Smiths Interconnect Announces Expansion of DaVinci Test Head Product Line | Heisener Electronics
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Smiths Interconnect Announces Expansion of DaVinci Test Head Product Line

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投稿日: 2022-09-10, SMC Corporation of America

Smiths Interconnect, the world's leading supplier of semiconductor test solutions, announced the expansion of its DaVinci high-speed test family with the introduction of the DaVinci Micro Test Socket, which is designed for high-speed testing with a minimum pitch of 0.35mm.

Various connected devices and data-intensive applications continue to drive the demand for high-performance and adaptable computing solutions. Mobile devices such as phones, tablets, and automotive infotainment systems have the most complex system-on-a-chip (SoC) ever built, and these SoCs face the challenge of combining multiple processing components such as CPUs, GPUs, AI engines, camera processors, memory and 5G modem into a single chip to save space, cost and power consumption challenges.

The need to add more functionality on the smallest possible chip size has led to a reduction in the pitch of integrated circuits below 500 microns. At the same time, by integrating key system components on a single chip, the increase in chip performance can cause pin-to-pin noise, or what is known as "crosstalk" in testing. Although test engineers have made great efforts in package design, shrinking chip size will inevitably make high-speed signals susceptible to crosstalk, resulting in false test failures.

Smiths Interconnect aims to break through this testing bottleneck with DaVinci technology. DaVinci Micro test sockets make full use of DaVinci coaxial technology for integrated circuit (IC) applications, achieve 350µm pitch and provide ideal pin-to-pin isolation, reduce the impact of crosstalk during testing, and greatly improve chip performance testing. accuracy. Its innovative design protects small diameter signal probes, ensuring products can be deployed and withstand harsh test environments.

"The introduction of the DaVinci Micro high-speed test socket will enable Smiths Interconnect's customers to significantly increase innovation in high-performance computing, graphics and adaptive SoCs technology," said Brian Mitchell, general manager and vice president of Smiths Intercom's Semiconductor Test Business Unit. "The fully shielded signal path of the DaVinci Micro effectively eliminates crosstalk issues during testing and significantly improves test performance, which sets it apart from other non-DaVinci series products.

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