ページ 913 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
MRF6VP41KHR6	NXP	FET RF 2CH 110V 450MHZ NI1230 Transistor Type: LDMOS (Dual) Frequency: 450MHz Gain: 20dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 150mA Power - Output: 1000W Voltage - Rated: 110V Package / Case: NI-1230 Supplier Device Package: NI-1230	パッケージ: NI-1230	在庫7,744
TL431MSDT,215	NXP	IC VREF SHUNT ADJ SOT23-3 Reference Type: Shunt Output Type: Adjustable Voltage - Output (Min/Fixed): 2.495V Voltage - Output (Max): 36V Current - Output: 100mA Tolerance: ±2% Temperature Coefficient: - Noise - 0.1Hz to 10Hz: - Noise - 10Hz to 10kHz: - Voltage - Input: - Current - Supply: - Current - Cathode: 1mA Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫4,848
MC33910G5ACR2	NXP	IC SYSTEM BASIS CHIP 32LQFP Applications: System Basis Chip Current - Supply: 4.5mA Voltage - Supply: 5.5 V ~ 27 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	パッケージ: 32-LQFP	在庫5,456
MCZ33999EKR2	NXP	IC SW 16OUTPT PWM & SPI 54-SOIC Switch Type: General Purpose Number of Outputs: 16 Ratio - Input:Output: 1:16 Output Configuration: Low Side Output Type: N-Channel Interface: SPI Voltage - Load: 5 V ~ 27 V Voltage - Supply (Vcc/Vdd): 3.1 V ~ 5.5 V Current - Output (Max): 900mA Rds On (Typ): 550 mOhm Input Type: - Features: PWM Input Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Operating Temperature: -40°C ~ 150°C (TJ) Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP	パッケージ: 54-SSOP (0.295", 7.50mm Width) Exposed Pad	在庫7,120
74HCT4511N,652	NXP	IC BCD-7SEG LATCH/DEC/DVR 16DIP Display Type: LED Configuration: 7 Segment Interface: BCD Digits or Characters: - Current - Supply: - Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	パッケージ: 16-DIP (0.300", 7.62mm)	在庫4,464
PCA9555BS,118	NXP	IC I/O EXPANDER I2C 16B 24HVQFN Number of I/O: 16 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (4x4)	パッケージ: 24-VFQFN Exposed Pad	在庫135,528
P1014NSE5HHA	NXP	IC MPU Q OR IQ 800MHZ 425TEBGA1 Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox Package / Case: 425-FBGA Supplier Device Package: 425-TEPBGA1	パッケージ: 425-FBGA	在庫4,480
MC8641DHX1000GC	NXP	IC MPU MPC86XX 1.0GHZ 1023FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 1023-BCBGA, FCCBGA Supplier Device Package: 1023-FCCBGA (33x33)	パッケージ: 1023-BCBGA, FCCBGA	在庫5,936
KMPC8360ZUAJDGA	NXP	IC MPU MPC83XX 533MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	パッケージ: 740-LBGA	在庫4,016
MPC8347EZQADDB	NXP	IC MPU MPC83XX 266MHZ 620BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-PBGA (29x29)	パッケージ: 620-BBGA Exposed Pad	在庫4,416
MPC8569CVJANKGB	NXP	IC MPU MPC85XX 800MHZ 783FCBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2, DDR3, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (8), 1 Gbps (4) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫9,168
P1014NXN5HFB	NXP	IC MPU Q OR IQ 800MHZ 425TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 425-FBGA Supplier Device Package: 425-TEPBGA I (19x19)	パッケージ: 425-FBGA	在庫3,776
MCF5235CVM150J	NXP	IC MCU 32BIT ROMLESS 256MAPBGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 150MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, WDT Number of I/O: 97 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	パッケージ: 256-LBGA	在庫5,536
MPC5553MVZ132	NXP	IC MCU 32BIT 1.5MB FLASH 324BGA Core Processor: e200z6 Core Size: 32-Bit Speed: 132MHz Connectivity: CAN, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 220 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 324-BBGA Supplier Device Package: 324-TEPBGA (23x23)	パッケージ: 324-BBGA	在庫3,488
SVF312R3K2CKU2	NXP	IC MCU 32BIT ROMLESS 176LQFP Core Processor: ARM? Cortex?-A5 Core Size: 32-Bit Single-Core Speed: 266MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG Peripherals: LCD, SAI Number of I/O: 115 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1.5MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫4,960
MC9S08SH32MTG	NXP	IC MCU 8BIT 32KB FLASH 16TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 13 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	パッケージ: 16-TSSOP (0.173", 4.40mm Width)	在庫4,224
LPC11E66JBD48E	NXP	IC MCU 32BIT 64KB FLASH 48LQFP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Number of I/O: 36 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP	在庫6,544
P5DF081X0/T1AD2060	NXP	IC SAM MIFARE 8PLLCC Type: RFID Reader Frequency: 13.56MHz Standards: ISO 14443, MIFARE Interface: UART Voltage - Supply: 2.7 V ~ 3.3 V Operating Temperature: -25°C ~ 85°C Package / Case: Die Supplier Device Package: Die	パッケージ: Die	在庫3,204
LS2044AXN7V1B	NXP	LS2044A XT 2000 R1.1 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫2,752
MCIMX6X2CVN08AC	NXP	I.MX 6SX ROM PERF ENHAN Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 200MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17x17)	パッケージ: 400-LFBGA	在庫4,736
SPC5742PK1MLQ5R	NXP	1.5MB NVM 2 X E200Z4 CORES 150 Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 150MHz Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Number of I/O: - Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫5,568
SP5746CSK1AMMH6R	NXP	32 BIT DUAL CORE 3M FLASH 384 Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: - Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LBGA Supplier Device Package: 100-MAPBGA (11x11)	パッケージ: 100-LBGA	在庫4,960
S912XDT512J1VAAR	NXP	16-BIT MCU S12X CORE 512KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CANbus, I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 20K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	パッケージ: 80-QFP	在庫6,976
SPC5744PFK1AMMM8	NXP	NXP 32-BIT MCU DUAL CORE POWER Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 180MHz Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Number of I/O: - Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 257-LFBGA Supplier Device Package: 257-MAPBGA (14x14)	パッケージ: 257-LFBGA	在庫5,392
MKL03Z32VFG4R	NXP	KINETIS KL03: 48MHZ CORTEX-M0+ U Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 7x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 16-WQFN Exposed Pad Supplier Device Package: 16-QFN (3x3)	パッケージ: 16-WQFN Exposed Pad	在庫7,744
PCA85276ATT-AY	NXP	AUTOMOTIVE 40 X 4 LCD DRIVER Display Type: LCD Configuration: 40 Segment Interface: I2C Digits or Characters: 10 Characters, 20 Characters, 160 Elements Current - Supply: 3.5 µA Voltage - Supply: 1.8V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 56-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 56-TSSOP	パッケージ: -	Request a Quote
MC33FS4505CAER2	NXP	SYSTEM BASIS CHIP, LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	パッケージ: -	Request a Quote
SAF7751HN-N208W-SK	NXP	CAR DISP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote

MRF6VP41KHR6

NXP

FET RF 2CH 110V 450MHZ NI1230

Transistor Type: LDMOS (Dual)
Frequency: 450MHz
Gain: 20dB
Voltage - Test: 50V
Current Rating: -
Noise Figure: -
Current - Test: 150mA
Power - Output: 1000W
Voltage - Rated: 110V
Package / Case: NI-1230
Supplier Device Package: NI-1230

パッケージ: NI-1230

在庫7,744

TL431MSDT,215

NXP

IC VREF SHUNT ADJ SOT23-3

Reference Type: Shunt
Output Type: Adjustable
Voltage - Output (Min/Fixed): 2.495V
Voltage - Output (Max): 36V
Current - Output: 100mA
Tolerance: ±2%
Temperature Coefficient: -
Noise - 0.1Hz to 10Hz: -
Noise - 10Hz to 10kHz: -
Voltage - Input: -
Current - Supply: -
Current - Cathode: 1mA
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫4,848

MC33910G5ACR2

NXP

IC SYSTEM BASIS CHIP 32LQFP

Applications: System Basis Chip
Current - Supply: 4.5mA
Voltage - Supply: 5.5 V ~ 27 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

パッケージ: 32-LQFP

在庫5,456

MCZ33999EKR2

NXP

IC SW 16OUTPT PWM & SPI 54-SOIC

Switch Type: General Purpose
Number of Outputs: 16
Ratio - Input:Output: 1:16
Output Configuration: Low Side
Output Type: N-Channel
Interface: SPI
Voltage - Load: 5 V ~ 27 V
Voltage - Supply (Vcc/Vdd): 3.1 V ~ 5.5 V
Current - Output (Max): 900mA
Rds On (Typ): 550 mOhm
Input Type: -
Features: PWM Input
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Operating Temperature: -40°C ~ 150°C (TJ)
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-SOICW-EP

パッケージ: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

在庫7,120

74HCT4511N,652

NXP

IC BCD-7SEG LATCH/DEC/DVR 16DIP

Display Type: LED
Configuration: 7 Segment
Interface: BCD
Digits or Characters: -
Current - Supply: -
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

パッケージ: 16-DIP (0.300", 7.62mm)

在庫4,464

PCA9555BS,118

NXP

IC I/O EXPANDER I2C 16B 24HVQFN

Number of I/O: 16
Interface: I2C, SMBus
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 10mA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-HVQFN (4x4)

パッケージ: 24-VFQFN Exposed Pad

在庫135,528

P1014NSE5HHA

NXP

IC MPU Q OR IQ 800MHZ 425TEBGA1

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (1)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Package / Case: 425-FBGA
Supplier Device Package: 425-TEPBGA1

