ページ 404 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
2PD602AS,115	NXP	TRANS NPN 50V 0.5A SC-59 Transistor Type: NPN Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 50V Vce Saturation (Max) @ Ib, Ic: 600mV @ 30mA, 300mA Current - Collector Cutoff (Max): 10nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 170 @ 150mA, 10V Power - Max: 250mW Frequency - Transition: 180MHz Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫3,088
LD6806TD/29H,125	NXP	IC REG LINEAR 2.9V 200MA 5TSOP Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 2.9V Voltage - Output (Max): - Voltage Dropout (Max): 0.13V @ 200mA Current - Output: 200mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: SC-74A, SOT-753 Supplier Device Package: 5-TSOP	パッケージ: SC-74A, SOT-753	在庫6,336
MC33395EW	NXP	IC GATE DRIVER 3PHASE 32SOIC Driven Configuration: Half-Bridge Channel Type: 3-Phase Number of Drivers: 6 Gate Type: N-Channel MOSFET Voltage - Supply: 5.5 V ~ 24 V Logic Voltage - VIL, VIH: - Current - Peak Output (Source, Sink): - Input Type: Non-Inverting High Side Voltage - Max (Bootstrap): - Rise / Fall Time (Typ): 350ns, 250ns Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 32-SOIC (0.295", 7.50mm Width) Supplier Device Package: 32-SOIC	パッケージ: 32-SOIC (0.295", 7.50mm Width)	在庫5,360
PCA8581T/6,118	NXP	IC EEPROM 1KBIT 100KHZ 8SO Memory Type: Non-Volatile Memory Format: EEPROM Technology: EEPROM Memory Size: 1Kb (128 x 8) Memory Interface: I2C Clock Frequency: 100kHz Write Cycle Time - Word, Page: 10ms Access Time: - Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -25°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	パッケージ: 8-SOIC (0.154", 3.90mm Width)	在庫4,736
74AVCH20T245DGV:11	NXP	TXRX 20BIT TRANSLATNG 56TSSOP Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 2 Channels per Circuit: 10 Voltage - VCCA: 0.8V ~ 3.6V Voltage - VCCB: 0.8V ~ 3.6V Input Signal: - Output Signal: - Output Type: Tri-State, Non-Inverted Data Rate: 380Mbps Operating Temperature: -40°C ~ 125°C (TA) Features: - Mounting Type: Surface Mount Package / Case: 56-TFSOP (0.173", 4.40mm Width) Supplier Device Package: 56-TSSOP	パッケージ: 56-TFSOP (0.173", 4.40mm Width)	在庫3,856
74LVT374DB,112	NXP	IC D-TYPE POS TRG SNGL 20SSOP Function: Standard Type: D-Type Output Type: Tri-State, Non-Inverted Number of Elements: 1 Number of Bits per Element: 8 Clock Frequency: 200MHz Max Propagation Delay @ V, Max CL: 5.2ns @ 3.3V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 32mA, 64mA Voltage - Supply: 2.7 V ~ 3.6 V Current - Quiescent (Iq): 190µA Input Capacitance: 4pF Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 20-SSOP (0.209", 5.30mm Width)	パッケージ: 20-SSOP (0.209", 5.30mm Width)	在庫7,744
MC33797BPEW	NXP	IC SQUIB DRIVER 4-CH 32-SOIC Applications: - Interface: SPI Voltage - Supply: 4.75 V ~ 5.25 V Package / Case: 32-SOIC (0.295", 7.50mm Width) Supplier Device Package: 32-SOIC Mounting Type: Surface Mount	パッケージ: 32-SOIC (0.295", 7.50mm Width)	在庫35,424
P1011NSE2DFB	NXP	IC MPU Q OR IQ 800MHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	パッケージ: 689-BBGA Exposed Pad	在庫6,600
P89LPC971FDH,129	NXP	IC MCU 8BIT 4KB FLASH 20TSSOP Core Processor: 8051 Core Size: 8-Bit Speed: 18MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 18 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	パッケージ: 20-TSSOP (0.173", 4.40mm Width)	在庫6,448
P89LPC921FDH,512	NXP	IC MCU 8BIT 4KB FLASH 20TSSOP Core Processor: 8051 Core Size: 8-Bit Speed: 18MHz Connectivity: I2C, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Number of I/O: 18 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	パッケージ: 20-TSSOP (0.173", 4.40mm Width)	在庫3,152
MC68HC908JL3ECP	NXP	IC MCU 8BIT 4KB FLASH 28DIP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LED, LVD, POR, PWM Number of I/O: 23 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V Data Converters: A/D 12x8b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 28-DIP (0.600", 15.24mm) Supplier Device Package: 28-PDIP	パッケージ: 28-DIP (0.600", 15.24mm)	在庫4,656
