Microchip has introduced a new integrated switching power supply module specifically designed for highly restricted telecommunications, industrial and solid state drive (SSD) applications.
The unit is packaged in a thermally enhanced package that integrates the inductor and passive components into a single molded power converter. The slim 10mm x 6mm x 2mm package saves space, simplifies board design, and eliminates concerns about passive components that can introduce unexpected electromagnetic interference (EMI).
According to IHS data, by 2019, the global power module market is expected to account for nearly one-third (30%) of the power semiconductor market, and its growth rate will be twice that of power discrete devices (from 2014 to 2019). Microchip is well positioned in this market, in part because it has developed a process that places all passive components on a thermally enhanced leadframe that reduces the distance between components to maximize Ground reduces radiation and improves heat dissipation.
The MIC45404 integrates one of the thinnest integrated magnetic inductors in a 19V, 5A point-of-load buck converter. Integrated components include the controller, metal-oxide-semiconductor field-effect transistor (MOSFET), feedback path, and pulse-width modulation (PWM) switching regulator. The small form factor of the MIC45404 module allows it to be placed on the back of a PCB, on a daughter card, or at point-of-load power conversion. Other locations in telecommunications and industrial applications may limit vertical height.
The MIC45404 is available now, sampling and mass production in a 10mm x 2mm x 6mm QFN package. The company said that pin-selectable output voltage, switching frequency and current limit further increase design flexibility and save space.
The company also introduced the MIC45404 Evaluation Kit (MIC45404YMP-EV), which can utilize integrated switching power supply modules for application development.
