NXP 製品

BFT92W,115

NXP

TRANS PNP 35MA 15V 4GHZ SOT323

• Transistor Type: PNP
• Voltage - Collector Emitter Breakdown (Max): 15V
• Frequency - Transition: 4GHz
• Noise Figure (dB Typ @ f): 2.5dB ~ 3dB @ 500MHz ~ 1GHz
• Gain: -
• Power - Max: 300mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 15mA, 10V
• Current - Collector (Ic) (Max): 25mA
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-70, SOT-323
• Supplier Device Package: SOT-323-3

パッケージ: SC-70, SOT-323

CBT3126PW,112

NXP

IC FET BUS SWITCH QUAD 14TSSOP

• Type: Bus Switch
• Circuit: 1 x 1:1
• Independent Circuits: 4
• Current - Output High, Low: -
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 14-TSSOP

パッケージ: 14-TSSOP (0.173", 4.40mm Width)

74HCT423N,112

NXP

IC DUAL RETRIG MULTIVIB 16DIP

• Logic Type: Monostable
• Independent Circuits: 2
• Schmitt Trigger Input: No
• Propagation Delay: 22ns
• Current - Output High, Low: 4mA, 4mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

パッケージ: 16-DIP (0.300", 7.62mm)

TDA20143/2,518

NXP

IC HDMI INTERFACE 28-HVQFN

• Type: Tuner
• Applications: Set-Top Boxes, TV
• Mounting Type: Surface Mount
• Package / Case: 28-VFQFN Exposed Pad
• Supplier Device Package: 28-HVQFN (5x5)

パッケージ: 28-VFQFN Exposed Pad

MHW7185CN

NXP

IC CATV AMP MOD 750MHZ 7-CATV

• Applications: CATV
• Output Type: -
• Number of Circuits: 1
• -3db Bandwidth: -
• Slew Rate: -
• Current - Supply: 400mA
• Current - Output / Channel: -
• Voltage - Supply, Single/Dual (±): -
• Mounting Type: Surface Mount
• Package / Case: Module
• Supplier Device Package: 7-CATV Module

パッケージ: Module

TDA9889TS/V1,512

NXP

IC AMPLIFIER AGC 16-SSOP

• Applications: Automatic Gain Control (AGC)
• Output Type: -
• Number of Circuits: 1
• -3db Bandwidth: -
• Slew Rate: -
• Current - Supply: 55mA
• Current - Output / Channel: -
• Voltage - Supply, Single/Dual (±): 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 16-SSOP

パッケージ: 16-SSOP (0.209", 5.30mm Width)

SC68C652BIB48,128

NXP

IC UART DUAL 48LQFP

• Features: Timer/Counter
• Number of Channels: 2, DUART
• FIFO's: 32 Byte
• Protocol: -
• Data Rate (Max): 5Mbps
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP

MPC8545EPXANGD

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

MPC8360CVVAGDG

NXP

IC MPU MPC83XX 400MHZ 740TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 740-LBGA
• Supplier Device Package: 740-TBGA (37.5x37.5)

パッケージ: 740-LBGA

P1012NSE2FFB

NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 125°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

パッケージ: 689-BBGA Exposed Pad

MCIMX6L7DVN10AB

NXP

IC MPU I.MX6SL 1.0GHZ 432MAPBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (3)
• Voltage - I/O: 1.2V, 1.8V, 3.0V
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 432-TFBGA
• Supplier Device Package: 432-MAPBGA (13x13)

パッケージ: 432-TFBGA

MPC852TVR66A

NXP

IC MPU MPC8XX 66MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

パッケージ: 256-BBGA

MC68HC711E9CFU2

NXP

IC MCU 8BIT 12KB OTP 64QFP

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 2MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number of I/O: 38
• Program Memory Size: 12KB (12K x 8)
• Program Memory Type: OTP
• EEPROM Size: 512 x 8
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

パッケージ: 64-QFP

MCF51MM256VLK

NXP

IC MCU 32BIT 256KB FLASH 80LQFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I2C, SCI, SPI, USB OTG
• Peripherals: LVD, PWM, WDT
• Number of I/O: 47
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x16b, D/A 1x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (12x12)

パッケージ: 80-LQFP

MC9S12XS64MAE

NXP

IC MCU 16BIT 64KB FLASH 64LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 44
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

MK20DX128VMC7

NXP

IC MCU 32BIT 128KB FLASH 121BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 70
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 35x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 121-LFBGA
• Supplier Device Package: 121-MAPBGA (8x8)

パッケージ: 121-LFBGA

MKE02Z16VLC4

NXP

IC MCU 32BIT 16KB FLASH 32LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: LVD, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b, D/A 2x6b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

