ページ 333 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
BFU580QX	NXP	TRANS RF NPN 12V 60MA SOT89-3 Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 12V Frequency - Transition: 10.5GHz Noise Figure (dB Typ @ f): 1.3dB @ 1.8GHz Gain: 8.5dB Power - Max: 1W DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 30mA, 8V Current - Collector (Ic) (Max): 60mA Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-243AA Supplier Device Package: SOT-89-3	パッケージ: TO-243AA	在庫20,412
BZX284-C13,115	NXP	DIODE ZENER 13V 400MW SOD2 Voltage - Zener (Nom) (Vz): 13V Tolerance: ±5% Power - Max: 400mW Impedance (Max) (Zzt): 10 Ohms Current - Reverse Leakage @ Vr: 100nA @ 8V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SOD-110 Supplier Device Package: SOD110	パッケージ: SOD-110	在庫6,656
PCA9551D,112	NXP	IC LED DRIVER PS DIM 25MA 16SO Type: Power Switch Topology: - Internal Switch(s): Yes Number of Outputs: 8 Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V Voltage - Output: - Current - Output / Channel: 25mA Frequency: - Dimming: PWM Applications: - Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	パッケージ: 16-SOIC (0.154", 3.90mm Width)	在庫14,772
74LV139BQ,115	NXP	IC DUAL 2-4 DECOD/DEMUX 16DHVQFN Type: Decoder/Demultiplexer Circuit: 1 x 2:4 Independent Circuits: 2 Current - Output High, Low: 12mA, 12mA Voltage Supply Source: Single Supply Voltage - Supply: 1 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-VFQFN Exposed Pad Supplier Device Package: 16-DHVQFN (2.5x3.5)	パッケージ: 16-VFQFN Exposed Pad	在庫4,992
74ABT2240N,112	NXP	IC BUFF INVERT 5.5V 20DIP Logic Type: Buffer, Inverting Number of Elements: 2 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 12mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	パッケージ: 20-DIP (0.300", 7.62mm)	在庫6,112
PCA9541PW/01,118	NXP	IC I2C 2:1 SELECTOR 16-TSSOP Applications: 2-Channel I2C Multiplexer Interface: I2C, SMBus Voltage - Supply: 2.3 V ~ 5.5 V Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP Mounting Type: Surface Mount	パッケージ: 16-TSSOP (0.173", 4.40mm Width)	在庫2,752
KMPC880VR66	NXP	IC MPU MPC8XX 66MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (2), 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	パッケージ: 357-BBGA	在庫6,848
MPC8250AZQIHBC	NXP	IC MPU MPC82XX 200MHZ 516BGA Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	パッケージ: 516-BBGA	在庫2,000
MC9S08LL8CLH	NXP	IC MCU 8BIT 10KB FLASH 64LQFP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Number of I/O: 38 Program Memory Size: 10KB (10K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫2,144
MC68HC908BD48IFB	NXP	IC MCU 8BIT 48KB FLASH 44QFP Core Processor: HC08 Core Size: 8-Bit Speed: 6MHz Connectivity: I2C, USB Peripherals: POR, PWM Number of I/O: 32 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 6x8b Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 44-QFP Supplier Device Package: 44-QFP (10x10)	パッケージ: 44-QFP	在庫29,184
MC9S12DG128MPVE	NXP	IC MCU 16BIT 128KB FLASH 112LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: PWM, WDT Number of I/O: 91 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	パッケージ: 112-LQFP	在庫47,232
LPC1776FET180,551	NXP	IC MCU 32BIT 256KB FLASH 180BGA Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 120MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 141 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 8x12b, D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 180-TFBGA Supplier Device Package: 180-TFBGA (12x12)	パッケージ: 180-TFBGA	在庫6,112
S9S08SG16E1VTLR	NXP	IC MCU 8BIT 16KB FLASH 28TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 22 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	パッケージ: 28-TSSOP (0.173", 4.40mm Width)	在庫49,320