SPC5567MVZ132	NXP	IC MCU 32BIT 2MB FLASH 324TEBGA Core Processor: e200z6 Core Size: 32-Bit Speed: 132MHz Connectivity: CAN, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 238 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 324-BBGA Supplier Device Package: 324-TEPBGA (23x23)	パッケージ: 324-BBGA	在庫3,744
MCF5471VR200	NXP	IC MCU 32BIT ROMLESS 388PBGA Core Processor: Coldfire V4E Core Size: 32-Bit Speed: 200MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Number of I/O: 99 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 388-BBGA Supplier Device Package: 388-PBGA (27x27)	パッケージ: 388-BBGA	在庫4,448
S912XHZ384F1VAG	NXP	IC MCU 16BIT 384KB FLASH 144QFP Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 117 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 28K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 16x8/10b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-QFP (20x20)	パッケージ: 144-LQFP	在庫4,288
LPC2930FBD208,551	NXP	IC MCU 32BIT ROMLESS 208LQFP Core Processor: ARM9? Core Size: 16/32-Bit Speed: 125MHz Connectivity: CAN, EBI/EMI, I2C, LIN, SPI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Number of I/O: 152 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 56K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 24x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 208-LQFP Supplier Device Package: 208-LQFP (28x28)	パッケージ: 208-LQFP	在庫5,856
S9S12G128F0MLH	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫85,212
SE95D,112	NXP	IC SENSOR TEMP 2.8-5.5V SOT96-1 Sensor Type: Digital, Local Sensing Temperature - Local: -55°C ~ 125°C Sensing Temperature - Remote: - Output Type: I2C/SMBus Voltage - Supply: 2.8 V ~ 5.5 V Resolution: 10 b Features: Output Switch, Programmable Limit, Shutdown Mode Accuracy - Highest (Lowest): ±1°C (±3°C) Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Operating Temperature: -55°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	パッケージ: 8-SOIC (0.154", 3.90mm Width)	在庫26,604
MC34VR500V8ES	NXP	REGULATOR BUCK QUAD WITH UP TO Applications: QorlQ LS1/T1 Communications Processors Current - Supply: 250µA Voltage - Supply: 2.8 V ~ 4.5 V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-QFN-EP (8x8)	パッケージ: 56-VFQFN Exposed Pad	在庫7,032
LS1023ASE8KQB	NXP	QORIQ 2XCPU 64-BIT ARM ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫6,464
MCIMX6X2AVN08AC	NXP	I.MX 6SX ROM PERF ENHAN Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 200MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17x17)	パッケージ: 400-LFBGA	在庫2,912
S9S08DN48F2VLF	NXP	M74K MASK ONLY - AUTO Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP	在庫7,152
S9S08RN16W2MTJ	NXP	8-BIT MCU S08 CORE 16KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	パッケージ: 20-TSSOP (0.173", 4.40mm Width)	在庫5,216
MC34PF8100EQEP	NXP	IC POWER MANAGEMENT I.MX8QM Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	パッケージ: 56-VFQFN Exposed Pad	在庫4,992
MC33FS5502Y0ESR2	NXP	HIGH VOLTAGE PMIC QFN56 Applications: Power Supplies Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	パッケージ: -	Request a Quote
MC33FS4508NAE	NXP	SYSTEM BASIS CHIP, LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	パッケージ: -	Request a Quote
S9S12ZVLS1AMFMR	NXP	S12Z CPU, 16K FLASH Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
MC34VR500VAESR2	NXP	REGULATOR BUCK QUAD WITH UP TO 4 Applications: QorlQ LS1/T1 Communications Processors Current - Supply: 15mA Voltage - Supply: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-QFN-EP (8x8)	パッケージ: -	Request a Quote
TEA8919DAT-1Y	NXP	TEA8919DAT Applications: - Voltage - Input: - Voltage - Supply: - Current - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	パッケージ: -	Request a Quote

