ページ 92 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
MRF6S27050HSR3	NXP	FET RF 68V 2.62GHZ NI-780S Transistor Type: LDMOS Frequency: 2.62GHz Gain: 16dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 500mA Power - Output: 7W Voltage - Rated: 68V Package / Case: NI-780S Supplier Device Package: NI-780S	パッケージ: NI-780S	在庫4,112
74LVC138AD/AUJ	NXP	IC DECODER/DEMUX INV 16SOIC Type: Decoder/Demultiplexer Circuit: 1 x 3:8 Independent Circuits: 1 Current - Output High, Low: 24mA, 24mA Voltage Supply Source: Single Supply Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	パッケージ: 16-SOIC (0.154", 3.90mm Width)	在庫4,288
74HCT9114N,112	NXP	IC NINE WIDE SCHMITT BUFF 20-DIP Logic Type: Inverter Number of Circuits: 9 Number of Inputs: 9 Features: Schmitt Trigger, Open Drain Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Max): 8µA Current - Output High, Low: -, 4mA Logic Level - Low: 0.7 V ~ 0.8 V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Supplier Device Package: 20-DIP Package / Case: 20-DIP (0.300", 7.62mm)	パッケージ: 20-DIP (0.300", 7.62mm)	在庫3,824
74ABT540PW,118	NXP	IC BUFF INVERT 5.5V 20TSSOP Logic Type: Buffer, Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	パッケージ: 20-TSSOP (0.173", 4.40mm Width)	在庫5,872
SCC2681AC1N28,112	NXP	IC UART 28-DIP Features: Configurable GPIO, Internal Oscillator, Timer/Counter Number of Channels: 2, DUART FIFO's: - Protocol: - Data Rate (Max): 1Mbps Voltage - Supply: 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: - With False Start Bit Detection: Yes With Modem Control: - Mounting Type: Through Hole Package / Case: 28-DIP (0.600", 15.24mm) Supplier Device Package: 28-DIP	パッケージ: 28-DIP (0.600", 15.24mm)	在庫7,920
PCA9502BS,151	NXP	IC I/O EXPANDER I2C/SPI 24HVQFN Number of I/O: 8 Interface: I2C, SPI Interrupt Output: No Features: - Output Type: Push-Pull Current - Output Source/Sink: - Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (4x4)	パッケージ: 24-VFQFN Exposed Pad	在庫16,776
MPC8321ECZQADDC	NXP	IC MPU MPC83XX 266MHZ 516BGA Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	パッケージ: 516-BBGA	在庫4,560
MC68LC302CPU16CT	NXP	IC MPU M683XX 16MHZ 100LQFP Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 16MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TA) Security Features: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: 100-LQFP	在庫6,464
P1024NSE5DFB	NXP	IC MPU Q OR IQ 667MHZ 561TEBGA1 Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 561-FBGA Supplier Device Package: 561-TEPBGA1 (23x23)	パッケージ: 561-FBGA	在庫5,488
MPC885ZP66	NXP	IC MPU MPC8XX 66MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (3), 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	パッケージ: 357-BBGA	在庫6,176
MC9S08DV60ACLFR	NXP	IC MCU 8BIT 60KB FLASH 48LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 3K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP	在庫5,200
MC908GZ48VFUE	NXP	IC MCU 8BIT 48KB FLASH 64QFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: CAN, SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 53 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1.5K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 24x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	パッケージ: 64-QFP	在庫3,264
LPC1830FBD144,551	NXP	IC MCU 32BIT ROMLESS 144LQFP Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 180MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 83 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 200K x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: A/D 8x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫2,224
MK10DX128VFM5	NXP	IC MCU 32BIT 128KB FLASH 32QFN Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 24 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 10x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN Exposed Pad (5x5)	パッケージ: 32-VFQFN Exposed Pad	在庫4,160
