Preci-Dip 製品 - IC用ソケット、トランジスタ

514-87-600M35-001148

Preci-Dip

CONN SOCKET BGA 600POS GOLD

• Type: BGA
• Number of Positions or Pins (Grid): 600 (35 x 35)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Surface Mount
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

550-10-600M35-001166

Preci-Dip

BGA PIN ADAPTER 1.27MM SMD

• Type: BGA
• Number of Positions or Pins (Grid): 600 (35 x 35)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

518-77-360M19-001106

Preci-Dip

CONN SOCKET PGA 360POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 360 (19 x 19)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Surface Mount
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: Flash
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

514-83-480M29-001148

Preci-Dip

CONN SOCKET BGA 480POS GOLD

• Type: BGA
• Number of Positions or Pins (Grid): 480 (29 x 29)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 29.5µin (0.75µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Surface Mount
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

514-83-478M26-131148

Preci-Dip

CONN SOCKET BGA 478POS GOLD

• Type: BGA
• Number of Positions or Pins (Grid): 478 (26 x 26)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 29.5µin (0.75µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Surface Mount
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

558-10-388M26-001101

Preci-Dip

PGA SOLDER TAIL 1.27MM

• Type: PGA
• Number of Positions or Pins (Grid): 388 (26 x 26)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

518-77-357M19-001106

Preci-Dip

CONN SOCKET PGA 357POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 357 (19 x 19)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Surface Mount
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: Flash
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

518-77-356M26-001106

Preci-Dip

CONN SOCKET PGA 356POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 356 (26 x 26)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Surface Mount
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: Flash
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

518-77-360M19-001105

Preci-Dip

CONN SOCKET PGA 360POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 360 (19 x 19)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: Flash
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

518-77-352M26-001106

Preci-Dip

CONN SOCKET PGA 352POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 352 (26 x 26)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Surface Mount
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: Flash
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

558-10-360M19-001104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

• Type: BGA
• Number of Positions or Pins (Grid): 360 (19 x 19)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Brass
• Mounting Type: Surface Mount
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

514-87-576M30-001148

Preci-Dip

CONN SOCKET BGA 576POS GOLD

• Type: BGA
• Number of Positions or Pins (Grid): 576 (30 x 30)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Surface Mount
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

518-77-357M19-001105

Preci-Dip

CONN SOCKET PGA 357POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 357 (19 x 19)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: Flash
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

518-77-356M26-001105

Preci-Dip

CONN SOCKET PGA 356POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 356 (26 x 26)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: Flash
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

550-10-576M30-001166

Preci-Dip

BGA PIN ADAPTER 1.27MM SMD

• Type: BGA
• Number of Positions or Pins (Grid): 576 (30 x 30)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

558-10-357M19-001104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

• Type: BGA
• Number of Positions or Pins (Grid): 357 (19 x 19)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Brass
• Mounting Type: Surface Mount
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

550-10-400M20-000152

Preci-Dip

BGA SOLDER TAIL

• Type: BGA
• Number of Positions or Pins (Grid): 400 (20 x 20)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Brass
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

558-10-356M26-001104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

• Type: BGA
• Number of Positions or Pins (Grid): 356 (26 x 26)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Brass
• Mounting Type: Surface Mount
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

518-77-352M26-001105

Preci-Dip

CONN SOCKET PGA 352POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 352 (26 x 26)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: Flash
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

558-10-352M26-001104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

• Type: BGA
• Number of Positions or Pins (Grid): 352 (26 x 26)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Brass
• Mounting Type: Surface Mount
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

514-83-456M26-001148

Preci-Dip

CONN SOCKET BGA 456POS GOLD

• Type: BGA
• Number of Positions or Pins (Grid): 456 (26 x 26)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 29.5µin (0.75µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Surface Mount
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

514-87-560M33-001148

Preci-Dip

CONN SOCKET BGA 560POS GOLD

• Type: BGA
• Number of Positions or Pins (Grid): 560 (33 x 33)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Surface Mount
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

550-10-560M33-001166

Preci-Dip

BGA PIN ADAPTER 1.27MM SMD

• Type: BGA
• Number of Positions or Pins (Grid): 560 (33 x 33)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

550-10-388M26-001152

Preci-Dip

BGA SOLDER TAIL

• Type: BGA
• Number of Positions or Pins (Grid): 388 (26 x 26)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Brass
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

558-10-360M19-001101

Preci-Dip

PGA SOLDER TAIL 1.27MM

• Type: PGA
• Number of Positions or Pins (Grid): 360 (19 x 19)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

558-10-357M19-001101

Preci-Dip

PGA SOLDER TAIL 1.27MM

• Type: PGA
• Number of Positions or Pins (Grid): 357 (19 x 19)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

558-10-356M26-001101

Preci-Dip

PGA SOLDER TAIL 1.27MM

• Type: PGA
• Number of Positions or Pins (Grid): 356 (26 x 26)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

パッケージ: -

558-10-352M26-001101

Preci-Dip

PGA SOLDER TAIL 1.27MM

• Type: PGA
• Number of Positions or Pins (Grid): 352 (26 x 26)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

パッケージ: -