2PD602AS,115

NXP

TRANS NPN 50V 0.5A SC-59

Transistor Type: NPN
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 600mV @ 30mA, 300mA
Current - Collector Cutoff (Max): 10nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 170 @ 150mA, 10V
Power - Max: 250mW
Frequency - Transition: 180MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫3,088

LD6806TD/29H,125

NXP

IC REG LINEAR 2.9V 200MA 5TSOP

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 2.9V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.13V @ 200mA
Current - Output: 200mA
Current - Quiescent (Iq): -
Current - Supply (Max): 100µA ~ 250µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: SC-74A, SOT-753
Supplier Device Package: 5-TSOP

パッケージ: SC-74A, SOT-753

在庫6,336

MC33395EW

NXP

IC GATE DRIVER 3PHASE 32SOIC

Driven Configuration: Half-Bridge
Channel Type: 3-Phase
Number of Drivers: 6
Gate Type: N-Channel MOSFET
Voltage - Supply: 5.5 V ~ 24 V
Logic Voltage - VIL, VIH: -
Current - Peak Output (Source, Sink): -
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): -
Rise / Fall Time (Typ): 350ns, 250ns
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 32-SOIC

パッケージ: 32-SOIC (0.295", 7.50mm Width)

在庫5,360

PCA8581T/6,118

NXP

IC EEPROM 1KBIT 100KHZ 8SO

Memory Type: Non-Volatile
Memory Format: EEPROM
Technology: EEPROM
Memory Size: 1Kb (128 x 8)
Memory Interface: I2C
Clock Frequency: 100kHz
Write Cycle Time - Word, Page: 10ms
Access Time: -
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -25°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

パッケージ: 8-SOIC (0.154", 3.90mm Width)

在庫4,736

74AVCH20T245DGV:11

NXP

TXRX 20BIT TRANSLATNG 56TSSOP

Translator Type: Voltage Level
Channel Type: Bidirectional
Number of Circuits: 2
Channels per Circuit: 10
Voltage - VCCA: 0.8V ~ 3.6V
Voltage - VCCB: 0.8V ~ 3.6V
Input Signal: -
Output Signal: -
Output Type: Tri-State, Non-Inverted
Data Rate: 380Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Features: -
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.173", 4.40mm Width)
Supplier Device Package: 56-TSSOP

パッケージ: 56-TFSOP (0.173", 4.40mm Width)

在庫3,856

74LVT374DB,112

NXP

IC D-TYPE POS TRG SNGL 20SSOP

Function: Standard
Type: D-Type
Output Type: Tri-State, Non-Inverted
Number of Elements: 1
Number of Bits per Element: 8
Clock Frequency: 200MHz
Max Propagation Delay @ V, Max CL: 5.2ns @ 3.3V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 2.7 V ~ 3.6 V
Current - Quiescent (Iq): 190µA
Input Capacitance: 4pF
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.209", 5.30mm Width)

パッケージ: 20-SSOP (0.209", 5.30mm Width)

在庫7,744

MC33797BPEW

NXP

IC SQUIB DRIVER 4-CH 32-SOIC

Applications: -
Interface: SPI
Voltage - Supply: 4.75 V ~ 5.25 V
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 32-SOIC
Mounting Type: Surface Mount

パッケージ: 32-SOIC (0.295", 7.50mm Width)

在庫35,424

P1011NSE2DFB

NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

パッケージ: 689-BBGA Exposed Pad

在庫6,600

P89LPC971FDH,129

NXP

IC MCU 8BIT 4KB FLASH 20TSSOP

Core Processor: 8051
Core Size: 8-Bit
Speed: 18MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O: 18
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

パッケージ: 20-TSSOP (0.173", 4.40mm Width)

在庫6,448

P89LPC921FDH,512

NXP

IC MCU 8BIT 4KB FLASH 20TSSOP

Core Processor: 8051
Core Size: 8-Bit
Speed: 18MHz
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Number of I/O: 18
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

パッケージ: 20-TSSOP (0.173", 4.40mm Width)

