.9 V ~ 4.2 V
Operating Temperature: -10°C ~ 65°C
Mounting Type: Surface Mount
Package / Case: 64-WFQFN
Supplier Device Package: 64-QFN (9x9)

パッケージ: 64-WFQFN

在庫4,320

GTL2005PW,112

NXP

IC XLATR QUAD BI-DIREC 14-TSSOP

Translator Type: Mixed Signal
Channel Type: Bidirectional
Number of Circuits: 1
Channels per Circuit: 4
Voltage - VCCA: -
Voltage - VCCB: -
Input Signal: GTL
Output Signal: LVTTL, TTL
Output Type: Non-Inverted
Data Rate: -
Operating Temperature: -40°C ~ 85°C (TA)
Features: -
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 14-TSSOP

パッケージ: 14-TSSOP (0.173", 4.40mm Width)

在庫6,160

SSTV16859EC,518

NXP

IC BUFFER DDR 13BIT 96-LFBGA

Logic Type: Registered Buffer with SSTL_2 Compatible I/O for DDR
Supply Voltage: 2.3 V ~ 2.7 V
Number of Bits: 13, 26
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 96-LFBGA
Supplier Device Package: 96-LFBGA (13.5x5.5)

パッケージ: 96-LFBGA

在庫3,360

N74F166D,602

NXP

IC SHIFT REGISTER 8BIT 16-SOIC

Logic Type: Register, Bidirectional
Output Type: Push-Pull
Number of Elements: 1
Number of Bits per Element: 8
Function: Universal
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

パッケージ: 16-SOIC (0.154", 3.90mm Width)

在庫3,840

HEF4081BT/AUJ

NXP

IC GATE AND 4CH 2-INP 14-SO

Logic Type: AND Gate
Number of Circuits: 4
Number of Inputs: 2
Features: -
Voltage - Supply: 3 V ~ 15 V
Current - Quiescent (Max): 1µA
Current - Output High, Low: 3.4mA, 3.4mA
Logic Level - Low: 1.5 V ~ 4 V
Logic Level - High: 3.5 V ~ 11 V
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Supplier Device Package: 14-SO
Package / Case: 14-SOIC (0.154", 3.90mm Width)

パッケージ: 14-SOIC (0.154", 3.90mm Width)

在庫2,096

74LVTN16245BBQ,518

NXP

TXRX 16BIT 3.3V 3ST 60HXQFN

Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Supplier Device Package: 60-HXQFN (4x6)

パッケージ: 60-XFQFN Dual Rows, Exposed Pad

在庫3,872

BGD816L,112

NXP

IC AMP GAIN PWR 860MHZ SOT115J

Applications: CATV
Output Type: -
Number of Circuits: 1
-3db Bandwidth: -
Slew Rate: -
Current - Supply: 360mA
Current - Output / Channel: -
Voltage - Supply, Single/Dual (±): -
Mounting Type: -
Package / Case: SOT-115J
Supplier Device Package: SOT115J

パッケージ: SOT-115J

在庫7,792

TDA8922BJ/N2,112

NXP

IC AMP AUDIO PWR 88W STER 23SIL

Type: Class D
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Max Output Power x Channels @ Load: 88W x 1 @ 6 Ohm; 50W x 2 @ 6 Ohm
Voltage - Supply: ±12.5 V ~ 30 V
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: DBS23P
Package / Case: 23-SIP Formed Leads

パッケージ: 23-SIP Formed Leads

在庫5,616

SC28L91A1A,512

NXP

IC UART SINGLE W/FIFO 44-PLCC

Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Number of Channels: 1, UART
FIFO's: 16 Byte
Protocol: -
Data Rate (Max): 1Mbps
Voltage - Supply: 3.3V, 5V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: -
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

パッケージ: 44-LCC (J-Lead)

在庫4,080

UJA1168TK/FDJ

NXP

IC SBC CAN MINI HS 14HVSON

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Full
Receiver Hysteresis: 200mV
Data Rate: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 14-VDFN Exposed Pad
Supplier Device Package: 14-HVSON (3x4.5)

パッケージ: 14-VDFN Exposed Pad

在庫4,896

KMPC8360EVVAHFH

NXP

IC MPU MPC83XX 500MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 500MHz
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

パッケージ: 740-LBGA

在庫3,120

MCIMX503CVM8B

NXP

IC MPU I.MX50 800MHZ 400MAPBGA

Core Processor: ARM? Cortex?-A8
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR, LPDDR2, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: LCD
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: Boot Security, Cryptography, Secure JTAG
Package / Case: 400-LFBGA
Supplier Device Package: 400-MAPBGA (17x17)

