ページ 816 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
PMN50XP,165	NXP	MOSFET P-CH 20V 4.8A 6TSOP FET Type: P-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 20V Current - Continuous Drain (Id) @ 25°C: 4.8A (Tc) Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V Vgs(th) (Max) @ Id: 950mV @ 250µA Gate Charge (Qg) (Max) @ Vgs: 10nC @ 4.5V Input Capacitance (Ciss) (Max) @ Vds: 1020pF @ 20V Vgs (Max): ±12V FET Feature: - Power Dissipation (Max): 2.2W (Tc) Rds On (Max) @ Id, Vgs: 60 mOhm @ 2.8A, 4.5V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 6-TSOP Package / Case: SC-74, SOT-457	パッケージ: SC-74, SOT-457	在庫2,912
MRF6V12500HSR5	NXP	FET RF 110V 1.03GHZ NI-1230H Transistor Type: LDMOS Frequency: 1.03GHz Gain: 19.7dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 200mA Power - Output: 500W Voltage - Rated: 110V Package / Case: NI-780S Supplier Device Package: NI-780S	パッケージ: NI-780S	在庫5,056
PCF1252-0T/F4,118	NXP	IC VOLT DETECT W/RESET 8SOIC Type: Simple Reset/Power-On Reset Number of Voltages Monitored: 1 Output: Push-Pull, Totem Pole Reset: Active High Reset Timeout: 400 µs Minimum Voltage - Threshold: 4.75V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	パッケージ: 8-SOIC (0.154", 3.90mm Width)	在庫2,928
MC34905CS5EK	NXP	IC SBC HIGH SPEED CAN 5V 32SOIC Applications: System Basis Chip Current - Supply: 2mA Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC	パッケージ: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad	在庫4,256
BUK124-50L,127	NXP	TOPFET LOGIC LVL 50V TO220-5 Switch Type: General Purpose Number of Outputs: 1 Ratio - Input:Output: 1:1 Output Configuration: Low Side Output Type: N-Channel Interface: On/Off Voltage - Load: 50V (Max) Voltage - Supply (Vcc/Vdd): 5V Current - Output (Max): 30A Rds On (Typ): 21 mOhm Input Type: Non-Inverting Features: Status Flag Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Operating Temperature: 150°C (TJ) Package / Case: TO-220-5 Formed Leads Supplier Device Package: SOT263-01	パッケージ: TO-220-5 Formed Leads	在庫7,968
74ABT2240D,112	NXP	IC BUFF INVERT 5.5V 20SOIC Logic Type: Buffer, Inverting Number of Elements: 2 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 12mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	パッケージ: 20-SOIC (0.295", 7.50mm Width)	在庫4,896
74ALVCH162827DGG:1	NXP	IC BUFF DVR TRI-ST 20BIT 56TSSOP Logic Type: Buffer, Non-Inverting Number of Elements: 2 Number of Bits per Element: 10 Input Type: - Output Type: Push-Pull Current - Output High, Low: 12mA, 12mA Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 56-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 56-TSSOP	パッケージ: 56-TFSOP (0.240", 6.10mm Width)	在庫3,744
TDA2615/N1,112	NXP	IC AMP AUDIO PWR 8W STER AB 9SIL Type: Class AB Output Type: 2-Channel (Stereo) Max Output Power x Channels @ Load: 8W x 2 @ 8 Ohm Voltage - Supply: 15 V ~ 42 V, ±7.5 V ~ 21 V Features: Depop, Mute, Short-Circuit and Thermal Protection Mounting Type: Through Hole Operating Temperature: -25°C ~ 150°C (TA) Supplier Device Package: 9-SIL MPF Package / Case: 9-SIP Exposed Tab	パッケージ: 9-SIP Exposed Tab	在庫2,944
PCA9535CHF,118	NXP	IC I/O EXPANDER I2C 16B 24HWQFN Number of I/O: 16 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-WFQFN Exposed Pad Supplier Device Package: 24-HWQFN (4x4)	パッケージ: 24-WFQFN Exposed Pad	在庫6,832
MC8640TVU1250HE	NXP	IC MPU MPC86XX 1.25GHZ 994FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.25GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 994-BCBGA, FCCBGA Supplier Device Package: 994-FCCBGA (33x33)	パッケージ: 994-BCBGA, FCCBGA	在庫6,512