MC9S08PA8AVTJ	NXP	IC MCU 8BIT 8KB FLASH 20TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 18 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	パッケージ: 20-TSSOP (0.173", 4.40mm Width)	在庫2,608
MCF5234CVM150	NXP	IC MCU 32BIT ROMLESS 256MAPBGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 150MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, WDT Number of I/O: 97 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	パッケージ: 256-LBGA	在庫5,280
74LV4799PW,112	NXP	IC OSC TIMER CTRL 100KHZ 16TSSOP Type: Timer Control Count: - Frequency: 100kHz Voltage - Supply: 0.9 V ~ 6 V Current - Supply: 36µA Operating Temperature: 0°C ~ 70°C Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP Mounting Type: Surface Mount	パッケージ: 16-TSSOP (0.173", 4.40mm Width)	在庫5,184
MPXM2102AS	NXP	SENS PRESSURE 14.5 PSI MAX MPAK Pressure Type: Absolute Operating Pressure: 14.5 PSI (100 kPa) Output Type: Wheatstone Bridge Output: 0 mV ~ 40 mV (10V) Accuracy: - Voltage - Supply: 10 V ~ 16 V Port Size: Male - 0.12" (2.97mm) Tube Port Style: Barbless Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 5-SMD Module Supplier Device Package: 5-MPAK	パッケージ: 5-SMD Module	在庫6,228
OM15041Z	NXP	DEMO RGB LED WITH ZIGBEE NFC Type: - Frequency: - For Use With/Related Products: - Supplied Contents: -	パッケージ: -	在庫4,752
MD7IC21100NBR1	NXP	IC PWR AMP RF 2170MHZ TO-272-14 Frequency: 2.11GHz ~ 2.17GHz P1dB: 50.4dBm (110W) Gain: 28.5dB Noise Figure: - RF Type: W-CDMA Voltage - Supply: 32V Current - Supply: 925mA Test Frequency: - Package / Case: TO-272-14 Variant, Flat Leads Supplier Device Package: TO-272 WB-14	パッケージ: TO-272-14 Variant, Flat Leads	在庫7,146
MCIMX6X3EVK10AC	NXP	I.MX 6SX ROM PERF ENHAN Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 200MHz, 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (14x14)	パッケージ: 400-LFBGA	在庫4,976
MCIMX6U5EVM10AD	NXP	I.MX 6DL ROM PERF ENHAN Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-LFBGA Supplier Device Package: 624-MAPBGA (21x21)	パッケージ: 624-LFBGA	在庫6,444
S912XEQ512BMAG	NXP	16-BIT MCU S12X CORE 512KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫7,840
SPC5746BBK1AMMH6	NXP	SINGLE CORE 3M FLASH Core Processor: e200z4 Core Size: 32-Bit Speed: 160MHz Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, I²S, POR, WDT Number of I/O: - Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LBGA Supplier Device Package: 100-MAPBGA (11x11)	パッケージ: 100-LBGA	在庫5,408
S912XET512BMAG	NXP	16-BIT MCU S12X CORE 512KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫6,480
SPC5602BK0CLH4R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 45 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫6,416
MIMXRT1061CVJ5BR	NXP	IC MCU 32BIT EXT MEM 196LFBGA Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Single-Core Speed: 528MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Number of I/O: 127 Program Memory Size: - Program Memory Type: External Program Memory EEPROM Size: - RAM Size: 1M x 8 Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 20x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 196-LFBGA Supplier Device Package: 196-LFBGA (12x12)	パッケージ: -	Request a Quote
FS32K146HRT0VLQR	NXP	IC MCU 32BIT 1MB FLASH 144LQFP Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 80MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 128 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: -	Request a Quote
SPC5604BAMLH4	NXP	IC MCU 32BIT 512KB FLASH 64LQFP Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 45 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 12x10b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: -	Request a Quote

