ページ 403 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
PDTA124XK,115	NXP	TRANS PREBIAS PNP 250MW SMT3 Transistor Type: PNP - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 22k Resistor - Emitter Base (R2) (Ohms): 47k DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: - Power - Max: 250mW Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫6,176
74ABT373AD,118	NXP	IC OCTAL TRANSP LATCH 3ST 20SOIC Logic Type: D-Type Transparent Latch Circuit: 8:8 Output Type: Tri-State Voltage - Supply: 4.5 V ~ 5.5 V Independent Circuits: 1 Delay Time - Propagation: 3.6ns Current - Output High, Low: 32mA, 64mA Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	パッケージ: 20-SOIC (0.295", 7.50mm Width)	在庫6,768
74ALVT16374DL,118	NXP	IC D-TYPE POS TRG DUAL 48SSOP Function: Standard Type: D-Type Output Type: Tri-State, Non-Inverted Number of Elements: 2 Number of Bits per Element: 8 Clock Frequency: 250MHz Max Propagation Delay @ V, Max CL: 3.2ns @ 3.3V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 8mA, 24mA; 32mA, 64mA Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V Current - Quiescent (Iq): 100µA Input Capacitance: 3pF Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-BSSOP (0.295", 7.50mm Width)	パッケージ: 48-BSSOP (0.295", 7.50mm Width)	在庫5,856
74HCT393N,652	NXP	IC COUNTER DUAL 4BIT BIN 14DIP Logic Type: Binary Counter Direction: Up Number of Elements: 2 Number of Bits per Element: 4 Reset: Asynchronous Timing: - Count Rate: 107MHz Trigger Type: Negative Edge Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 14-DIP (0.300", 7.62mm) Supplier Device Package: 14-DIP	パッケージ: 14-DIP (0.300", 7.62mm)	在庫4,784
N74F126D,602	NXP	IC BUFFER TRI-ST QUAD 14SOIC Logic Type: Buffer, Non-Inverting Number of Elements: 4 Number of Bits per Element: 1 Input Type: - Output Type: Push-Pull Current - Output High, Low: 15mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	パッケージ: 14-SOIC (0.154", 3.90mm Width)	在庫6,448
TDA9984AHW/15/C188	NXP	HDMI TRANSMITTER 1080P 80HTQFP Type: HDMI 1.3 Transmitter Applications: Set-Top Boxes, Video Players, Recorders Mounting Type: Surface Mount Package / Case: 80-TQFP Exposed Pad Supplier Device Package: 80-HTQFP (12x12)	パッケージ: 80-TQFP Exposed Pad	在庫3,312
MHW10276N	NXP	IC CATV AMPLIFIER MOD 7-CATV Applications: CATV Output Type: - Number of Circuits: 1 -3db Bandwidth: - Slew Rate: - Current - Supply: 250mA Current - Output / Channel: - Voltage - Supply, Single/Dual (±): - Mounting Type: Surface Mount Package / Case: Module Supplier Device Package: 7-CATV Module	パッケージ: Module	在庫7,456
TDA8566Q/N2,112	NXP	IC AMP AUDIO PWR 55W STER 17SIL Type: Class B Output Type: 2-Channel (Stereo) Max Output Power x Channels @ Load: 55W x 2 @ 2 Ohm Voltage - Supply: 6 V ~ 18 V Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Through Hole Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: DBS17P Package / Case: 17-SIP Formed Leads	パッケージ: 17-SIP Formed Leads	在庫4,848
MCZ33905D5EK	NXP	IC SBC CAN/LIN 5.0V HS DL 54SOIC Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Mounting Type: Surface Mount	パッケージ: 54-SSOP (0.295", 7.50mm Width) Exposed Pad	在庫5,344
UJA1079TW/3V3/WD:1	NXP	IC SBC LINE 3.3V 32HTSSOP Applications: Automotive Interface: SPI Serial Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	パッケージ: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	在庫7,008
P4040NSN1NNB	NXP	IC MPU Q OR IQ 1.5GHZ 1295FCBGA Core Processor: PowerPC e500mc Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 1.5GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (8), 10 Gbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5)	パッケージ: 1295-BBGA, FCBGA	在庫6,544