MPXV7025DPT1	NXP	IC PRESSURE SENSOR 8-SOP Pressure Type: Differential Operating Pressure: ±3.63 PSI (±25 kPa) Output Type: Analog Voltage Output: 0.2 V ~ 4.7 V Accuracy: ±5% Voltage - Supply: 4.75 V ~ 5.25 V Port Size: Male - 0.13" (3.3mm) Tube, Dual Port Style: Barbed Features: Temperature Compensated Termination Style: PCB Maximum Pressure: ±29.01 PSI (±200 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-SMD Module Supplier Device Package: -	パッケージ: 8-SMD Module	在庫8,496
MMA7268QT	NXP	ACCELEROMETER 1.5G 16QFN Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 16-LQFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	パッケージ: 16-LQFN Exposed Pad	在庫2,286
NT2L1011G0DUDV	NXP	IC SMART TAG NFC TYPE2 UNCASED Type: RFID Transponder Frequency: 13.56MHz Standards: ISO 14443 Interface: - Voltage - Supply: - Operating Temperature: -25°C ~ 70°C Package / Case: Die Supplier Device Package: Wafer	パッケージ: Die	在庫3,132
PCF7941ATT/3601/2A	NXP	IC RF REMOTE WIRELESS 20-TSSOP Frequency: - Applications: - Modulation or Protocol: - Data Rate (Max): - Power - Output: - Current - Transmitting: - Data Interface: - Antenna Connector: - Memory Size: - Features: - Voltage - Supply: - Operating Temperature: - Package / Case: -	パッケージ: -	在庫2,430
QN9083CUKZ	NXP	BTLE SOC Type: TxRx + MCU RF Family/Standard: Bluetooth Protocol: Bluetooth v5.0 Modulation: - Frequency: 2.4GHz Data Rate (Max): - Power - Output: 2dBm Sensitivity: -95dBm Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM Serial Interfaces: I2C, SPI, UART, USART, USB GPIO: - Voltage - Supply: 1.62 V ~ 3.6 V Current - Receiving: 3.5mA Current - Transmitting: 3.5mA Operating Temperature: -40°C ~ 85°C Package / Case: -	パッケージ: -	在庫8,946
MW6IC2240GNBR1	NXP	IC PWR AMP RF 4.5W TO272-16GW Frequency: 2.11GHz ~ 2.17GHz P1dB: - Gain: 28dB Noise Figure: - RF Type: Cellular, W-CDMA Voltage - Supply: 28V Current - Supply: 210mA Test Frequency: - Package / Case: TO-272-16 Variant, Gull Wing Supplier Device Package: TO-272 WB-16 GULL	パッケージ: TO-272-16 Variant, Gull Wing	在庫36,696
MC32PF1550A3EP	NXP	POWER MANAGEMENT IC: 3 BUCK REGS Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Current - Supply: - Voltage - Supply: 3.8 V ~ 7 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-QFN (5x5)	パッケージ: 40-VFQFN Exposed Pad	在庫3,456
TDF8599BTH/N1/S422	NXP	IC AMP I2C DIAGNOSTICS 36HSOP Type: Class D Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Max Output Power x Channels @ Load: 150W x 1 @ 2 Ohm; 70W x 2 @ 4 Ohm Voltage - Supply: 8 V ~ 24 V Features: Depop, Differential Inputs, I²C, Mute, Short-Circuit and Thermal Protection Mounting Type: - Operating Temperature: - Supplier Device Package: - Package / Case: -	パッケージ: -	在庫2,992
SCIMX6X3EVK10ABR	NXP	I.MX 6 SERIES 32-BIT MPU ARM CO Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫8,832
SPC5674KAVMM2R	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z7d Core Size: 32-Bit Dual-Core Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V Data Converters: A/D 22x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 257-LFBGA Supplier Device Package: 257-MAPBGA (14x14)	パッケージ: 257-LFBGA	在庫2,160
SPC5742PFK1AMLQ8	NXP	1.5MB NVM 2 X E200Z4 CORES 180 Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 180MHz Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Number of I/O: - Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫7,408
SPC5604BAMLL4R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 28x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: 100-LQFP	在庫7,744
S9S12G48J1VLCR	NXP	IC MCU 16BIT 48KB FLASH 32LQFP Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	パッケージ: -	Request a Quote
S9S12G128J0CLHR	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: -	Request a Quote