MPC8347CZQAGD	NXP	IC MPU MPC83XX 400MHZ 620BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: - RAM Controllers: DDR Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-PBGA (29x29)	パッケージ: 620-BBGA Exposed Pad	在庫4,752
MPC860DTCZQ50D4	NXP	IC MPU MPC8XX 50MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (2), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	パッケージ: 357-BBGA	在庫6,336
MC68HCP11E1VFNE2	NXP	IC MCU 8BIT ROMLESS 52PLCC Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1)	パッケージ: 52-LCC (J-Lead)	在庫3,584
SPC5517GAVMG80	NXP	IC MCU 32BIT 1.5MB FLASH 208BGA Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Speed: 80MHz Connectivity: CAN, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 144 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 208-BGA Supplier Device Package: 208-MAPBGA (17x17)	パッケージ: 208-BGA	在庫5,472
MCF52213AE50	NXP	IC MCU 32BIT 128KB FLASH 64LQFP Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫6,032
S9S08SG8E2VTGR	NXP	IC MCU 8BIT 8KB FLASH 16TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	パッケージ: 16-TSSOP (0.173", 4.40mm Width)	在庫6,912
MCF52256CAG66	NXP	IC MCU 32BIT 256KB FLASH 144LQFP Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 66MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 96 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫8,412
MC9S12XET256MAL	NXP	IC MCU 16BIT 256KB FLASH 112LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	パッケージ: 112-LQFP	在庫337,548
MC68HC11E1VFNE3R	NXP	8BIT MCU512 BYTES RAM EPP Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1)	パッケージ: 52-LCC (J-Lead)	在庫3,184
SPC5604BF2VLL6R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 28x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: 100-LQFP	在庫6,592
S912ZVHL32F1VLQ	NXP	MAGNIV 16-BIT MCU S12Z CORE 32 Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Number of I/O: 100 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫5,824
SAF7751HV-N208W-SK	NXP	CAR DISP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
SAF775DHN-N208W-BK	NXP	CAR DISP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
LS1018AXE7PQA	NXP	LAYERSCAPE 64-BIT ARM CORTEX-A72 Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.5GHz Co-Processors/DSP: - RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: - Ethernet: 1Gbps (1), 2.5Gbps (5) SATA: SATA 6Gbps (1) USB: USB 3.0 (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: Secure Boot, TrustZone® Package / Case: 448-BFBGA Supplier Device Package: 448-FBGA (17x17)	パッケージ: -	Request a Quote
LPC802M011JDH20J	NXP	LPC802M011JDH20 Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 15MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	パッケージ: -	Request a Quote
S912ZVCA19AMLF	NXP	IC MCU 16BIT 192KB FLASH 48LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 28 Program Memory Size: 192KB (192K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Data Converters: A/D 10x12b SAR; D/A 1x8b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: -	Request a Quote
MIMX8DL1CVNFZAB	NXP	I.MX 8DUALXLITE 15SQ Core Processor: ARM® Cortex®-A35 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.2GHz Co-Processors/DSP: ARM® Cortex®-M4F RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 1Gbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG Package / Case: 388-LFBGA Supplier Device Package: 388-LBGA (15x15)	パッケージ: -	Request a Quote
FS32K144UIT0VLFR	NXP	S32K144, M4F, 512 KB FLASH Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote

PMN50XP,165

NXP

MOSFET P-CH 20V 4.8A 6TSOP

FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 4.8A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs(th) (Max) @ Id: 950mV @ 250µA
Gate Charge (Qg) (Max) @ Vgs: 10nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds: 1020pF @ 20V
Vgs (Max): ±12V
FET Feature: -
Power Dissipation (Max): 2.2W (Tc)
Rds On (Max) @ Id, Vgs: 60 mOhm @ 2.8A, 4.5V
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: 6-TSOP
Package / Case: SC-74, SOT-457

パッケージ: SC-74, SOT-457

在庫2,912

MRF6V12500HSR5

NXP

FET RF 110V 1.03GHZ NI-1230H

Transistor Type: LDMOS
Frequency: 1.03GHz
Gain: 19.7dB
Voltage - Test: 50V
Current Rating: -
Noise Figure: -
Current - Test: 200mA
Power - Output: 500W
Voltage - Rated: 110V
Package / Case: NI-780S
Supplier Device Package: NI-780S

パッケージ: NI-780S

在庫5,056

PCF1252-0T/F4,118

NXP

IC VOLT DETECT W/RESET 8SOIC

Type: Simple Reset/Power-On Reset
Number of Voltages Monitored: 1
Output: Push-Pull, Totem Pole
Reset: Active High
Reset Timeout: 400 µs Minimum
Voltage - Threshold: 4.75V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

パッケージ: 8-SOIC (0.154", 3.90mm Width)

在庫2,928

MC34905CS5EK

NXP

IC SBC HIGH SPEED CAN 5V 32SOIC

Applications: System Basis Chip
Current - Supply: 2mA
Voltage - Supply: 5.5 V ~ 28 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC

パッケージ: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

在庫4,256

BUK124-50L,127

NXP

TOPFET LOGIC LVL 50V TO220-5

Switch Type: General Purpose
Number of Outputs: 1
Ratio - Input:Output: 1:1
Output Configuration: Low Side
Output Type: N-Channel
Interface: On/Off
Voltage - Load: 50V (Max)
Voltage - Supply (Vcc/Vdd): 5V
Current - Output (Max): 30A
Rds On (Typ): 21 mOhm
Input Type: Non-Inverting
Features: Status Flag
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Operating Temperature: 150°C (TJ)
Package / Case: TO-220-5 Formed Leads
Supplier Device Package: SOT263-01

パッケージ: TO-220-5 Formed Leads

在庫7,968

74ABT2240D,112

NXP

IC BUFF INVERT 5.5V 20SOIC

Logic Type: Buffer, Inverting
Number of Elements: 2
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 12mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO

パッケージ: 20-SOIC (0.295", 7.50mm Width)

在庫4,896

74ALVCH162827DGG:1

NXP

IC BUFF DVR TRI-ST 20BIT 56TSSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Number of Bits per Element: 10
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 56-TSSOP

パッケージ: 56-TFSOP (0.240", 6.10mm Width)

在庫3,744

TDA2615/N1,112

NXP

IC AMP AUDIO PWR 8W STER AB 9SIL

Type: Class AB
Output Type: 2-Channel (Stereo)
Max Output Power x Channels @ Load: 8W x 2 @ 8 Ohm
Voltage - Supply: 15 V ~ 42 V, ±7.5 V ~ 21 V
Features: Depop, Mute, Short-Circuit and Thermal Protection
Mounting Type: Through Hole
Operating Temperature: -25°C ~ 150°C (TA)
Supplier Device Package: 9-SIL MPF
Package / Case: 9-SIP Exposed Tab

パッケージ: 9-SIP Exposed Tab

在庫2,944

PCA9535CHF,118

NXP

IC I/O EXPANDER I2C 16B 24HWQFN

Number of I/O: 16
Interface: I2C, SMBus
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 10mA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-WFQFN Exposed Pad
Supplier Device Package: 24-HWQFN (4x4)

パッケージ: 24-WFQFN Exposed Pad

在庫6,832

MC8640TVU1250HE

NXP

IC MPU MPC86XX 1.25GHZ 994FCCBGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.25GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 994-BCBGA, FCCBGA
Supplier Device Package: 994-FCCBGA (33x33)

パッケージ: 994-BCBGA, FCCBGA

在庫6,512

MPC8347CZQAGD

NXP

IC MPU MPC83XX 400MHZ 620BGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: -
RAM Controllers: DDR
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 620-BBGA Exposed Pad
Supplier Device Package: 620-PBGA (29x29)