パッケージ: 425-FBGA

在庫4,480

MC8641DHX1000GC

NXP

IC MPU MPC86XX 1.0GHZ 1023FCCBGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 1023-BCBGA, FCCBGA
Supplier Device Package: 1023-FCCBGA (33x33)

パッケージ: 1023-BCBGA, FCCBGA

在庫5,936

KMPC8360ZUAJDGA

NXP

IC MPU MPC83XX 533MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 533MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

パッケージ: 740-LBGA

在庫4,016

MPC8347EZQADDB

NXP

IC MPU MPC83XX 266MHZ 620BGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 620-BBGA Exposed Pad
Supplier Device Package: 620-PBGA (29x29)

パッケージ: 620-BBGA Exposed Pad

在庫4,416

MPC8569CVJANKGB

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (8), 1 Gbps (4)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫9,168

P1014NXN5HFB

NXP

IC MPU Q OR IQ 800MHZ 425TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (1)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 425-FBGA
Supplier Device Package: 425-TEPBGA I (19x19)

パッケージ: 425-FBGA

在庫3,776

MCF5235CVM150J

NXP

IC MCU 32BIT ROMLESS 256MAPBGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 150MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Number of I/O: 97
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

パッケージ: 256-LBGA

在庫5,536

MPC5553MVZ132

NXP

IC MCU 32BIT 1.5MB FLASH 324BGA

Core Processor: e200z6
Core Size: 32-Bit
Speed: 132MHz
Connectivity: CAN, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 220
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
Data Converters: A/D 40x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 324-BBGA
Supplier Device Package: 324-TEPBGA (23x23)

パッケージ: 324-BBGA

在庫3,488

SVF312R3K2CKU2

NXP

IC MCU 32BIT ROMLESS 176LQFP

Core Processor: ARM? Cortex?-A5
Core Size: 32-Bit Single-Core
Speed: 266MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
Peripherals: LCD, SAI
Number of I/O: 115
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 1.5MB
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫4,960

MC9S08SH32MTG

NXP

IC MCU 8BIT 32KB FLASH 16TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 13
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

パッケージ: 16-TSSOP (0.173", 4.40mm Width)

在庫4,224

LPC11E66JBD48E

NXP

IC MCU 32BIT 64KB FLASH 48LQFP

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O: 36
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP

在庫6,544

P5DF081X0/T1AD2060

NXP

IC SAM MIFARE 8PLLCC

Type: RFID Reader
Frequency: 13.56MHz
Standards: ISO 14443, MIFARE
Interface: UART
Voltage - Supply: 2.7 V ~ 3.3 V
Operating Temperature: -25°C ~ 85°C
Package / Case: Die
Supplier Device Package: Die

パッケージ: Die

在庫3,204

LS2044AXN7V1B

NXP

LS2044A XT 2000 R1.1

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫2,752

MCIMX6X2CVN08AC

NXP

I.MX 6SX ROM PERF ENHAN

Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 200MHz, 800MHz
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Package / Case: 400-LFBGA
Supplier Device Package: 400-MAPBGA (17x17)

パッケージ: 400-LFBGA

在庫4,736

SPC5742PK1MLQ5R

NXP

1.5MB NVM 2 X E200Z4 CORES 150

Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Speed: 150MHz
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Number of I/O: -
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫5,568

SP5746CSK1AMMH6R

NXP

32 BIT DUAL CORE 3M FLASH 384

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: -
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 100-LBGA
Supplier Device Package: 100-MAPBGA (11x11)

パッケージ: 100-LBGA

在庫4,960

S912XDT512J1VAAR

NXP

16-BIT MCU S12X CORE 512KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 80MHz
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 59
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 20K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 8x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

パッケージ: 80-QFP

在庫6,976

SPC5744PFK1AMMM8

NXP

NXP 32-BIT MCU DUAL CORE POWER

Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Speed: 180MHz
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Number of I/O: -
Program Memory Size: 2.5MB (2.5M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 257-LFBGA
Supplier Device Package: 257-MAPBGA (14x14)

パッケージ: 257-LFBGA

在庫5,392

MKL03Z32VFG4R

NXP

KINETIS KL03: 48MHZ CORTEX-M0+ U

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number of I/O: 14
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 7x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 16-WQFN Exposed Pad
Supplier Device Package: 16-QFN (3x3)

パッケージ: 16-WQFN Exposed Pad

在庫7,744

PCA85276ATT-AY

NXP

AUTOMOTIVE 40 X 4 LCD DRIVER

Display Type: LCD
Configuration: 40 Segment
Interface: I2C
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Current - Supply: 3.5 µA
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 56-TSSOP

パッケージ: -

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MC33FS4505CAER2

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

パッケージ: -

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SAF7751HN-N208W-SK

NXP

CAR DISP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

Request a Quote