ページ 332 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
MRF5S4140HSR3	NXP	FET RF 65V 465MHZ NI-780S Transistor Type: LDMOS Frequency: 465MHz Gain: 21dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.25A Power - Output: 28W Voltage - Rated: 65V Package / Case: NI-780S Supplier Device Package: NI-780S	パッケージ: NI-780S	在庫4,176
BAS316/ZLX	NXP	DIODE GEN PURP 100V 215MA SOD323 Diode Type: Standard Voltage - DC Reverse (Vr) (Max): 100V Current - Average Rectified (Io): 215mA (DC) Voltage - Forward (Vf) (Max) @ If: 1.25V @ 150mA Speed: Standard Recovery >500ns, > 200mA (Io) Reverse Recovery Time (trr): 4ns Current - Reverse Leakage @ Vr: 500nA @ 80V Capacitance @ Vr, F: 1pF @ 0V, 1MHz Mounting Type: Surface Mount Package / Case: SC-76, SOD-323 Supplier Device Package: SOD-323 Operating Temperature - Junction: 150°C (Max)	パッケージ: SC-76, SOD-323	在庫4,832
MC34708VK	NXP	IC POWER MANAGEMENT 206MAPBGA Applications: General Purpose Current - Supply: - Voltage - Supply: 1.8 V ~ 4.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 206-LFBGA Supplier Device Package: 206-MAPBGA (8x8)	パッケージ: 206-LFBGA	在庫3,632
SSL5301T/1J	NXP	IC LED DRIVER OFFL SWITCHER 8SO Type: AC DC Offline Switcher Topology: Flyback, Step-Down (Buck), Step-Up (Boost) Internal Switch(s): No Number of Outputs: 1 Voltage - Supply (Min): 8.8V Voltage - Supply (Max): 32V Voltage - Output: - Current - Output / Channel: - Frequency: - Dimming: - Applications: Lighting Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	パッケージ: 8-SOIC (0.154", 3.90mm Width)	在庫6,080
MC44BC375UAFCR2	NXP	IC MODULATOR AUD/VID VHF 20-QFN Type: Modulator Applications: Set-Top Boxes Mounting Type: Surface Mount Package / Case: 20-VFQFN Exposed Pad Supplier Device Package: 20-QFN-EP (4x4)	パッケージ: 20-VFQFN Exposed Pad	在庫4,016
SA5209D,602	NXP	IC OPAMP VGA 16SO Amplifier Type: Variable Gain Number of Circuits: 1 Output Type: Differential Slew Rate: - Gain Bandwidth Product: - -3db Bandwidth: - Current - Input Bias: 700nA Voltage - Input Offset: - Current - Supply: 43mA Current - Output / Channel: - Voltage - Supply, Single/Dual (±): 4.5 V ~ 7 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	パッケージ: 16-SOIC (0.154", 3.90mm Width)	在庫6,752
SC16C852SVIET,151	NXP	IC UART DUAL W/FIFO 36-TFBGA Features: - Number of Channels: 2, DUART FIFO's: 128 Byte Protocol: RS485 Data Rate (Max): 20Mbps Voltage - Supply: 1.8V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 36-TFBGA Supplier Device Package: 36-TFBGA (3.5x3.5)	パッケージ: 36-TFBGA	在庫15,408
P82B96PN,112	NXP	IC REDRIVER I2C 2CH 400KHZ 8DIP Type: Buffer, ReDriver Applications: I2C Input: 2-Wire Bus Output: 2-Wire Bus Data Rate (Max): 400kHz Number of Channels: 2 Delay Time: - Signal Conditioning: - Capacitance - Input: 7pF Voltage - Supply: 2 V ~ 15 V Current - Supply: 900µA Operating Temperature: -40°C ~ 85°C Mounting Type: - Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-DIP	パッケージ: 8-DIP (0.300", 7.62mm)	在庫4,800
P2020NSE2HHC	NXP	IC MPU Q OR IQ 1.2GHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	パッケージ: 689-BBGA Exposed Pad	在庫4,368
MPC8265AZUMHBC	NXP	IC MPU MPC82XX 266MHZ 408TBGA Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	パッケージ: 480-LBGA	在庫2,912
MCIMX233DJM4CR2	NXP	IC MPU I.MX23 454MHZ 169MAPBGA Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 454MHz Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen Ethernet: - SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -10°C ~ 70°C (TA) Security Features: Cryptography, Hardware ID Package / Case: 169-LFBGA Supplier Device Package: 169-MAPBGA (11x11)	パッケージ: 169-LFBGA	在庫36,000
MCIMX357DJQ5C	NXP	IC MPU I.MX35 532MHZ 400MAPBGA Core Processor: ARM1136JF-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 532MHz Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -20°C ~ 70°C (TA) Security Features: Secure Fusebox, Secure JTAG, Tamper Detection Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17x17)	パッケージ: 400-LFBGA	在庫7,884
