ページ 32 - Preci-Dip 製品 - IC用ソケット、トランジスタ | Heisener Electronics
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Preci-Dip 製品 - IC用ソケット、トランジスタ

レコード 2,821
ページ  32/101
画像
部品番号
メーカ
説明
パッケージ
在庫
数量
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
614-87-632-41-001101
Preci-Dip

CONN IC DIP SOCKET 32POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 32 (2 x 16)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫4,320
32 (2 x 16)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
614-87-432-41-001101
Preci-Dip

CONN IC DIP SOCKET 32POS GOLD

  • Type: DIP, 0.4" (10.16mm) Row Spacing
  • Number of Positions or Pins (Grid): 32 (2 x 16)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫3,906
32 (2 x 16)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
123-83-318-41-001101
Preci-Dip

CONN IC DIP SOCKET 18POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 18 (2 x 9)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫5,094
18 (2 x 9)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
122-83-318-41-001101
Preci-Dip

CONN IC DIP SOCKET 18POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 18 (2 x 9)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫2,934
18 (2 x 9)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
299-87-210-10-001101
Preci-Dip

CONN IC DIP SOCKET 10POS GOLD

  • Type: DIP, 0.2" (5.08mm) Row Spacing
  • Number of Positions or Pins (Grid): 10 (2 x 5)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole, Right Angle, Horizontal
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫4,284
10 (2 x 5)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
117-87-620-41-105101
Preci-Dip

CONN IC DIP SOCKET 20POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 20 (2 x 10)
  • Pitch - Mating: 0.070" (1.78mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.070" (1.78mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫3,636
20 (2 x 10)
0.070" (1.78mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.070" (1.78mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
114-83-628-41-134161
Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫3,726
28 (2 x 14)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
114-83-628-41-117101
Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫5,274
28 (2 x 14)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
114-83-428-41-117101
Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.4" (10.16mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫5,364
28 (2 x 14)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
114-83-328-41-134161
Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫5,994
28 (2 x 14)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
114-83-328-41-117101
Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫5,724
28 (2 x 14)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
116-83-422-41-006101
Preci-Dip

CONN IC DIP SOCKET 22POS GOLD

  • Type: DIP, 0.4" (10.16mm) Row Spacing
  • Number of Positions or Pins (Grid): 22 (2 x 11)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Elevated, Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫8,802
22 (2 x 11)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
116-83-322-41-006101
Preci-Dip

CONN IC DIP SOCKET 22POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 22 (2 x 11)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Elevated, Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫4,680
22 (2 x 11)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
116-83-318-41-012101
Preci-Dip

CONN IC DIP SOCKET 18POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 18 (2 x 9)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Elevated, Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫3,544
18 (2 x 9)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
116-83-420-41-003101
Preci-Dip

CONN IC DIP SOCKET 20POS GOLD

  • Type: DIP, 0.4" (10.16mm) Row Spacing
  • Number of Positions or Pins (Grid): 20 (2 x 10)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Elevated, Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫8,568
20 (2 x 10)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
116-83-320-41-003101
Preci-Dip

CONN IC DIP SOCKET 20POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 20 (2 x 10)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Elevated, Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫4,266
20 (2 x 10)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
116-87-420-41-008101
Preci-Dip

CONN IC DIP SOCKET 20POS GOLD

  • Type: DIP, 0.4" (10.16mm) Row Spacing
  • Number of Positions or Pins (Grid): 20 (2 x 10)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Elevated, Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫2,736
20 (2 x 10)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
114-87-640-41-134161
Preci-Dip

CONN IC DIP SOCKET 40POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 40 (2 x 20)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫7,992
40 (2 x 20)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
114-87-640-41-117101
Preci-Dip

CONN IC DIP SOCKET 40POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 40 (2 x 20)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫4,644
40 (2 x 20)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
110-83-318-41-105161
Preci-Dip

CONN IC DIP SOCKET 18POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 18 (2 x 9)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫7,902
18 (2 x 9)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
116-87-628-41-018101
Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Elevated, Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫7,272
28 (2 x 14)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
116-87-428-41-018101
Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.4" (10.16mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Elevated, Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫3,492
28 (2 x 14)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
116-87-328-41-018101
Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Elevated, Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫2,592
28 (2 x 14)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
117-83-628-41-005101
Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.070" (1.78mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.070" (1.78mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫6,300
28 (2 x 14)
0.070" (1.78mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.070" (1.78mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
117-83-428-41-005101
Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.4" (10.16mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.070" (1.78mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.070" (1.78mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫8,316
28 (2 x 14)
0.070" (1.78mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.070" (1.78mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
114-83-328-41-134191
Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫6,012
28 (2 x 14)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
614-83-420-31-012101
Preci-Dip

CONN IC DIP SOCKET 20POS GOLD

  • Type: DIP, 0.4" (10.16mm) Row Spacing
  • Number of Positions or Pins (Grid): 20 (2 x 10)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫2,340
20 (2 x 10)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
614-83-320-31-012101
Preci-Dip

CONN IC DIP SOCKET 20POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 20 (2 x 10)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
パッケージ: -
在庫8,622
20 (2 x 10)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C