MPC8535ECVTAKGA	NXP	IC MPU MPC85XX 600MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (1) USB: USB 2.0 (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫6,320
MPC8308CZQAFD	NXP	IC MPU MPC83XX 333MHZ 473MAPBGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: - RAM Controllers: DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19x19)	パッケージ: 473-LFBGA	在庫4,784
MPC603RRX266TC	NXP	IC MPU MPC6XX 266MHZ 255FCCBGA Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-FCCBGA (21x21)	パッケージ: 255-BCBGA Exposed Pad	在庫2,512
P1011NXE2HFB	NXP	IC MPU Q OR IQ 800MHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	パッケージ: 689-BBGA Exposed Pad	在庫6,064
SPC5515SAMLU66	NXP	IC MCU 32BIT 768KB FLASH 176LQFP Core Processor: e200z1 Core Size: 32-Bit Speed: 66MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 137 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	パッケージ: 176-LQFP	在庫6,928
PCK351DB,112	NXP	IC CLK BUFFER 1:10 125MHZ 24SSOP Type: Fanout Buffer (Distribution) Number of Circuits: 1 Ratio - Input:Output: 1:10 Differential - Input:Output: No/No Input: LVTTL Output: LVTTL Frequency - Max: 125MHz Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-SSOP (0.209", 5.30mm Width) Supplier Device Package: 24-SSOP	パッケージ: 24-SSOP (0.209", 5.30mm Width)	在庫6,464
PCK210BS,118	NXP	IC CLK BUFFER 1:5 1.5GHZ 32HVQFN Type: Fanout Buffer (Distribution) Number of Circuits: 2 Ratio - Input:Output: 1:5 Differential - Input:Output: Yes/Yes Input: ECL, PECL Output: PECL Frequency - Max: 1.5GHz Voltage - Supply: 2.25 V ~ 3.8 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	パッケージ: 32-VFQFN Exposed Pad	在庫4,960
MPC9447AC	NXP	IC CLK BUFFER 2:9 350MHZ 32LQFP Type: Fanout Buffer (Distribution), Multiplexer Number of Circuits: 1 Ratio - Input:Output: 2:9 Differential - Input:Output: No/No Input: LVCMOS Output: LVCMOS Frequency - Max: 350MHz Voltage - Supply: 2.375 V ~ 3.465 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	パッケージ: 32-LQFP	在庫4,912
MMA5212W	NXP	ACCELEROMETER 120G 16QFN Type: Digital Axis: X Acceleration Range: ±120g Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: 4.2 V ~ 17 V Features: - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	パッケージ: 16-QFN Exposed Pad	在庫8,010
SP5746CBK1AMMH6R	NXP	DUAL CORE, 3M FLASH, 256 Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: - Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LBGA Supplier Device Package: 100-MAPBGA (11x11)	パッケージ: 100-LBGA	在庫5,664
S912XDT256F1MAA	NXP	16-BIT MCU S12X CORE 256KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CANbus, I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	パッケージ: 80-QFP	在庫4,784
S912XEG384BCAL	NXP	16-BIT MCU S12X CORE 384KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	パッケージ: 112-LQFP	在庫2,256
S9S12XS128J1VAE	NXP	16-BIT MCU S12X CORE 128KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 40MHz Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫5,232
S9S12G96AMLFR	NXP	16BIT 96K FLASH Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 3K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP	在庫5,920
SPC5746GBK0AMMJ6	NXP	IC MCU 3MB FLASH Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
LPC55S14JBD100Y	NXP	IC MCU 32BIT 128KB FLSH 100HLQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-HLQFP (14x14)	パッケージ: -	Request a Quote
MC56F83663VLH	NXP	IC MCU 32BIT 128KB FLASH 64LQFP Core Processor: 56800EX Core Size: 32-Bit Single-Core Speed: 100MHz Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 20x12b; D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: -	Request a Quote