S912XEP768J5MAGR	NXP	IC MCU 16BIT 768KB FLASH 144LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫4,704
MK60DX256ZVMD10	NXP	IC MCU 32BIT 256KB FLASH 144BGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 100 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 42x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LFBGA Supplier Device Package: 144-MAPBGA (13x13)	パッケージ: 144-LFBGA	在庫7,488
S9S12GA240F0MLH	NXP	IC MCU 16BIT 240KB FLASH 64LQFP Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 240KB (240K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 11K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 2x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫7,888
S9S08SL8F1MTL	NXP	IC MCU 8BIT 8KB FLASH 28TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 22 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	パッケージ: 28-TSSOP (0.173", 4.40mm Width)	在庫4,208
MCHC912B32CFUE8	NXP	IC MCU 16BIT 32KB FLASH 80QFP Core Processor: CPU12 Core Size: 16-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 63 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 768 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	パッケージ: 80-QFP	在庫5,072
MSC8122MP8000	NXP	DSP 16BIT 500MHZ MULTI 431FCBGA Type: SC140 Core Interface: DSI, Ethernet, RS-232 Clock Rate: 500MHz Non-Volatile Memory: External On-Chip RAM: 1.436MB Voltage - I/O: 3.30V Voltage - Core: 1.20V Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 431-BFBGA, FCBGA Supplier Device Package: 431-FCPBGA (20x20)	パッケージ: 431-BFBGA, FCBGA	在庫7,632
MC33FS4502LAE	NXP	SYSTEM BASIS CHIP LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP Exposed Pad	在庫6,324
NX1A4WPZ	NXP	IC WIRELESS PWR RECEIVER WLCSP42 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫7,728
MCZ33905DS5EKR2	NXP	SYSTEM BASIS CHIP LIN 2X 5.0 V Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: - Supplier Device Package: - Mounting Type: -	パッケージ: -	在庫5,472
S912XD256F1CAGR	NXP	16-BIT MCU S12X CORE 256KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CANbus, I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b, 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫6,240
S9S08LG16J0VLF	NXP	8-BIT MCU S08 CORE 18KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I²C, LINbus, SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 18KB (18K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1.9K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP	在庫3,216
S9S12G48F1MLCR	NXP	16-BIT MCU S12 CORE 48KB FLASH Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	パッケージ: 32-LQFP	在庫6,704
MPF5024AMBA0ESR2	NXP	POWER MANAGEMENT IC, PRE-PROG, 4 Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 10µA Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	パッケージ: -	Request a Quote
MIMXRT1064DVL6BR	NXP	IC MCU 32BIT 4MB FLASH 196MAPBGA Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Single-Core Speed: 600MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Number of I/O: 127 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1M x 8 Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 20x12b Oscillator Type: External, Internal Operating Temperature: 0°C ~ 95°C (TJ) Mounting Type: Surface Mount Package / Case: 196-LFBGA Supplier Device Package: 196-MAPBGA (10x10)	パッケージ: -	Request a Quote
SAF775DHV-N208W-GY	NXP	CAR DISP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
MC34VR500V9ES	NXP	REGULATOR BUCK QUAD WITH UP TO 4 Applications: QorlQ LS1/T1 Communications Processors Current - Supply: 15mA Voltage - Supply: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-QFN-EP (8x8)	パッケージ: -	Request a Quote