BFU580QX

NXP

TRANS RF NPN 12V 60MA SOT89-3

Transistor Type: NPN
Voltage - Collector Emitter Breakdown (Max): 12V
Frequency - Transition: 10.5GHz
Noise Figure (dB Typ @ f): 1.3dB @ 1.8GHz
Gain: 8.5dB
Power - Max: 1W
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 30mA, 8V
Current - Collector (Ic) (Max): 60mA
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-243AA
Supplier Device Package: SOT-89-3

パッケージ: TO-243AA

在庫20,412

BZX284-C13,115

NXP

DIODE ZENER 13V 400MW SOD2

Voltage - Zener (Nom) (Vz): 13V
Tolerance: ±5%
Power - Max: 400mW
Impedance (Max) (Zzt): 10 Ohms
Current - Reverse Leakage @ Vr: 100nA @ 8V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-110
Supplier Device Package: SOD110

パッケージ: SOD-110

在庫6,656

PCA9551D,112

NXP

IC LED DRIVER PS DIM 25MA 16SO

Type: Power Switch
Topology: -
Internal Switch(s): Yes
Number of Outputs: 8
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Voltage - Output: -
Current - Output / Channel: 25mA
Frequency: -
Dimming: PWM
Applications: -
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

パッケージ: 16-SOIC (0.154", 3.90mm Width)

在庫14,772

74LV139BQ,115

NXP

IC DUAL 2-4 DECOD/DEMUX 16DHVQFN

Type: Decoder/Demultiplexer
Circuit: 1 x 2:4
Independent Circuits: 2
Current - Output High, Low: 12mA, 12mA
Voltage Supply Source: Single Supply
Voltage - Supply: 1 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-VFQFN Exposed Pad
Supplier Device Package: 16-DHVQFN (2.5x3.5)

パッケージ: 16-VFQFN Exposed Pad

在庫4,992

74ABT2240N,112

NXP

IC BUFF INVERT 5.5V 20DIP

Logic Type: Buffer, Inverting
Number of Elements: 2
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 12mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)
Supplier Device Package: 20-DIP

パッケージ: 20-DIP (0.300", 7.62mm)

在庫6,112

PCA9541PW/01,118

NXP

IC I2C 2:1 SELECTOR 16-TSSOP

Applications: 2-Channel I2C Multiplexer
Interface: I2C, SMBus
Voltage - Supply: 2.3 V ~ 5.5 V
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP
Mounting Type: Surface Mount

パッケージ: 16-TSSOP (0.173", 4.40mm Width)

在庫2,752

KMPC880VR66

NXP

IC MPU MPC8XX 66MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (2), 10/100 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

パッケージ: 357-BBGA

在庫6,848

MPC8250AZQIHBC

NXP

IC MPU MPC82XX 200MHZ 516BGA

Core Processor: PowerPC G2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 200MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 516-BBGA
Supplier Device Package: 516-FPBGA (27x27)

パッケージ: 516-BBGA

在庫2,000

MC9S08LL8CLH

NXP

IC MCU 8BIT 10KB FLASH 64LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Number of I/O: 38
Program Memory Size: 10KB (10K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫2,144

MC68HC908BD48IFB

NXP

IC MCU 8BIT 48KB FLASH 44QFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 6MHz
Connectivity: I2C, USB
Peripherals: POR, PWM
Number of I/O: 32
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 6x8b
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 44-QFP
Supplier Device Package: 44-QFP (10x10)

パッケージ: 44-QFP

在庫29,184

MC9S12DG128MPVE

NXP

IC MCU 16BIT 128KB FLASH 112LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: PWM, WDT
Number of I/O: 91
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

パッケージ: 112-LQFP

在庫47,232

LPC1776FET180,551

NXP

IC MCU 32BIT 256KB FLASH 180BGA

Core Processor: ARM? Cortex?-M3
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O: 141
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
Data Converters: A/D 8x12b, D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 180-TFBGA
Supplier Device Package: 180-TFBGA (12x12)

パッケージ: 180-TFBGA

在庫6,112

S9S08SG16E1VTLR

NXP

IC MCU 8BIT 16KB FLASH 28TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 22
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 28-TSSOP

パッケージ: 28-TSSOP (0.173", 4.40mm Width)

在庫49,320

MC9S08PA8AVTJ

NXP

IC MCU 8BIT 8KB FLASH 20TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, LIN, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 18
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

パッケージ: 20-TSSOP (0.173", 4.40mm Width)

