ページ 85 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
BUK7C1R2-40EJ	NXP	MOSFET N-CH 40V 200A D2PAK-7 FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 40V Current - Continuous Drain (Id) @ 25°C: - Drive Voltage (Max Rds On, Min Rds On): - Vgs(th) (Max) @ Id: - Gate Charge (Qg) (Max) @ Vgs: - Input Capacitance (Ciss) (Max) @ Vds: - Vgs (Max): - FET Feature: - Power Dissipation (Max): - Rds On (Max) @ Id, Vgs: - Operating Temperature: - Mounting Type: Surface Mount Supplier Device Package: D2PAK (7-Lead) Package / Case: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB	パッケージ: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB	在庫4,496
MRF6S19100NBR1	NXP	FET RF 68V 1.99GHZ TO272-4 Transistor Type: LDMOS Frequency: 1.99GHz Gain: 14.5dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 950mA Power - Output: 22W Voltage - Rated: 68V Package / Case: TO-272BB Supplier Device Package: TO-272 WB-4	パッケージ: TO-272BB	在庫7,088
MRF5S9150HR5	NXP	FET RF 68V 880MHZ NI-780S Transistor Type: LDMOS Frequency: 880MHz Gain: 19.7dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.5A Power - Output: 33W Voltage - Rated: 68V Package / Case: NI-780 Supplier Device Package: NI-780	パッケージ: NI-780	在庫4,000
BYD17G,115	NXP	DIODE AVALANCHE 400V 1.5A MELF Diode Type: Avalanche Voltage - DC Reverse (Vr) (Max): 400V Current - Average Rectified (Io): 1.5A Voltage - Forward (Vf) (Max) @ If: 1.05V @ 1A Speed: Standard Recovery >500ns, > 200mA (Io) Reverse Recovery Time (trr): 3µs Current - Reverse Leakage @ Vr: 1µA @ 400V Capacitance @ Vr, F: 21pF @ 0V, 1MHz Mounting Type: Surface Mount Package / Case: SOD-87 Supplier Device Package: MELF Operating Temperature - Junction: -65°C ~ 175°C	パッケージ: SOD-87	在庫3,216
TDA3681J/N2C,112	NXP	IC VOLT REG W/SW & IGNIT 17-SIL Applications: Ignition Buffer, Regulator Current - Supply: 110µA Voltage - Supply: 9.5 V ~ 18 V Operating Temperature: -40°C ~ 85°C Mounting Type: Through Hole Package / Case: 17-SIP Formed Leads Supplier Device Package: 17-PDBS	パッケージ: 17-SIP Formed Leads	在庫7,072
74LVCH32244AEC/G:5	NXP	IC BUFF DVR TRI-ST 32BIT 96LFBGA Logic Type: Buffer, Non-Inverting Number of Elements: 8 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 24mA, 24mA Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 96-LFBGA Supplier Device Package: 96-LFBGA (13.5x5.5)	パッケージ: 96-LFBGA	在庫5,808
74ABT16543BB,518	NXP	IC TRANSCVR TRI-ST 16BIT 52QFP Logic Type: Transceiver, Non-Inverting Number of Elements: 2 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 52-QFP Supplier Device Package: 52-QFP (10x10)	パッケージ: 52-QFP	在庫7,424
SC16C652BIB48,128	NXP	IC ENCODER/DECODER IRDA 48LQFP Features: - Number of Channels: 2, DUART FIFO's: 32 Byte Protocol: - Data Rate (Max): 5Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP	在庫2,864
MCIMX257CVM4	NXP	IC MPU I.MX25 400MHZ 400MAPBGA Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: - RAM Controllers: LPDDR, DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, Touchscreen Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: - Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17x17)	パッケージ: 400-LFBGA	在庫8,124
MCIMX253CVM4	NXP	IC MPU I.MX25 400MHZ 400MAPBGA Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: - RAM Controllers: LPDDR, DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: - Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17x17)	パッケージ: 400-LFBGA	在庫5,056
XPC850ZT66BU	NXP	IC MPU MPC8XX 66MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23x23)	パッケージ: 256-BGA	在庫2,528
MPC8541VTAQF	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫4,544
MPC8540VT833LB	NXP	IC MPU MPC85XX 833MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 833MHz Co-Processors/DSP: - RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 784-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 784-BBGA, FCBGA	在庫10,020
SPC5748GK1MMN6	NXP	IC MCU 32BIT 6MB FLASH 324MAPBGA Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 246 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 324-LFBGA Supplier Device Package: 324-MAPBGA (19x19)	パッケージ: 324-LFBGA	在庫7,504