PDTA124XK,115

NXP

TRANS PREBIAS PNP 250MW SMT3

Transistor Type: PNP - Pre-Biased
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 22k
Resistor - Emitter Base (R2) (Ohms): 47k
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
Frequency - Transition: -
Power - Max: 250mW
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫6,176

74ABT373AD,118

NXP

IC OCTAL TRANSP LATCH 3ST 20SOIC

Logic Type: D-Type Transparent Latch
Circuit: 8:8
Output Type: Tri-State
Voltage - Supply: 4.5 V ~ 5.5 V
Independent Circuits: 1
Delay Time - Propagation: 3.6ns
Current - Output High, Low: 32mA, 64mA
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO

パッケージ: 20-SOIC (0.295", 7.50mm Width)

在庫6,768

74ALVT16374DL,118

NXP

IC D-TYPE POS TRG DUAL 48SSOP

Function: Standard
Type: D-Type
Output Type: Tri-State, Non-Inverted
Number of Elements: 2
Number of Bits per Element: 8
Clock Frequency: 250MHz
Max Propagation Delay @ V, Max CL: 3.2ns @ 3.3V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 8mA, 24mA; 32mA, 64mA
Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
Current - Quiescent (Iq): 100µA
Input Capacitance: 3pF
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-BSSOP (0.295", 7.50mm Width)

パッケージ: 48-BSSOP (0.295", 7.50mm Width)

在庫5,856

74HCT393N,652

NXP

IC COUNTER DUAL 4BIT BIN 14DIP

Logic Type: Binary Counter
Direction: Up
Number of Elements: 2
Number of Bits per Element: 4
Reset: Asynchronous
Timing: -
Count Rate: 107MHz
Trigger Type: Negative Edge
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Supplier Device Package: 14-DIP

パッケージ: 14-DIP (0.300", 7.62mm)

在庫4,784

N74F126D,602

NXP

IC BUFFER TRI-ST QUAD 14SOIC

Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Number of Bits per Element: 1
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 15mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

パッケージ: 14-SOIC (0.154", 3.90mm Width)

在庫6,448

TDA9984AHW/15/C188

NXP

HDMI TRANSMITTER 1080P 80HTQFP

Type: HDMI 1.3 Transmitter
Applications: Set-Top Boxes, Video Players, Recorders
Mounting Type: Surface Mount
Package / Case: 80-TQFP Exposed Pad
Supplier Device Package: 80-HTQFP (12x12)

パッケージ: 80-TQFP Exposed Pad

在庫3,312

MHW10276N

NXP

IC CATV AMPLIFIER MOD 7-CATV

Applications: CATV
Output Type: -
Number of Circuits: 1
-3db Bandwidth: -
Slew Rate: -
Current - Supply: 250mA
Current - Output / Channel: -
Voltage - Supply, Single/Dual (±): -
Mounting Type: Surface Mount
Package / Case: Module
Supplier Device Package: 7-CATV Module

パッケージ: Module

在庫7,456

TDA8566Q/N2,112

NXP

IC AMP AUDIO PWR 55W STER 17SIL

Type: Class B
Output Type: 2-Channel (Stereo)
Max Output Power x Channels @ Load: 55W x 2 @ 2 Ohm
Voltage - Supply: 6 V ~ 18 V
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: DBS17P
Package / Case: 17-SIP Formed Leads

パッケージ: 17-SIP Formed Leads

在庫4,848

MCZ33905D5EK

NXP

IC SBC CAN/LIN 5.0V HS DL 54SOIC

Applications: System Basis Chip
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-SOICW-EP
Mounting Type: Surface Mount

パッケージ: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

在庫5,344

UJA1079TW/3V3/WD:1

NXP

IC SBC LINE 3.3V 32HTSSOP

Applications: Automotive
Interface: SPI Serial
Voltage - Supply: 4.5 V ~ 28 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

パッケージ: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

在庫7,008

P4040NSN1NNB

NXP

IC MPU Q OR IQ 1.5GHZ 1295FCBGA

Core Processor: PowerPC e500mc
Number of Cores/Bus Width: 4 Core, 32-Bit
Speed: 1.5GHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (8), 10 Gbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 1295-BBGA, FCBGA
Supplier Device Package: 1295-FCPBGA (37.5x37.5)

パッケージ: 1295-BBGA, FCBGA

在庫6,544

MPC8535ECVTAKGA

NXP

IC MPU MPC85XX 600MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 600MHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (1)
USB: USB 2.0 (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫6,320