パッケージ: 620-BBGA Exposed Pad

在庫4,752

MPC860DTCZQ50D4

NXP

IC MPU MPC8XX 50MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 50MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (2), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

パッケージ: 357-BBGA

在庫6,336

MC68HCP11E1VFNE2

NXP

IC MCU 8BIT ROMLESS 52PLCC

Core Processor: HC11
Core Size: 8-Bit
Speed: 2MHz
Connectivity: SCI, SPI
Peripherals: POR, WDT
Number of I/O: 38
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: 512 x 8
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 52-LCC (J-Lead)
Supplier Device Package: 52-PLCC (19.1x19.1)

パッケージ: 52-LCC (J-Lead)

在庫3,584

SPC5517GAVMG80

NXP

IC MCU 32BIT 1.5MB FLASH 208BGA

Core Processor: e200z0, e200z1
Core Size: 32-Bit Dual-Core
Speed: 80MHz
Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 144
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
Data Converters: A/D 40x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 208-BGA
Supplier Device Package: 208-MAPBGA (17x17)

パッケージ: 208-BGA

在庫5,472

MCF52213AE50

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 56
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫6,032

S9S08SG8E2VTGR

NXP

IC MCU 8BIT 8KB FLASH 16TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 12
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

パッケージ: 16-TSSOP (0.173", 4.40mm Width)

在庫6,912

MCF52256CAG66

NXP

IC MCU 32BIT 256KB FLASH 144LQFP

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 66MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 96
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫8,412

MC9S12XET256MAL

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

パッケージ: 112-LQFP

在庫337,548

MC68HC11E1VFNE3R

NXP

8BIT MCU512 BYTES RAM EPP

Core Processor: HC11
Core Size: 8-Bit
Speed: 3MHz
Connectivity: SCI, SPI
Peripherals: POR, WDT
Number of I/O: 38
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: 512 x 8
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 52-LCC (J-Lead)
Supplier Device Package: 52-PLCC (19.1x19.1)

パッケージ: 52-LCC (J-Lead)

在庫3,184

SPC5604BF2VLL6R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 79
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 28x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

在庫6,592

S912ZVHL32F1VLQ

NXP

MAGNIV 16-BIT MCU S12Z CORE 32

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Number of I/O: 100
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫5,824

SAF7751HV-N208W-SK

NXP

CAR DISP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

Request a Quote

SAF775DHN-N208W-BK

NXP

CAR DISP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

Request a Quote

LS1018AXE7PQA

NXP

LAYERSCAPE 64-BIT ARM CORTEX-A72

Core Processor: ARM® Cortex®-A72
Number of Cores/Bus Width: 1 Core, 64-Bit
Speed: 1.5GHz
Co-Processors/DSP: -
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Display & Interface Controllers: -
Ethernet: 1Gbps (1), 2.5Gbps (5)
SATA: SATA 6Gbps (1)
USB: USB 3.0 (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Secure Boot, TrustZone®
Package / Case: 448-BFBGA
Supplier Device Package: 448-FBGA (17x17)

パッケージ: -

Request a Quote

LPC802M011JDH20J

NXP

LPC802M011JDH20

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 15MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O: 16
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Data Converters: A/D 12x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

パッケージ: -

Request a Quote

S912ZVCA19AMLF

NXP

IC MCU 16BIT 192KB FLASH 48LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 28
Program Memory Size: 192KB (192K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Data Converters: A/D 10x12b SAR; D/A 1x8b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: -

Request a Quote

MIMX8DL1CVNFZAB

NXP

I.MX 8DUALXLITE 15SQ

Core Processor: ARM® Cortex®-A35
Number of Cores/Bus Width: 2 Core, 64-Bit
Speed: 1.2GHz
Co-Processors/DSP: ARM® Cortex®-M4F
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Ethernet: 1Gbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TJ)
Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Package / Case: 388-LFBGA
Supplier Device Package: 388-LBGA (15x15)

パッケージ: -

Request a Quote

FS32K144UIT0VLFR

NXP

S32K144, M4F, 512 KB FLASH

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

Request a Quote