在庫3,152

MC68HC908JL3ECP

NXP

IC MCU 8BIT 4KB FLASH 28DIP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LED, LVD, POR, PWM
Number of I/O: 23
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V
Data Converters: A/D 12x8b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 28-DIP (0.600", 15.24mm)
Supplier Device Package: 28-PDIP

パッケージ: 28-DIP (0.600", 15.24mm)

在庫4,656

SPC5567MVZ132

NXP

IC MCU 32BIT 2MB FLASH 324TEBGA

Core Processor: e200z6
Core Size: 32-Bit
Speed: 132MHz
Connectivity: CAN, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 238
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
Data Converters: A/D 40x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 324-BBGA
Supplier Device Package: 324-TEPBGA (23x23)

パッケージ: 324-BBGA

在庫3,744

MCF5471VR200

NXP

IC MCU 32BIT ROMLESS 388PBGA

Core Processor: Coldfire V4E
Core Size: 32-Bit
Speed: 200MHz
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Number of I/O: 99
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 388-BBGA
Supplier Device Package: 388-PBGA (27x27)

パッケージ: 388-BBGA

在庫4,448

S912XHZ384F1VAG

NXP

IC MCU 16BIT 384KB FLASH 144QFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 80MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Number of I/O: 117
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 28K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 16x8/10b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-QFP (20x20)

パッケージ: 144-LQFP

在庫4,288

LPC2930FBD208,551

NXP

IC MCU 32BIT ROMLESS 208LQFP

Core Processor: ARM9?
Core Size: 16/32-Bit
Speed: 125MHz
Connectivity: CAN, EBI/EMI, I2C, LIN, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 152
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 56K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 24x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 208-LQFP
Supplier Device Package: 208-LQFP (28x28)

パッケージ: 208-LQFP

在庫5,856

S9S12G128F0MLH

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, IrDA, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫85,212

SE95D,112

NXP

IC SENSOR TEMP 2.8-5.5V SOT96-1

Sensor Type: Digital, Local
Sensing Temperature - Local: -55°C ~ 125°C
Sensing Temperature - Remote: -
Output Type: I2C/SMBus
Voltage - Supply: 2.8 V ~ 5.5 V
Resolution: 10 b
Features: Output Switch, Programmable Limit, Shutdown Mode
Accuracy - Highest (Lowest): ±1°C (±3°C)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Operating Temperature: -55°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

パッケージ: 8-SOIC (0.154", 3.90mm Width)

在庫26,604

MC34VR500V8ES

NXP

REGULATOR BUCK QUAD WITH UP TO

Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Voltage - Supply: 2.8 V ~ 4.5 V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-QFN-EP (8x8)

パッケージ: 56-VFQFN Exposed Pad

在庫7,032

LS1023ASE8KQB

NXP

QORIQ 2XCPU 64-BIT ARM ARCH 1.

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫6,464

MCIMX6X2AVN08AC

NXP

I.MX 6SX ROM PERF ENHAN

Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 200MHz, 800MHz
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Package / Case: 400-LFBGA
Supplier Device Package: 400-MAPBGA (17x17)

パッケージ: 400-LFBGA

在庫2,912

S9S08DN48F2VLF

NXP

M74K MASK ONLY - AUTO

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP

在庫7,152

S9S08RN16W2MTJ

NXP

8-BIT MCU S08 CORE 16KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 16
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 10x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

パッケージ: 20-TSSOP (0.173", 4.40mm Width)

在庫5,216

MC34PF8100EQEP

NXP

IC POWER MANAGEMENT I.MX8QM

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

パッケージ: 56-VFQFN Exposed Pad

在庫4,992

MC33FS5502Y0ESR2

NXP

HIGH VOLTAGE PMIC QFN56

Applications: Power Supplies
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

パッケージ: -

Request a Quote

MC33FS4508NAE

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

パッケージ: -

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S9S12ZVLS1AMFMR

NXP

S12Z CPU, 16K FLASH

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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MC34VR500VAESR2

NXP

REGULATOR BUCK QUAD WITH UP TO 4

Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 15mA
Voltage - Supply: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-QFN-EP (8x8)

パッケージ: -

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TEA8919DAT-1Y

NXP

TEA8919DAT

Applications: -
Voltage - Input: -
Voltage - Supply: -
Current - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

パッケージ: -

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