P80C32UFAA,512	NXP	IC MCU 8BIT ROMLESS 44PLCC Core Processor: 8051 Core Size: 8-Bit Speed: 33MHz Connectivity: UART/USART Peripherals: POR Number of I/O: 32 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	パッケージ: 44-LCC (J-Lead)	在庫4,992
P87LPC764BDH,512	NXP	IC MCU 8BIT 4KB OTP 20TSSOP Core Processor: 8051 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, WDT Number of I/O: 18 Program Memory Size: 4KB (4K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 6 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	パッケージ: 20-TSSOP (0.173", 4.40mm Width)	在庫7,744
NE1617DS,112	NXP	SENSOR TEMPERATURE SMBUS 16SSOP Sensor Type: Digital, Local/Remote Sensing Temperature - Local: 0°C ~ 120°C Sensing Temperature - Remote: -55°C ~ 127°C Output Type: SMBus Voltage - Supply: 3 V ~ 5.5 V Resolution: 7 b Features: One-Shot, Output Switch, Programmable Limit, Standby Mode Accuracy - Highest (Lowest): ±2°C (±3°C) Test Condition: 60°C ~ 100°C (0°C ~ 125°C) Operating Temperature: 0°C ~ 120°C Mounting Type: Surface Mount Package / Case: 16-SSOP (0.154", 3.90mm Width) Supplier Device Package: 16-SSOP	パッケージ: 16-SSOP (0.154", 3.90mm Width)	在庫3,384
MPXV7025DP	NXP	PRESSURE SENSOR DUAL PORT 8-SOP Pressure Type: Differential Operating Pressure: ±3.63 PSI (±25 kPa) Output Type: Analog Voltage Output: 0.2 V ~ 4.7 V Accuracy: ±5% Voltage - Supply: 4.75 V ~ 5.25 V Port Size: Male - 0.13" (3.3mm) Tube, Dual Port Style: Barbed Features: Temperature Compensated Termination Style: PCB Maximum Pressure: ±29.01 PSI (±200 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-SMD Module Supplier Device Package: -	パッケージ: 8-SMD Module	在庫6,048
MF0MOU2001DA4,118	NXP	IC MIFARE ULTRALIGHT FCP PLLMC Type: RFID Transponder Frequency: 13.56MHz Standards: ISO 14443, MIFARE, NFC Interface: - Voltage - Supply: - Operating Temperature: -25°C ~ 70°C Package / Case: MOA4, Smart Card Module Supplier Device Package: PLLMC	パッケージ: MOA4, Smart Card Module	在庫3,438
BGU8H1X	NXP	IC AMP LNA 5V 2500MHZ Frequency: 2.3GHz ~ 2.7GHz P1dB: -3dBm Gain: 13dB Noise Figure: 0.9dB RF Type: LTE, WiMax Voltage - Supply: 1.5 V ~ 3.1 V Current - Supply: 5mA Test Frequency: 2.3GHz Package / Case: 6-XFDFN Supplier Device Package: 6-XSON, SOT1232 (1.1x0.7)	パッケージ: 6-XFDFN	在庫4,590
TFA9872CUK/N1Z	NXP	3.6W/8OHM PDM I/O SPEAKER DRIVER Type: Class D Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Max Output Power x Channels @ Load: 5.1W x 1 @ 8 Ohm; 5.9W x 2 @ 6 Ohm Voltage - Supply: 1.65 V ~ 1.95 V Features: Depop, I²C, I²S, Mute, PWM, Short-Circuit and Thermal Protection Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 42-WLSCP (3.13x2.46) Package / Case: 42-UFBGA, WLCSP	パッケージ: 42-UFBGA, WLCSP	在庫2,624
SPC5668GAVMG	NXP	NXP 32-BIT MCU POWER ARCH 2MB Core Processor: e200z650 Core Size: 32-Bit Speed: 116MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 155 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 592K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 36x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 208-BGA Supplier Device Package: 208-MAPBGA (17x17)	パッケージ: 208-BGA	在庫38,880
SAF7751HV-N208W-KK	NXP	CAR DISP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
TJA1042T-3-1U	NXP	IC TRANSCEIVER HALF 1/1 8SO Type: Transceiver Protocol: CANbus Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 120 mV Data Rate: 5Mbps Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	パッケージ: -	Request a Quote
MC33772CTA1AER2	NXP	BATTERY CELL CONTROLLER, ADVANCE Function: Battery Cell Controller Battery Chemistry: Lithium Ion Number of Cells: 3 ~ 6 Fault Protection: Over/Under Voltage Interface: I2C, SPI Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	パッケージ: -	Request a Quote
SAF4000EL-101S47AY	NXP	SOFTWARE DEFINED RADIO Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
MC33FS6600M2KSR2	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: - Current - Supply: - Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	パッケージ: -	Request a Quote
FD32K116LFT0MFMT	NXP	IC Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote

BUK7C1R2-40EJ

NXP

MOSFET N-CH 40V 200A D2PAK-7

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 40V
Current - Continuous Drain (Id) @ 25°C: -
Drive Voltage (Max Rds On, Min Rds On): -
Vgs(th) (Max) @ Id: -
Gate Charge (Qg) (Max) @ Vgs: -
Input Capacitance (Ciss) (Max) @ Vds: -
Vgs (Max): -
FET Feature: -
Power Dissipation (Max): -
Rds On (Max) @ Id, Vgs: -
Operating Temperature: -
Mounting Type: Surface Mount
Supplier Device Package: D2PAK (7-Lead)
Package / Case: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB

パッケージ: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB

在庫4,496

MRF6S19100NBR1

NXP

FET RF 68V 1.99GHZ TO272-4

Transistor Type: LDMOS
Frequency: 1.99GHz
Gain: 14.5dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 950mA
Power - Output: 22W
Voltage - Rated: 68V
Package / Case: TO-272BB
Supplier Device Package: TO-272 WB-4

パッケージ: TO-272BB

在庫7,088

MRF5S9150HR5

NXP

FET RF 68V 880MHZ NI-780S

Transistor Type: LDMOS
Frequency: 880MHz
Gain: 19.7dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.5A
Power - Output: 33W
Voltage - Rated: 68V
Package / Case: NI-780
Supplier Device Package: NI-780

パッケージ: NI-780

在庫4,000

BYD17G,115

NXP

DIODE AVALANCHE 400V 1.5A MELF

Diode Type: Avalanche
Voltage - DC Reverse (Vr) (Max): 400V
Current - Average Rectified (Io): 1.5A
Voltage - Forward (Vf) (Max) @ If: 1.05V @ 1A
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3µs
Current - Reverse Leakage @ Vr: 1µA @ 400V
Capacitance @ Vr, F: 21pF @ 0V, 1MHz
Mounting Type: Surface Mount
Package / Case: SOD-87
Supplier Device Package: MELF
Operating Temperature - Junction: -65°C ~ 175°C

パッケージ: SOD-87

在庫3,216

TDA3681J/N2C,112

NXP

IC VOLT REG W/SW & IGNIT 17-SIL

Applications: Ignition Buffer, Regulator
Current - Supply: 110µA
Voltage - Supply: 9.5 V ~ 18 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Through Hole
Package / Case: 17-SIP Formed Leads
Supplier Device Package: 17-PDBS

パッケージ: 17-SIP Formed Leads

在庫7,072

74LVCH32244AEC/G:5

NXP

IC BUFF DVR TRI-ST 32BIT 96LFBGA

Logic Type: Buffer, Non-Inverting
Number of Elements: 8
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.2 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 96-LFBGA
Supplier Device Package: 96-LFBGA (13.5x5.5)

パッケージ: 96-LFBGA

在庫5,808

74ABT16543BB,518

NXP

IC TRANSCVR TRI-ST 16BIT 52QFP

Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 52-QFP
Supplier Device Package: 52-QFP (10x10)

パッケージ: 52-QFP

在庫7,424

SC16C652BIB48,128

NXP

IC ENCODER/DECODER IRDA 48LQFP

Features: -
Number of Channels: 2, DUART
FIFO's: 32 Byte
Protocol: -
Data Rate (Max): 5Mbps
Voltage - Supply: 2.5V, 3.3V, 5V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP

在庫2,864

MCIMX257CVM4

NXP

IC MPU I.MX25 400MHZ 400MAPBGA

Core Processor: ARM926EJ-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: -
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: -
Package / Case: 400-LFBGA
Supplier Device Package: 400-MAPBGA (17x17)

パッケージ: 400-LFBGA

在庫8,124

MCIMX253CVM4

NXP

IC MPU I.MX25 400MHZ 400MAPBGA

Core Processor: ARM926EJ-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: -
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: -
Package / Case: 400-LFBGA
Supplier Device Package: 400-MAPBGA (17x17)

パッケージ: 400-LFBGA

在庫5,056

XPC850ZT66BU

NXP

IC MPU MPC8XX 66MHZ 256BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 256-BGA
Supplier Device Package: 256-PBGA (23x23)

パッケージ: 256-BGA

在庫2,528

MPC8541VTAQF

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫4,544

MPC8540VT833LB

NXP

IC MPU MPC85XX 833MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 833MHz
Co-Processors/DSP: -
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 784-BBGA, FCBGA

在庫10,020

SPC5748GK1MMN6

NXP

IC MCU 32BIT 6MB FLASH 324MAPBGA

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 246
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 324-LFBGA
Supplier Device Package: 324-MAPBGA (19x19)

