Versarien's thin metal foam heat sink provides high thermal performance for thin applications.
The heat sink uses VersarienCu microporous metal copper foam. The interconnected pores of the foam create a large surface area. The surface area combined with the high thermal conductivity of copper can reduce the height of the heat sink without sacrificing performance.
A thin, hard, high-temperature copper oxide layer increases the emissivity of the foam, enhances the radiation performance of the heat sink, and reduces the temperature of the component. These heat sinks are designed for use in passive cooling applications where space is limited. Power and performance are critical, such as power ICs, high temperature components, transistors, cable modems, broadband, VOIP and LED TVs.