MPC8308CZQAFD

NXP

IC MPU MPC83XX 333MHZ 473MAPBGA

Core Processor: PowerPC e300c3
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 333MHz
Co-Processors/DSP: -
RAM Controllers: DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 473-LFBGA
Supplier Device Package: 473-MAPBGA (19x19)

パッケージ: 473-LFBGA

在庫4,784

MPC603RRX266TC

NXP

IC MPU MPC6XX 266MHZ 255FCCBGA

Core Processor: PowerPC 603e
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 255-BCBGA Exposed Pad
Supplier Device Package: 255-FCCBGA (21x21)

パッケージ: 255-BCBGA Exposed Pad

在庫2,512

P1011NXE2HFB

NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

パッケージ: 689-BBGA Exposed Pad

在庫6,064

SPC5515SAMLU66

NXP

IC MCU 32BIT 768KB FLASH 176LQFP

Core Processor: e200z1
Core Size: 32-Bit
Speed: 66MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 137
Program Memory Size: 768KB (768K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
Data Converters: A/D 40x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

パッケージ: 176-LQFP

在庫6,928

PCK351DB,112

NXP

IC CLK BUFFER 1:10 125MHZ 24SSOP

Type: Fanout Buffer (Distribution)
Number of Circuits: 1
Ratio - Input:Output: 1:10
Differential - Input:Output: No/No
Input: LVTTL
Output: LVTTL
Frequency - Max: 125MHz
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 24-SSOP

パッケージ: 24-SSOP (0.209", 5.30mm Width)

在庫6,464

PCK210BS,118

NXP

IC CLK BUFFER 1:5 1.5GHZ 32HVQFN

Type: Fanout Buffer (Distribution)
Number of Circuits: 2
Ratio - Input:Output: 1:5
Differential - Input:Output: Yes/Yes
Input: ECL, PECL
Output: PECL
Frequency - Max: 1.5GHz
Voltage - Supply: 2.25 V ~ 3.8 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

パッケージ: 32-VFQFN Exposed Pad

在庫4,960

MPC9447AC

NXP

IC CLK BUFFER 2:9 350MHZ 32LQFP

Type: Fanout Buffer (Distribution), Multiplexer
Number of Circuits: 1
Ratio - Input:Output: 2:9
Differential - Input:Output: No/No
Input: LVCMOS
Output: LVCMOS
Frequency - Max: 350MHz
Voltage - Supply: 2.375 V ~ 3.465 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

パッケージ: 32-LQFP

在庫4,912

MMA5212W

NXP

ACCELEROMETER 120G 16QFN

Type: Digital
Axis: X
Acceleration Range: ±120g
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: 4.2 V ~ 17 V
Features: -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-QFN Exposed Pad
Supplier Device Package: 16-QFN (6x6)

パッケージ: 16-QFN Exposed Pad

在庫8,010

SP5746CBK1AMMH6R

NXP

DUAL CORE, 3M FLASH, 256

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: -
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 100-LBGA
Supplier Device Package: 100-MAPBGA (11x11)

パッケージ: 100-LBGA

在庫5,664

S912XDT256F1MAA

NXP

16-BIT MCU S12X CORE 256KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 80MHz
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 59
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 8x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

パッケージ: 80-QFP

在庫4,784

S912XEG384BCAL

NXP

16-BIT MCU S12X CORE 384KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 24K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

パッケージ: 112-LQFP

在庫2,256

S9S12XS128J1VAE

NXP

16-BIT MCU S12X CORE 128KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 40MHz
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 59
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 8x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫5,232

S9S12G96AMLFR

NXP

16BIT 96K FLASH

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: 3K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP

在庫5,920

SPC5746GBK0AMMJ6

NXP

IC MCU 3MB FLASH

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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LPC55S14JBD100Y

NXP

IC MCU 32BIT 128KB FLSH 100HLQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 64
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Supplier Device Package: 100-HLQFP (14x14)

パッケージ: -

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MC56F83663VLH

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

Core Processor: 56800EX
Core Size: 32-Bit Single-Core
Speed: 100MHz
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Data Converters: A/D 20x12b; D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: -

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