ページ 199 - 組み込みーシステムオンチップ(SoC) | 集積回路(IC) | Heisener Electronics
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組み込みーシステムオンチップ(SoC)

レコード 5,589
ページ  199/200
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説明
パッケージ
在庫
数量
Core Processor
Flash Size
RAM Size
Peripherals
Connectivity
Speed
Primary Attributes
Operating Temperature
Package / Case
Supplier Device Package
10AS032H1F35E1SG
Altera

IC SOC FPGA 384 I/O 1152FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 320K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
パッケージ: 1152-BBGA, FCBGA
在庫2,560
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 320K Logic Elements
0°C ~ 100°C (TJ)
1152-BBGA, FCBGA
1152-FBGA (35x35)
10AS022E3F27E1SG
Altera

IC SOC FPGA 240 I/O 672FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 220K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA (27x27)
パッケージ: 672-BBGA, FCBGA
在庫5,824
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 220K Logic Elements
0°C ~ 100°C (TJ)
672-BBGA, FCBGA
672-FBGA (27x27)
10AS066N2F40I2SGES
Altera

IC SOC FPGA 588 I/O 1517FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 660K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
パッケージ: 1517-BBGA, FCBGA
在庫5,904
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 660K Logic Elements
-40°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
XCZU19EG-L2FFVB1517E
Xilinx Inc.

IC FPGA 644 I/O 1517FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
パッケージ: 1517-BBGA, FCBGA
在庫4,864
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
0°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
XCZU19EG-1FFVE1924E
Xilinx Inc.

IC FPGA 668 I/O 1924FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1924-FCBGA (45x45)
パッケージ: 1924-BBGA, FCBGA
在庫6,512
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
0°C ~ 100°C (TJ)
1924-BBGA, FCBGA
1924-FCBGA (45x45)
XCZU2EG-3SFVC784E
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
パッケージ: 784-BBGA, FCBGA
在庫5,936
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq?UltraScale+? FPGA, 103K+ Logic Cells
0°C ~ 100°C (TJ)
784-BBGA, FCBGA
784-FCBGA (23x23)
XCZU2CG-L2SFVA625E
Xilinx Inc.

IC FPGA 180 I/O 625FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 625-BFBGA, FCBGA
  • Supplier Device Package: 625-FCBGA (21x21)
パッケージ: 625-BFBGA, FCBGA
在庫7,424
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq?UltraScale+? FPGA, 103K+ Logic Cells
0°C ~ 100°C (TJ)
625-BFBGA, FCBGA
625-FCBGA (21x21)
M2S150-FCV484
Microsemi Corporation

IC FPGA SOC 150K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BFBGA
  • Supplier Device Package: 484-BGA
パッケージ: 484-BFBGA
在庫5,664
ARM? Cortex?-M3
512KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 150K Logic Modules
0°C ~ 85°C (TJ)
484-BFBGA
484-BGA
1SX280LN3F43E2VG
Intel

1760-PIN FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2800K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
パッケージ: -
在庫3,280
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 2800K Logic Elements
0°C ~ 100°C (TJ)
-
-
5ASXBB3D4F31C4N
Intel

IC FPGA 170 I/O 896FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 925MHz
  • Primary Attributes: FPGA - 350K Logic Elements
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FBGA (31x31)
パッケージ: 896-BBGA, FCBGA
在庫3,456
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
925MHz
FPGA - 350K Logic Elements
0°C ~ 85°C (TJ)
896-BBGA, FCBGA
896-FBGA (31x31)
10AS027E2F27E2LG
Intel

672-PIN FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 270K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
パッケージ: -
在庫6,624
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 270K Logic Elements
0°C ~ 100°C (TJ)
-
-
AGFB027R24C3E4X
Intel

IC FPGA AGILEX-F 2340FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
パッケージ: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 2.7M Logic Elements
0°C ~ 100°C (TJ)
-
-
AGIB019R31B1E1V
Intel

IC FPGA AGILEX-I 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 3184-BFBGA Exposed Pad
  • Supplier Device Package: 3184-BGA (56x45)
パッケージ: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 1.9M Logic Elements
0°C ~ 100°C (TJ)
3184-BFBGA Exposed Pad
3184-BGA (56x45)
SC-20100S-A
GHI Electronics, LLC

SITCORE SC20100S SOC

  • Architecture: MPU
  • Core Processor: ARM Cortex-M7
  • Flash Size: 2MB
  • RAM Size: 1MB
  • Peripherals: PWM
  • Connectivity: CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART, USB
  • Speed: 480MHz
  • Primary Attributes: -
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
パッケージ: -
在庫1,269
ARM Cortex-M7
2MB
1MB
PWM
CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART, USB
480MHz
-
-40°C ~ 85°C
100-LQFP
100-LQFP (14x14)
MPFS160T-1FCVG784I
Microchip Technology

IC SOC RISC-V 784FCBGA

  • Architecture: MPU, FPGA
  • Core Processor: RISC-V
  • Flash Size: 128kB
  • RAM Size: 1.4125MB
  • Peripherals: DMA, PCI, PWM
  • Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
  • Speed: -
  • Primary Attributes: FPGA - 161K Logic Modules
  • Operating Temperature: -40°C ~ 100°C
  • Package / Case: 784-BFBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
パッケージ: -
在庫9
RISC-V
128kB
1.4125MB
DMA, PCI, PWM
CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
-
FPGA - 161K Logic Modules
-40°C ~ 100°C
784-BFBGA, FCBGA
784-FCBGA (23x23)
MIMX9351AVTXMAB
NXP

