Trenz Electronic GmbH 製品

TE0729-02-2IF-K

Trenz Electronic GmbH

SOM ZYNQ XC7Z020-2I 512MB RTC

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7020)
• Speed: -
• Flash Size: 32MB
• RAM Size: 512MB
• Connector Type: Samtec BTE
• Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
• Operating Temperature: -40°C ~ 85°C

パッケージ: -

TE0712-02-100-2C3

Trenz Electronic GmbH

SOM ARTIX7 XC7A100T-2C 1GB LOPRO

• Module/Board Type: FPGA
• Core Processor: Artix-7 A100T
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: 0°C ~ 70°C

パッケージ: -

TE0630-01IBF

Trenz Electronic GmbH

SOM SPARTAN-6 1GB DDR3

• Module/Board Type: FPGA, USB Core
• Core Processor: Spartan-6 LX-75
• Co-Processor: Cypress EZ-USB FX2LP
• Speed: 100MHz
• Flash Size: 8MB
• RAM Size: 128MB
• Connector Type: B2B
• Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm)
• Operating Temperature: -40°C ~ 85°C

パッケージ: -

TE0720-03-1CR

Trenz Electronic GmbH

SOM SOC 7Z020-1CLG484C 256MB DDR

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7020)
• Speed: -
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: 0°C ~ 70°C

パッケージ: -

TE0820-02-03EG-1EA

Trenz Electronic GmbH

SOM USCALE+ XCZU3EG-1S 1GB DDR4

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

パッケージ: -

TE0820-03-03CG-1ED

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 1GB 128MB

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 1GB
• Connector Type: B2B
• Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
• Operating Temperature: 0°C ~ 85°C

パッケージ: -

TE0630-02IBF

Trenz Electronic GmbH

IC MOD SPARTAN-6 100MHZ 128MB

• Module/Board Type: FPGA, USB Core
• Core Processor: Spartan-6 LX-75
• Co-Processor: Cypress EZ-USB FX2LP
• Speed: 100MHz
• Flash Size: 8MB
• RAM Size: 128MB
• Connector Type: B2B
• Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm)
• Operating Temperature: -40°C ~ 85°C

パッケージ: -

AM0010-02-5DE21MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

• Module/Board Type: MPU Core
• Core Processor: Zynq™ UltraScale+™ ZU5EV-1E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 4GB
• Connector Type: Board-to-Board (BTB) Socket
• Size / Dimension: 2.220" L x 1.575" W (56.40mm x 40.00mm)
• Operating Temperature: 0°C ~ 85°C

パッケージ: -

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TE0726-03-41C64-A

Trenz Electronic GmbH

IC MODULE ZYNQBERRY

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7010)
• Speed: -
• Flash Size: 16MB
• RAM Size: 512MB
• Connector Type: CSI, DSI
• Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 70°C

パッケージ: -

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TE0600-03-52I11-C

Trenz Electronic GmbH

IC MODULE GIGABEE

• Module/Board Type: FPGA Core
• Core Processor: Spartan-6 LX-45
• Co-Processor: -
• Speed: 125MHz
• Flash Size: 16MB
• RAM Size: 256MB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

パッケージ: -

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TEM0007-01-CHE11-A

Trenz Electronic GmbH

MICROCHIP POLARFIRE SOC FPGA 250

• Module/Board Type: FPGA
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: 64MB
• RAM Size: 1GB
• Connector Type: B2B
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -

パッケージ: -

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TE0714-04-42I-7-C

Trenz Electronic GmbH

IC MODULE ARTIX-7

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

パッケージ: -

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TE0630-03-63I22-A

Trenz Electronic GmbH

IC MOD SPARTAN-6 100MHZ 128MB

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

パッケージ: -

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TE0710-02-72I21-A

Trenz Electronic GmbH

MOD FPGA ARTIX7 100T 512MB 78BGA

• Module/Board Type: FPGA Core
• Core Processor: Artix-7 A100T
• Co-Processor: -
• Speed: 100MHz
• Flash Size: 32MB
• RAM Size: 512MB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