パッケージ: 32-LQFP

MM912F634DV1AER2

NXP

IC MCU DUAL LS/HS SWITCH 48LQFP

• Applications: Automotive
• Core Processor: S12
• Program Memory Type: FLASH (32 KB)
• Controller Series: HCS12
• RAM Size: 2K x 8
• Interface: LIN, SCI
• Number of I/O: 9
• Voltage - Supply: 2.25 V ~ 5.5 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

パッケージ: 48-LQFP Exposed Pad

PCK9447BD,151

NXP

IC CLK BUFFER 2:9 350MHZ 32LQFP

• Type: Fanout Buffer (Distribution), Multiplexer
• Number of Circuits: 1
• Ratio - Input:Output: 2:9
• Differential - Input:Output: No/No
• Input: LVCMOS
• Output: LVCMOS
• Frequency - Max: 350MHz
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

パッケージ: 32-LQFP

MPXAZ4250AC6T1

NXP

SENSOR PRESSURE 36.3PSI MAX 8SOP

• Pressure Type: Absolute
• Operating Pressure: 2.9 PSI ~ 36.26 PSI (20 kPa ~ 250 kPa)
• Output Type: Analog Voltage
• Output: 0.2 V ~ 4.9 V
• Accuracy: ±1.5%
• Voltage - Supply: 4.75 V ~ 5.25 V
• Port Size: Male - 0.13" (3.17mm) Tube
• Port Style: Barbless
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 145.04 PSI (1000 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SMD, Gull Wing, Top Port
• Supplier Device Package: -

パッケージ: 8-SMD, Gull Wing, Top Port

MF3ICDH4101DUD/05,

NXP

IC SMART CARD 4K EEPROM FFC

• Type: RFID Transponder
• Frequency: 13.56MHz
• Standards: ISO 14443, MIFARE
• Interface: UART
• Voltage - Supply: -
• Operating Temperature: -25°C ~ 70°C
• Package / Case: Die
• Supplier Device Package: Die

パッケージ: Die

MWCT1014SFVLHN

NXP

WCT1014SF 64 LQFP

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

パッケージ: -

NX5P2924UKZ

NXP

IC LOAD SWITCH HI SD 2.5A 6WLCSP

• Switch Type: General Purpose
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: On/Off
• Voltage - Load: 0.8 V ~ 5.5 V
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 2.5A
• Rds On (Typ): 14 mOhm
• Input Type: Non-Inverting
• Features: Load Discharge, Slew Rate Controlled
• Fault Protection: -
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 6-UFBGA, WLCSP
• Supplier Device Package: 6-WLCSP (0.87x1.37)

パッケージ: 6-UFBGA, WLCSP

SPC5747CBK0AVKU6

NXP

DUAL CORE 4M FLASH 512K RAM F

• Core Processor: e200z2, e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz/160MHz
• Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 129
• Program Memory Size: 4MB (4M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 80x10b, 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP Exposed Pad
• Supplier Device Package: 176-LQFP (24x24)

パッケージ: 176-LQFP Exposed Pad

SP5742PFK1AKLQ5R

NXP

1.5MB NVM 2 X E200Z4 CORES 150

• Core Processor: e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 150MHz
• Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: -
• Program Memory Size: 1.5MB (1.5M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 192K x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 135°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

PCA9848BSMP

NXP

IC

• Type: Bus Switch
• Circuit: 2 x 8:1
• Independent Circuits: 1
• Current - Output High, Low: -, 20mA
• Voltage Supply Source: Single Supply
• Voltage - Supply: 0.9V ~ 3.6V, 1.65V ~ 3.6V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)

パッケージ: -

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MIMXRT1166DVM6A

NXP

IC MCU 32BIT EXT MEM 289LFBGA

• Core Processor: ARM® Cortex®-M4/M7
• Core Size: 32-Bit Dual-Core
• Speed: 240MHz, 600MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: External Program Memory
• EEPROM Size: -
• RAM Size: 1M x 8
• Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
• Data Converters: A/D 2x12b; D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 95°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-LFBGA (14x14)

パッケージ: -

TJA1448BTK-S1Z

NXP

IC TRANSCEIVER HALF 2/2 14HVSON

• Type: Transceiver
• Protocol: CANbus
• Number of Drivers/Receivers: 2/2
• Duplex: Half
• Receiver Hysteresis: 50 mV
• Data Rate: 5Mbps
• Voltage - Supply: 4.5V ~ 5.5V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 14-VDFN Exposed Pad
• Supplier Device Package: 14-HVSON (3x4.5)

パッケージ: -

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