IC

  • Architecture: -
  • Core Processor: -
  • Flash Size: -
  • RAM Size: -
  • Peripherals: -
  • Connectivity: -
  • Speed: -
  • Primary Attributes: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
パッケージ: -
Request a Quote
-
-
-
-
-
-
-
-
-
-
1SX250HN3F43E2LG
Intel

IC FPGA STRATIX 10 1760FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2500K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
パッケージ: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 2500K Logic Elements
0°C ~ 100°C (TJ)
1760-BBGA, FCBGA
1760-FBGA (42.5x42.5)
AGFA008R16A2E1V
Intel

IC FPGA AGILEX-F 1546FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 764K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
パッケージ: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 764K Logic Elements
0°C ~ 100°C (TJ)
-
-
XCVE1752-2MLINSVG1369
AMD

IC VERSAL AI-CORE FPGA 1369BGA

  • Architecture: MPU, FPGA
  • Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DDR, DMA, PCIe
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.4GHz
  • Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
  • Operating Temperature: -40°C ~ 110°C (TJ)
  • Package / Case: 1369-BFBGA, FCBGA
  • Supplier Device Package: 1369-FCBGA (35x35)
パッケージ: -
Request a Quote
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
-
256KB
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.4GHz
Versal™ AI Edge FPGA, 1M Logic Cells
-40°C ~ 110°C (TJ)
1369-BFBGA, FCBGA
1369-FCBGA (35x35)
AGFD019R31C2E3E
Intel

IC FPGA AGILEX-F 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 3184-BFBGA Exposed Pad
  • Supplier Device Package: 3184-BGA (56x45)
パッケージ: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 1.9M Logic Elements
0°C ~ 100°C (TJ)
3184-BFBGA Exposed Pad
3184-BGA (56x45)
1SX280HU3F50I2LGAS
Intel

IC FPGA STRATIX 10 2397FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2800K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2397-BBGA, FCBGA
  • Supplier Device Package: 2397-FBGA, FC (50x50)
パッケージ: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 2800K Logic Elements
-40°C ~ 100°C (TJ)
2397-BBGA, FCBGA
2397-FBGA, FC (50x50)
TCI6638K2KDXAAWA24
Texas Instruments

PROTOTYPE

  • Architecture: DSP, MPU
  • Core Processor: C66x, Quad ARM® Cortex®-A15 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: -
  • Peripherals: DDR, DMA, PCIe, POR, WDT
  • Connectivity: Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 1.2GHz, 1.4GHz
  • Primary Attributes: -
  • Operating Temperature: -40°C ~ 100°C (TC)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
パッケージ: -
Request a Quote
C66x, Quad ARM® Cortex®-A15 MPCore™ with CoreSight™
-
-
DDR, DMA, PCIe, POR, WDT
Ethernet, I2C, SPI, UART/USART, USB
1.2GHz, 1.4GHz
-
-40°C ~ 100°C (TC)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
TDA2EEBDQCBDRQ1
Texas Instruments

PROTOTYPE

  • Architecture: -
  • Core Processor: -
  • Flash Size: -
  • RAM Size: -
  • Peripherals: -
  • Connectivity: -
  • Speed: -
  • Primary Attributes: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
パッケージ: -
Request a Quote
-
-
-
-
-
-
-
-
-
-
AGFB022R31C2E3E
Intel

IC FPGA AGILEX-F 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.2M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
パッケージ: -
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 2.2M Logic Elements
0°C ~ 100°C (TJ)
-
-
1SX250HU3F50I3VG
Intel

IC FPGA STRATIX 10 2397FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2500K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2397-BBGA, FCBGA
  • Supplier Device Package: 2397-FBGA, FC (50x50)
パッケージ: -
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 2500K Logic Elements
-40°C ~ 100°C (TJ)
2397-BBGA, FCBGA
2397-FBGA, FC (50x50)
5ASTFD3G3F35I3G
Intel

IC SOC CORTEX-A9 1.05GHZ 1152BGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.05GHz
  • Primary Attributes: FPGA - 350K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA, FC (35x35)
パッケージ: -
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.05GHz
FPGA - 350K Logic Elements
-40°C ~ 100°C (TJ)
1152-BBGA, FCBGA
1152-FBGA, FC (35x35)
AGFD019R25A1E1V
Intel

IC FPGA AGILEX-F 2581FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
パッケージ: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 1.9M Logic Elements
0°C ~ 100°C (TJ)
-
-
TDA4VE88TGAALZRQ1
Texas Instruments

AUTOMOTIVE SYSTEM-ON-A-CHIP FOR

  • Architecture: DSP, MCU, MPU
  • Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
  • Flash Size: -
  • RAM Size: 2MB
  • Peripherals: DMA, PWM, WDT
  • Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
  • Speed: 2GHz, 1GHz, 1GHz
  • Primary Attributes: -
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 770-BFBGA, FCBGA
  • Supplier Device Package: 770-FCBGA (23x23)
パッケージ: -
在庫525
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
-
2MB
DMA, PWM, WDT
MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
2GHz, 1GHz, 1GHz
-
-40°C ~ 125°C (TJ)
770-BFBGA, FCBGA
770-FCBGA (23x23)