パッケージ: -

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TE0715-04-51I33-L

Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7015)
• Speed: 125MHz
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

パッケージ: -

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TE0808-04-6BE21-L

Trenz Electronic GmbH

IC MOD SOM MPSOC 4GB XCZU6EG

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 4GB
• Connector Type: B2B
• Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
• Operating Temperature: 0°C ~ 85°C

パッケージ: -

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TE0820-04-2BE21FA

Trenz Electronic GmbH

MOD MPSOC ZU2EG-1E 2GB DDR4 IND

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 2GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 85°C

パッケージ: -

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TE0713-02-72C46-A

Trenz Electronic GmbH

IC SOM ARTIX-7 FPGA DDR3

• Module/Board Type: FPGA Core
• Core Processor: Artix-7 XC7A100T-2FGG484C
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: B2B
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 85°C

パッケージ: -

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TE0720-03-31C33MA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7014S)
• Speed: 766MHz
• Flash Size: 8GB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 70°C

パッケージ: -

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TE0803-03-3BE11-AS

Trenz Electronic GmbH

MODULE SOM TE0803-03

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 2GB
• Connector Type: B2B
• Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
• Operating Temperature: 0°C ~ 85°C

パッケージ: -

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TE0820-05-3BE21ML

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

• Module/Board Type: MPU Core
• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
• Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E
• Speed: -
• Flash Size: 128MB
• RAM Size: 2GB
• Connector Type: Pin(s)
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 85°C

パッケージ: -

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TE0745-03-82I31-A

Trenz Electronic GmbH

SOM WITH AMD ZYNQ 7035-2I, 1 GBY

• Module/Board Type: MPU Core
• Core Processor: ARM Cortex-A9
• Co-Processor: Xilinx Zynq 7035 SoC XC7Z035-2FBG676I
• Speed: -
• Flash Size: 64MB
• RAM Size: 1GB
• Connector Type: Board-to-Board (BTB) Socket - 250
• Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
• Operating Temperature: -40°C ~ 85°C

パッケージ: -

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TE0712-02-71I36-A

Trenz Electronic GmbH

FPGA MODULE ARTIX7

• Module/Board Type: FPGA Core
• Core Processor: Artix-7 A100T
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

パッケージ: -

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TE0745-03-93E31-A

Trenz Electronic GmbH

SOM WITH AMD ZYNQ 7045-3E, 1 GBY

• Module/Board Type: MPU Core
• Core Processor: ARM Cortex-A9
• Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-3FFG676E
• Speed: -
• Flash Size: 64MB
• RAM Size: 1GB
• Connector Type: Samtec ST5
• Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
• Operating Temperature: 0°C ~ 85°C

パッケージ: -

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TE0818-02-9BE81-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH AMD

• Module/Board Type: MPU Core
• Core Processor: Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 4GB
• Connector Type: Board-to-Board (BTB) Socket - 4 x 240
• Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
• Operating Temperature: 0°C ~ 85°C

パッケージ: -

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TE0808-04-9BE21-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 4GB 128MB

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 4GB
• Connector Type: B2B
• Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
• Operating Temperature: 0°C ~ 85°C

パッケージ: -

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TE0630-03-82I12-A

Trenz Electronic GmbH

FPGA MODULE WITH AMD SPARTAN 6 L

• Module/Board Type: FPGA
• Core Processor: Xilinx Spartan™ 6 XC6SLX150-2CSG484I
• Co-Processor: -
• Speed: -
• Flash Size: 8MB
• RAM Size: 128MB
• Connector Type: Board-to-Board (BTB) Socket - 80
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

パッケージ: -

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TE0600-04-72C11-A

Trenz Electronic GmbH

IC MODULE GIGABEE

• Module/Board Type: FPGA
• Core Processor: Xilinx Spartan™ 6 XC6SLX100-2FGG484C
• Co-Processor: -
• Speed: 125MHz
• Flash Size: 16MB
• RAM Size: 128MB
• Connector Type: B2B
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 70°C

パッケージ: -

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