MRF5S4140HSR3

NXP

FET RF 65V 465MHZ NI-780S

Transistor Type: LDMOS
Frequency: 465MHz
Gain: 21dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.25A
Power - Output: 28W
Voltage - Rated: 65V
Package / Case: NI-780S
Supplier Device Package: NI-780S

パッケージ: NI-780S

在庫4,176

BAS316/ZLX

NXP

DIODE GEN PURP 100V 215MA SOD323

Diode Type: Standard
Voltage - DC Reverse (Vr) (Max): 100V
Current - Average Rectified (Io): 215mA (DC)
Voltage - Forward (Vf) (Max) @ If: 1.25V @ 150mA
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4ns
Current - Reverse Leakage @ Vr: 500nA @ 80V
Capacitance @ Vr, F: 1pF @ 0V, 1MHz
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Supplier Device Package: SOD-323
Operating Temperature - Junction: 150°C (Max)

パッケージ: SC-76, SOD-323

在庫4,832

MC34708VK

NXP

IC POWER MANAGEMENT 206MAPBGA

Applications: General Purpose
Current - Supply: -
Voltage - Supply: 1.8 V ~ 4.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 206-LFBGA
Supplier Device Package: 206-MAPBGA (8x8)

パッケージ: 206-LFBGA

在庫3,632

SSL5301T/1J

NXP

IC LED DRIVER OFFL SWITCHER 8SO

Type: AC DC Offline Switcher
Topology: Flyback, Step-Down (Buck), Step-Up (Boost)
Internal Switch(s): No
Number of Outputs: 1
Voltage - Supply (Min): 8.8V
Voltage - Supply (Max): 32V
Voltage - Output: -
Current - Output / Channel: -
Frequency: -
Dimming: -
Applications: Lighting
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

パッケージ: 8-SOIC (0.154", 3.90mm Width)

在庫6,080

MC44BC375UAFCR2

NXP

IC MODULATOR AUD/VID VHF 20-QFN

Type: Modulator
Applications: Set-Top Boxes
Mounting Type: Surface Mount
Package / Case: 20-VFQFN Exposed Pad
Supplier Device Package: 20-QFN-EP (4x4)

パッケージ: 20-VFQFN Exposed Pad

在庫4,016

SA5209D,602

NXP

IC OPAMP VGA 16SO

Amplifier Type: Variable Gain
Number of Circuits: 1
Output Type: Differential
Slew Rate: -
Gain Bandwidth Product: -
-3db Bandwidth: -
Current - Input Bias: 700nA
Voltage - Input Offset: -
Current - Supply: 43mA
Current - Output / Channel: -
Voltage - Supply, Single/Dual (±): 4.5 V ~ 7 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

パッケージ: 16-SOIC (0.154", 3.90mm Width)

在庫6,752

SC16C852SVIET,151

NXP

IC UART DUAL W/FIFO 36-TFBGA

Features: -
Number of Channels: 2, DUART
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 20Mbps
Voltage - Supply: 1.8V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 36-TFBGA
Supplier Device Package: 36-TFBGA (3.5x3.5)

パッケージ: 36-TFBGA

在庫15,408

P82B96PN,112

NXP

IC REDRIVER I2C 2CH 400KHZ 8DIP

Type: Buffer, ReDriver
Applications: I2C
Input: 2-Wire Bus
Output: 2-Wire Bus
Data Rate (Max): 400kHz
Number of Channels: 2
Delay Time: -
Signal Conditioning: -
Capacitance - Input: 7pF
Voltage - Supply: 2 V ~ 15 V
Current - Supply: 900µA
Operating Temperature: -40°C ~ 85°C
Mounting Type: -
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-DIP

パッケージ: 8-DIP (0.300", 7.62mm)

在庫4,800

P2020NSE2HHC

NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

パッケージ: 689-BBGA Exposed Pad

在庫4,368

MPC8265AZUMHBC

NXP

IC MPU MPC82XX 266MHZ 408TBGA

Core Processor: PowerPC G2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 480-LBGA
Supplier Device Package: 408-TBGA (37.5x37.5)