MRF6S27050HSR3

NXP

FET RF 68V 2.62GHZ NI-780S

Transistor Type: LDMOS
Frequency: 2.62GHz
Gain: 16dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 500mA
Power - Output: 7W
Voltage - Rated: 68V
Package / Case: NI-780S
Supplier Device Package: NI-780S

パッケージ: NI-780S

在庫4,112

74LVC138AD/AUJ

NXP

IC DECODER/DEMUX INV 16SOIC

Type: Decoder/Demultiplexer
Circuit: 1 x 3:8
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Voltage - Supply: 1.2 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

パッケージ: 16-SOIC (0.154", 3.90mm Width)

在庫4,288

74HCT9114N,112

NXP

IC NINE WIDE SCHMITT BUFF 20-DIP

Logic Type: Inverter
Number of Circuits: 9
Number of Inputs: 9
Features: Schmitt Trigger, Open Drain
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Max): 8µA
Current - Output High, Low: -, 4mA
Logic Level - Low: 0.7 V ~ 0.8 V
Logic Level - High: 2V
Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Supplier Device Package: 20-DIP
Package / Case: 20-DIP (0.300", 7.62mm)

パッケージ: 20-DIP (0.300", 7.62mm)

在庫3,824

74ABT540PW,118

NXP

IC BUFF INVERT 5.5V 20TSSOP

Logic Type: Buffer, Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

パッケージ: 20-TSSOP (0.173", 4.40mm Width)

在庫5,872

SCC2681AC1N28,112

NXP

IC UART 28-DIP

Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Number of Channels: 2, DUART
FIFO's: -
Protocol: -
Data Rate (Max): 1Mbps
Voltage - Supply: 5V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: -
With False Start Bit Detection: Yes
With Modem Control: -
Mounting Type: Through Hole
Package / Case: 28-DIP (0.600", 15.24mm)
Supplier Device Package: 28-DIP

パッケージ: 28-DIP (0.600", 15.24mm)

在庫7,920

PCA9502BS,151

NXP

IC I/O EXPANDER I2C/SPI 24HVQFN

Number of I/O: 8
Interface: I2C, SPI
Interrupt Output: No
Features: -
Output Type: Push-Pull
Current - Output Source/Sink: -
Clock Frequency: 400kHz
Voltage - Supply: 2.3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-HVQFN (4x4)

パッケージ: 24-VFQFN Exposed Pad

在庫16,776

MPC8321ECZQADDC

NXP

IC MPU MPC83XX 266MHZ 516BGA

Core Processor: PowerPC e300c2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography
Package / Case: 516-BBGA
Supplier Device Package: 516-FPBGA (27x27)

パッケージ: 516-BBGA

在庫4,560

MC68LC302CPU16CT

NXP

IC MPU M683XX 16MHZ 100LQFP

Core Processor: M68000
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Speed: 16MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

在庫6,464

P1024NSE5DFB

NXP

IC MPU Q OR IQ 667MHZ 561TEBGA1

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 561-FBGA
Supplier Device Package: 561-TEPBGA1 (23x23)

パッケージ: 561-FBGA

在庫5,488

MPC885ZP66

NXP

IC MPU MPC8XX 66MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (3), 10/100 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: Cryptography
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

パッケージ: 357-BBGA

在庫6,176

MC9S08DV60ACLFR

NXP

IC MCU 8BIT 60KB FLASH 48LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 60KB (60K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 3K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP

在庫5,200

MC908GZ48VFUE

NXP

IC MCU 8BIT 48KB FLASH 64QFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: CAN, SCI, SPI
Peripherals: LVD, POR, PWM
Number of I/O: 53
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1.5K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 24x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-QFP
Supplier Device Package: 64-QFP (14x14)

パッケージ: 64-QFP

在庫3,264

LPC1830FBD144,551

NXP

IC MCU 32BIT ROMLESS 144LQFP

Core Processor: ARM? Cortex?-M3
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O: 83
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 200K x 8
Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
Data Converters: A/D 8x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫2,224

MK10DX128VFM5

NXP

IC MCU 32BIT 128KB FLASH 32QFN

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 24
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 10x16b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-QFN Exposed Pad (5x5)

パッケージ: 32-VFQFN Exposed Pad

在庫4,160

MPXV7025DPT1

NXP

IC PRESSURE SENSOR 8-SOP

Pressure Type: Differential
Operating Pressure: ±3.63 PSI (±25 kPa)
Output Type: Analog Voltage
Output: 0.2 V ~ 4.7 V
Accuracy: ±5%
Voltage - Supply: 4.75 V ~ 5.25 V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Port Style: Barbed
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: ±29.01 PSI (±200 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 8-SMD Module
Supplier Device Package: -

