ページ 174 - Xilinx Inc. 製品 - 組み込み - FPGA（フィールドプログラマブルゲートアレイ） | Heisener Electronics
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Xilinx Inc. 製品 - 組み込み - FPGA（フィールドプログラマブルゲートアレイ）

レコード 5,652
ページ  174/202
画像
部品番号
メーカ
説明
パッケージ
在庫
数量
Number of Logic Elements/Cells
Total RAM Bits
Number of I/O
Number of Gates
Voltage - Supply
Mounting Type
Operating Temperature
Package / Case
Supplier Device Package
hot XCV1600E-6FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 512
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
パッケージ: 680-LBGA Exposed Pad
在庫5,456
34992
589824
512
2188742
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
XCV1600E-6FG1156I
Xilinx Inc.

IC FPGA 724 I/O 1156FBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 724
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA
  • Supplier Device Package: 1156-FBGA (35x35)
パッケージ: 1156-BBGA
在庫7,824
34992
589824
724
2188742
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
1156-BBGA
1156-FBGA (35x35)
hot XCV1600E-6FG1156C
Xilinx Inc.

IC FPGA 724 I/O 1156FBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 724
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA
  • Supplier Device Package: 1156-FBGA (35x35)
パッケージ: 1156-BBGA
在庫5,520
34992
589824
724
2188742
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
1156-BBGA
1156-FBGA (35x35)
XCV1600E-6BG560I
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 404
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
パッケージ: 560-LBGA, Metal
在庫4,912
34992
589824
404
2188742
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
hot XCV1600E-6BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 404
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
パッケージ: 560-LBGA, Metal
在庫8,676
34992
589824
404
2188742
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
hot XCV150-6PQ240C
Xilinx Inc.

IC FPGA 166 I/O 240QFP

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 166
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
パッケージ: 240-BFQFP
在庫4,016
3888
49152
166
164674
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP
240-PQFP (32x32)
hot XCV150-6FG456C
Xilinx Inc.

IC FPGA 260 I/O 456FBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 260
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
パッケージ: 456-BBGA
在庫5,648
3888
49152
260
164674
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
456-BBGA
456-FBGA (23x23)
XCV150-6FG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 176
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
パッケージ: 256-BGA
在庫5,712
3888
49152
176
164674
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
256-BGA
256-FBGA (17x17)
hot XCV150-6BG352C
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 260
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
パッケージ: 352-LBGA, Metal
在庫20,940
3888
49152
260
164674
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)
hot XCV150-6BG256C
Xilinx Inc.

IC FPGA 180 I/O 256BGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 180
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (27x27)
パッケージ: 256-BBGA
在庫4,736
3888
49152
180
164674
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
256-BBGA
256-PBGA (27x27)
hot XCV150-5PQ240I
Xilinx Inc.

IC FPGA 166 I/O 240QFP

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 166
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
パッケージ: 240-BFQFP
在庫12,756
3888
49152
166
164674
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
240-BFQFP
240-PQFP (32x32)
hot XCV150-5PQ240C
Xilinx Inc.

IC FPGA 166 I/O 240QFP

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 166
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
パッケージ: 240-BFQFP
在庫3,696
3888
49152
166
164674
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP
240-PQFP (32x32)
XCV150-5FG456I
Xilinx Inc.

IC FPGA 260 I/O 456FBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 260
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
パッケージ: 456-BBGA
在庫4,736
3888
49152
260
164674
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
456-BBGA
456-FBGA (23x23)
XCV150-5FG456C
Xilinx Inc.

IC FPGA 260 I/O 456FBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 260
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
パッケージ: 456-BBGA
在庫2,048
3888
49152
260
164674
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
456-BBGA
456-FBGA (23x23)
XCV150-5FG256I
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 176
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
パッケージ: 256-BGA
在庫3,968
3888
49152
176
164674
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
256-BGA
256-FBGA (17x17)
XCV150-5FG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 176
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
パッケージ: 256-BGA
在庫3,344
3888
49152
176
164674
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
256-BGA
256-FBGA (17x17)
hot XCV150-5BG352I
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 260
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
パッケージ: 352-LBGA, Metal
在庫3,968
3888
49152
260
164674
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)
hot XCV150-5BG352C
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 260
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
パッケージ: 352-LBGA, Metal
在庫30,372
3888
49152
260
164674
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)
hot XCV150-5BG256I
Xilinx Inc.

IC FPGA 180 I/O 256BGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 180
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (27x27)
パッケージ: 256-BBGA
在庫31,392
3888
49152
180
164674
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
256-BBGA
256-PBGA (27x27)
XCV150-5BG256C
Xilinx Inc.

IC FPGA 180 I/O 256BGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 180
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (27x27)
パッケージ: 256-BBGA
在庫2,336
3888
49152
180
164674
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
256-BBGA
256-PBGA (27x27)
hot XCV150-4PQ240I
Xilinx Inc.

IC FPGA 166 I/O 240QFP

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 166
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
パッケージ: 240-BFQFP
在庫7,896
3888
49152
166
164674
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
240-BFQFP
240-PQFP (32x32)
hot XCV150-4PQ240C
Xilinx Inc.

IC FPGA 166 I/O 240QFP

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 166
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
パッケージ: 240-BFQFP
在庫6,848
3888
49152
166
164674
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP
240-PQFP (32x32)
hot XCV150-4FG456I
Xilinx Inc.

IC FPGA 260 I/O 456FBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 260
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
パッケージ: 456-BBGA
在庫4,752
3888
49152
260
164674
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
456-BBGA
456-FBGA (23x23)
XCV150-4FG456C
Xilinx Inc.

IC FPGA 260 I/O 456FBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 260
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
パッケージ: 456-BBGA
在庫4,880
3888
49152
260
164674
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
456-BBGA
456-FBGA (23x23)
XCV150-4FG256I
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 176
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
パッケージ: 256-BGA
在庫7,952
3888
49152
176
164674
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
256-BGA
256-FBGA (17x17)
hot XCV150-4FG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 176
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
パッケージ: 256-BGA
在庫3,584
3888
49152
176
164674
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
256-BGA
256-FBGA (17x17)
hot XCV150-4BG352I
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 260
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
パッケージ: 352-LBGA, Metal
在庫5,776
3888
49152
260
164674
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)
hot XCV150-4BG352C
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 260
  • Number of Gates: 164674
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
パッケージ: 352-LBGA, Metal
在庫17,124
3888
49152
260
164674
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)