在庫2,608

MCF5234CVM150

NXP

IC MCU 32BIT ROMLESS 256MAPBGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 150MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Number of I/O: 97
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

パッケージ: 256-LBGA

在庫5,280

74LV4799PW,112

NXP

IC OSC TIMER CTRL 100KHZ 16TSSOP

Type: Timer Control
Count: -
Frequency: 100kHz
Voltage - Supply: 0.9 V ~ 6 V
Current - Supply: 36µA
Operating Temperature: 0°C ~ 70°C
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP
Mounting Type: Surface Mount

パッケージ: 16-TSSOP (0.173", 4.40mm Width)

在庫5,184

MPXM2102AS

NXP

SENS PRESSURE 14.5 PSI MAX MPAK

Pressure Type: Absolute
Operating Pressure: 14.5 PSI (100 kPa)
Output Type: Wheatstone Bridge
Output: 0 mV ~ 40 mV (10V)
Accuracy: -
Voltage - Supply: 10 V ~ 16 V
Port Size: Male - 0.12" (2.97mm) Tube
Port Style: Barbless
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 58.02 PSI (400 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 5-SMD Module
Supplier Device Package: 5-MPAK

パッケージ: 5-SMD Module

在庫6,228

OM15041Z

NXP

DEMO RGB LED WITH ZIGBEE NFC

Type: -
Frequency: -
For Use With/Related Products: -
Supplied Contents: -

パッケージ: -

在庫4,752

MD7IC21100NBR1

NXP

IC PWR AMP RF 2170MHZ TO-272-14

Frequency: 2.11GHz ~ 2.17GHz
P1dB: 50.4dBm (110W)
Gain: 28.5dB
Noise Figure: -
RF Type: W-CDMA
Voltage - Supply: 32V
Current - Supply: 925mA
Test Frequency: -
Package / Case: TO-272-14 Variant, Flat Leads
Supplier Device Package: TO-272 WB-14

パッケージ: TO-272-14 Variant, Flat Leads

在庫7,146

MCIMX6X3EVK10AC

NXP

I.MX 6SX ROM PERF ENHAN

Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 200MHz, 1GHz
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature: -20°C ~ 105°C (TJ)
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Package / Case: 400-LFBGA
Supplier Device Package: 400-MAPBGA (14x14)

パッケージ: 400-LFBGA

在庫4,976

MCIMX6U5EVM10AD

NXP

I.MX 6DL ROM PERF ENHAN

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -20°C ~ 105°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-LFBGA
Supplier Device Package: 624-MAPBGA (21x21)

パッケージ: 624-LFBGA

在庫6,444

S912XEQ512BMAG

NXP

16-BIT MCU S12X CORE 512KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 119
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 24x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫7,840

SPC5746BBK1AMMH6

NXP

SINGLE CORE 3M FLASH

Core Processor: e200z4
Core Size: 32-Bit
Speed: 160MHz
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, I²S, POR, WDT
Number of I/O: -
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 36x10b, 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 100-LBGA
Supplier Device Package: 100-MAPBGA (11x11)

パッケージ: 100-LBGA

在庫5,408

S912XET512BMAG

NXP

16-BIT MCU S12X CORE 512KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 119
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 24x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫6,480

SPC5602BK0CLH4R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 45
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 24K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫6,416

MIMXRT1061CVJ5BR

NXP

IC MCU 32BIT EXT MEM 196LFBGA

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Single-Core
Speed: 528MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O: 127
Program Memory Size: -
Program Memory Type: External Program Memory
EEPROM Size: -
RAM Size: 1M x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Data Converters: A/D 20x12b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Supplier Device Package: 196-LFBGA (12x12)

パッケージ: -

Request a Quote

FS32K146HRT0VLQR

NXP

IC MCU 32BIT 1MB FLASH 144LQFP

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit Single-Core
Speed: 80MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 128
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b SAR; D/A1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: -

Request a Quote

SPC5604BAMLH4

NXP

IC MCU 32BIT 512KB FLASH 64LQFP

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 45
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Data Converters: A/D 12x10b SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: -

Request a Quote