パッケージ: 8-SMD Module

在庫8,496

MMA7268QT

NXP

ACCELEROMETER 1.5G 16QFN

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 16-LQFN Exposed Pad
Supplier Device Package: 16-QFN (6x6)

パッケージ: 16-LQFN Exposed Pad

在庫2,286

NT2L1011G0DUDV

NXP

IC SMART TAG NFC TYPE2 UNCASED

Type: RFID Transponder
Frequency: 13.56MHz
Standards: ISO 14443
Interface: -
Voltage - Supply: -
Operating Temperature: -25°C ~ 70°C
Package / Case: Die
Supplier Device Package: Wafer

パッケージ: Die

在庫3,132

PCF7941ATT/3601/2A

NXP

IC RF REMOTE WIRELESS 20-TSSOP

Frequency: -
Applications: -
Modulation or Protocol: -
Data Rate (Max): -
Power - Output: -
Current - Transmitting: -
Data Interface: -
Antenna Connector: -
Memory Size: -
Features: -
Voltage - Supply: -
Operating Temperature: -
Package / Case: -

パッケージ: -

在庫2,430

QN9083CUKZ

NXP

BTLE SOC

Type: TxRx + MCU
RF Family/Standard: Bluetooth
Protocol: Bluetooth v5.0
Modulation: -
Frequency: 2.4GHz
Data Rate (Max): -
Power - Output: 2dBm
Sensitivity: -95dBm
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Serial Interfaces: I2C, SPI, UART, USART, USB
GPIO: -
Voltage - Supply: 1.62 V ~ 3.6 V
Current - Receiving: 3.5mA
Current - Transmitting: 3.5mA
Operating Temperature: -40°C ~ 85°C
Package / Case: -

パッケージ: -

在庫8,946

MW6IC2240GNBR1

NXP

IC PWR AMP RF 4.5W TO272-16GW

Frequency: 2.11GHz ~ 2.17GHz
P1dB: -
Gain: 28dB
Noise Figure: -
RF Type: Cellular, W-CDMA
Voltage - Supply: 28V
Current - Supply: 210mA
Test Frequency: -
Package / Case: TO-272-16 Variant, Gull Wing
Supplier Device Package: TO-272 WB-16 GULL

パッケージ: TO-272-16 Variant, Gull Wing

在庫36,696

MC32PF1550A3EP

NXP

POWER MANAGEMENT IC: 3 BUCK REGS

Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Current - Supply: -
Voltage - Supply: 3.8 V ~ 7 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-QFN (5x5)

パッケージ: 40-VFQFN Exposed Pad

在庫3,456

TDF8599BTH/N1/S422

NXP

IC AMP I2C DIAGNOSTICS 36HSOP

Type: Class D
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Max Output Power x Channels @ Load: 150W x 1 @ 2 Ohm; 70W x 2 @ 4 Ohm
Voltage - Supply: 8 V ~ 24 V
Features: Depop, Differential Inputs, I²C, Mute, Short-Circuit and Thermal Protection
Mounting Type: -
Operating Temperature: -
Supplier Device Package: -
Package / Case: -

パッケージ: -

在庫2,992

SCIMX6X3EVK10ABR

NXP

I.MX 6 SERIES 32-BIT MPU ARM CO

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫8,832

SPC5674KAVMM2R

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z7d
Core Size: 32-Bit Dual-Core
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
Data Converters: A/D 22x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 257-LFBGA
Supplier Device Package: 257-MAPBGA (14x14)

パッケージ: 257-LFBGA

在庫2,160

SPC5742PFK1AMLQ8

NXP

1.5MB NVM 2 X E200Z4 CORES 180

Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Speed: 180MHz
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Number of I/O: -
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫7,408

SPC5604BAMLL4R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 79
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 28x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

在庫7,744

S9S12G48J1VLCR

NXP

IC MCU 16BIT 48KB FLASH 32LQFP

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

パッケージ: -

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S9S12G128J0CLHR

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: -

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