パッケージ: 480-LBGA

在庫2,912

MCIMX233DJM4CR2

NXP

IC MPU I.MX23 454MHZ 169MAPBGA

Core Processor: ARM926EJ-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 454MHz
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Ethernet: -
SATA: -
USB: USB 2.0 + PHY (1)
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature: -10°C ~ 70°C (TA)
Security Features: Cryptography, Hardware ID
Package / Case: 169-LFBGA
Supplier Device Package: 169-MAPBGA (11x11)

パッケージ: 169-LFBGA

在庫36,000

MCIMX357DJQ5C

NXP

IC MPU I.MX35 532MHZ 400MAPBGA

Core Processor: ARM1136JF-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 532MHz
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature: -20°C ~ 70°C (TA)
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Package / Case: 400-LFBGA
Supplier Device Package: 400-MAPBGA (17x17)

パッケージ: 400-LFBGA

在庫7,884

S912XEP768J5MAGR

NXP

IC MCU 16BIT 768KB FLASH 144LQFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 119
Program Memory Size: 768KB (768K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 24x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫4,704

MK60DX256ZVMD10

NXP

IC MCU 32BIT 256KB FLASH 144BGA

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 100
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 42x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LFBGA
Supplier Device Package: 144-MAPBGA (13x13)

パッケージ: 144-LFBGA

在庫7,488

S9S12GA240F0MLH

NXP

IC MCU 16BIT 240KB FLASH 64LQFP

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, IrDA, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 240KB (240K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 11K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 2x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫7,888

S9S08SL8F1MTL

NXP

IC MCU 8BIT 8KB FLASH 28TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 22
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 28-TSSOP

パッケージ: 28-TSSOP (0.173", 4.40mm Width)

在庫4,208

MCHC912B32CFUE8

NXP

IC MCU 16BIT 32KB FLASH 80QFP

Core Processor: CPU12
Core Size: 16-Bit
Speed: 8MHz
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 63
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 768 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

パッケージ: 80-QFP

在庫5,072

MSC8122MP8000

NXP

DSP 16BIT 500MHZ MULTI 431FCBGA

Type: SC140 Core
Interface: DSI, Ethernet, RS-232
Clock Rate: 500MHz
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Operating Temperature: 0°C ~ 90°C (TJ)
Mounting Type: Surface Mount
Package / Case: 431-BFBGA, FCBGA
Supplier Device Package: 431-FCPBGA (20x20)

パッケージ: 431-BFBGA, FCBGA

在庫7,632

MC33FS4502LAE

NXP

SYSTEM BASIS CHIP LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP Exposed Pad

在庫6,324

NX1A4WPZ

NXP

IC WIRELESS PWR RECEIVER WLCSP42

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫7,728

MCZ33905DS5EKR2

NXP

SYSTEM BASIS CHIP LIN 2X 5.0 V

Applications: System Basis Chip
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

パッケージ: -

在庫5,472

S912XD256F1CAGR

NXP

16-BIT MCU S12X CORE 256KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 80MHz
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 119
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b, 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫6,240

S9S08LG16J0VLF

NXP

8-BIT MCU S08 CORE 18KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 18KB (18K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1.9K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP

在庫3,216

S9S12G48F1MLCR

NXP

16-BIT MCU S12 CORE 48KB FLASH

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

パッケージ: 32-LQFP

在庫6,704

MPF5024AMBA0ESR2

NXP

POWER MANAGEMENT IC, PRE-PROG, 4

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

パッケージ: -

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MIMXRT1064DVL6BR

NXP

IC MCU 32BIT 4MB FLASH 196MAPBGA

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Single-Core
Speed: 600MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O: 127
Program Memory Size: 4MB (4M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1M x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Data Converters: A/D 20x12b
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Supplier Device Package: 196-MAPBGA (10x10)

パッケージ: -

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SAF775DHV-N208W-GY

NXP

CAR DISP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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MC34VR500V9ES

NXP

REGULATOR BUCK QUAD WITH UP TO 4

Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 15mA
Voltage - Supply: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-QFN-EP (8x8)

パッケージ: -

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