パッケージ: 324-LFBGA

在庫7,504

P80C32UFAA,512

NXP

IC MCU 8BIT ROMLESS 44PLCC

Core Processor: 8051
Core Size: 8-Bit
Speed: 33MHz
Connectivity: UART/USART
Peripherals: POR
Number of I/O: 32
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

パッケージ: 44-LCC (J-Lead)

在庫4,992

P87LPC764BDH,512

NXP

IC MCU 8BIT 4KB OTP 20TSSOP

Core Processor: 8051
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Number of I/O: 18
Program Memory Size: 4KB (4K x 8)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

パッケージ: 20-TSSOP (0.173", 4.40mm Width)

在庫7,744

NE1617DS,112

NXP

SENSOR TEMPERATURE SMBUS 16SSOP

Sensor Type: Digital, Local/Remote
Sensing Temperature - Local: 0°C ~ 120°C
Sensing Temperature - Remote: -55°C ~ 127°C
Output Type: SMBus
Voltage - Supply: 3 V ~ 5.5 V
Resolution: 7 b
Features: One-Shot, Output Switch, Programmable Limit, Standby Mode
Accuracy - Highest (Lowest): ±2°C (±3°C)
Test Condition: 60°C ~ 100°C (0°C ~ 125°C)
Operating Temperature: 0°C ~ 120°C
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Supplier Device Package: 16-SSOP

パッケージ: 16-SSOP (0.154", 3.90mm Width)

在庫3,384

MPXV7025DP

NXP

PRESSURE SENSOR DUAL PORT 8-SOP

Pressure Type: Differential
Operating Pressure: ±3.63 PSI (±25 kPa)
Output Type: Analog Voltage
Output: 0.2 V ~ 4.7 V
Accuracy: ±5%
Voltage - Supply: 4.75 V ~ 5.25 V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Port Style: Barbed
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: ±29.01 PSI (±200 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 8-SMD Module
Supplier Device Package: -

パッケージ: 8-SMD Module

在庫6,048

MF0MOU2001DA4,118

NXP

IC MIFARE ULTRALIGHT FCP PLLMC

Type: RFID Transponder
Frequency: 13.56MHz
Standards: ISO 14443, MIFARE, NFC
Interface: -
Voltage - Supply: -
Operating Temperature: -25°C ~ 70°C
Package / Case: MOA4, Smart Card Module
Supplier Device Package: PLLMC

パッケージ: MOA4, Smart Card Module

在庫3,438

BGU8H1X

NXP

IC AMP LNA 5V 2500MHZ

Frequency: 2.3GHz ~ 2.7GHz
P1dB: -3dBm
Gain: 13dB
Noise Figure: 0.9dB
RF Type: LTE, WiMax
Voltage - Supply: 1.5 V ~ 3.1 V
Current - Supply: 5mA
Test Frequency: 2.3GHz
Package / Case: 6-XFDFN
Supplier Device Package: 6-XSON, SOT1232 (1.1x0.7)

パッケージ: 6-XFDFN

在庫4,590

TFA9872CUK/N1Z

NXP

3.6W/8OHM PDM I/O SPEAKER DRIVER

Type: Class D
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Max Output Power x Channels @ Load: 5.1W x 1 @ 8 Ohm; 5.9W x 2 @ 6 Ohm
Voltage - Supply: 1.65 V ~ 1.95 V
Features: Depop, I²C, I²S, Mute, PWM, Short-Circuit and Thermal Protection
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 42-WLSCP (3.13x2.46)
Package / Case: 42-UFBGA, WLCSP

パッケージ: 42-UFBGA, WLCSP

在庫2,624

SPC5668GAVMG

NXP

NXP 32-BIT MCU POWER ARCH 2MB

Core Processor: e200z650
Core Size: 32-Bit
Speed: 116MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 155
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 592K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 36x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 208-BGA
Supplier Device Package: 208-MAPBGA (17x17)

パッケージ: 208-BGA

在庫38,880

SAF7751HV-N208W-KK

NXP

CAR DISP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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TJA1042T-3-1U

NXP

IC TRANSCEIVER HALF 1/1 8SO

Type: Transceiver
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 120 mV
Data Rate: 5Mbps
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

パッケージ: -

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MC33772CTA1AER2

NXP

BATTERY CELL CONTROLLER, ADVANCE

Function: Battery Cell Controller
Battery Chemistry: Lithium Ion
Number of Cells: 3 ~ 6
Fault Protection: Over/Under Voltage
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

パッケージ: -

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SAF4000EL-101S47AY

NXP

SOFTWARE DEFINED RADIO

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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MC33FS6600M2KSR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: -
Current - Supply: -
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

パッケージ: -

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FD32K116LFT0MFMT

NXP

IC

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

Request a Quote