パッケージ: 400-LFBGA

在庫2,080

MCF52210CEP66

NXP

IC MCU 32BIT 64KB FLASH 64QFN

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 66MHz
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 43
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-VFQFN Exposed Pad
Supplier Device Package: 64-QFN Exposed Pad (9x9)

パッケージ: 64-VFQFN Exposed Pad

在庫4,528

MC9S12GC16MFUE

NXP

IC MCU 16BIT 16KB FLASH 80QFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 60
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

パッケージ: 80-QFP

在庫3,504

LPC4088FBD144,551

NXP

IC MCU 32BIT 512KB FLASH 144LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4032 x 8
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
Data Converters: A/D 8x12b, D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫7,888

MC56F84553VLH

NXP

IC MCU 32BIT 96KB FLASH 64LQFP

Core Processor: 56800EX
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 16x12b, 8x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫6,944

LPC11E36FHN33/501E

NXP

IC MCU 32BIT 96KB FLASH 33HVQFN

Core Processor: ARM? Cortex?-M0
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 28
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-VQFN Exposed Pad
Supplier Device Package: -

パッケージ: 32-VQFN Exposed Pad

在庫5,536

MFRC63002HN,157

NXP

IC CONTACTLESS READER 32HVQFN

Type: RFID Reader
Frequency: 13.56MHz
Standards: ISO 14443, MIFARE
Interface: I2C, SPI, UART
Voltage - Supply: 3 V ~ 5.5 V
Operating Temperature: -25°C ~ 85°C
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

パッケージ: 32-VFQFN Exposed Pad

在庫6,336

MW4IC915GNBR1

NXP

IC PWR AMP RF 26V 15W TO272-16GW

Frequency: 750MHz ~ 1GHz
P1dB: -
Gain: 30dB
Noise Figure: -
RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
Voltage - Supply: 26V
Current - Supply: 60mA
Test Frequency: -
Package / Case: TO-272-16 Variant, Gull Wing
Supplier Device Package: TO-272 WB-16 GULL

パッケージ: TO-272-16 Variant, Gull Wing

在庫8,820

BGA2011,115

NXP

MMIC AMPLIFIER 900MHZ 6TSSOP

Frequency: 900MHz
P1dB: 10dBm (10mW)
Gain: 19dB
Noise Figure: 1.5dB
RF Type: CDMA, DECT, PHS
Voltage - Supply: 4.5V
Current - Supply: 10mA ~ 20mA
Test Frequency: 900MHz
Package / Case: 6-TSSOP, SC-88, SOT-363
Supplier Device Package: 6-TSSOP

パッケージ: 6-TSSOP, SC-88, SOT-363

在庫5,130

MC32PF3000A8EP

NXP

POWER MANAGEMENT IC I.MX7 PRE-

Applications: i.MX Processors
Current - Supply: -
Voltage - Supply: 2.8 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

パッケージ: 48-VFQFN Exposed Pad

在庫5,056

T1042NSN7WQB

NXP

QORIQ 4X E5500 1500MHZ DDR3L/

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫3,664

MIMX8MD6DVAJZAB

NXP

I.MX 8MDUAL 17X17 NO LID 621FBGA

Core Processor: ARM® Cortex®-A53
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.3GHz
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet: GbE
SATA: -
USB: USB 3.0 (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 95°C (TJ)
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Package / Case: 621-FBGA, FCBGA
Supplier Device Package: 621-FCPBGA (17x17)

パッケージ: 621-FBGA, FCBGA

在庫4,848

MKE14F512VLL16R

NXP

KINETIS KE14F: 160MHZ CORTEX-M4F

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫7,200

S912ZVML32F3MKHR

NXP

MAGNIV 16-BIT MCU S12Z CORE 32

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 31
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP-EP (10x10)

パッケージ: 64-LQFP Exposed Pad

在庫6,880

S9S08RN16W2VTJ

NXP

S08 8-BIT MCU 16KB FLASH 20MHZ

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 16
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 10x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

パッケージ: 20-TSSOP (0.173", 4.40mm Width)

在庫6,544

S9S08RNA8W2VTG

NXP

8-BIT MCU S08 CORE 8KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 12
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

パッケージ: 16-TSSOP (0.173", 4.40mm Width)

在庫5,264