ページ 504 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
PDTA144EK,115	NXP	TRANS PREBIAS PNP 250MW SMT3 Transistor Type: PNP - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 47k Resistor - Emitter Base (R2) (Ohms): 47k DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: - Power - Max: 250mW Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫3,552
MC34726BFCR2	NXP	IC REG BUCK 1.8V 0.3A SYNC 8UDFN Function: Step-Down Output Configuration: Positive Topology: Buck Output Type: Fixed Number of Outputs: 1 Voltage - Input (Min): 2.7V Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 1.8V Voltage - Output (Max): - Current - Output: 300mA Frequency - Switching: 2MHz Synchronous Rectifier: Yes Operating Temperature: -25°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 8-UFDFN Supplier Device Package: 8-QFN-D (2x2)	パッケージ: 8-UFDFN	在庫2,144
TDA3629/Y,112	NXP	IC LIGHT POSITION CTRLR 8-DIP Applications: Automotive Current - Supply: 6mA Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40°C ~ 105°C Mounting Type: Through Hole Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-DIP	パッケージ: 8-DIP (0.300", 7.62mm)	在庫6,256
74HCT4515D,653	NXP	IC 4-16 DECOD/DEMUX INV 24SOIC Type: Decoder/Demultiplexer Circuit: 1 x 4:16 Independent Circuits: 1 Current - Output High, Low: 4mA, 4mA Voltage Supply Source: Single Supply Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	パッケージ: 24-SOIC (0.295", 7.50mm Width)	在庫7,152
N74F174N,602	NXP	IC D-TYPE POS TRG SNGL 16DIP Function: Master Reset Type: D-Type Output Type: Non-Inverted Number of Elements: 1 Number of Bits per Element: 6 Clock Frequency: 100MHz Max Propagation Delay @ V, Max CL: 10ns @ 5V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 1mA, 20mA Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Iq): 45mA Input Capacitance: - Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm)	パッケージ: 16-DIP (0.300", 7.62mm)	在庫6,160
UJA1075ATW/3V3WD,1	NXP	IC SBC CAN/LIN 3.3V HS 32HTSSOP Applications: Automotive Interface: CAN, LIN Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	パッケージ: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	在庫4,528
PCA9548ABS,118	NXP	IC I2C SWITCH 8CH 24-HVQFN Applications: Translating Switch Interface: I2C, SMBus Voltage - Supply: 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (4x4) Mounting Type: Surface Mount	パッケージ: 24-VFQFN Exposed Pad	在庫117,372
MPC8572PXATLD	NXP	IC MPU MPC85XX 1.2GHZ 1023FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 1023-BFBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33x33)	パッケージ: 1023-BFBGA, FCBGA	在庫4,848
KMPC859PVR133A	NXP	IC MPU MPC8XX 133MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	パッケージ: 357-BBGA	在庫5,248
MPC8358CVRAGDDA	NXP	IC MPU MPC83XX 400MHZ 668BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 668-BBGA Exposed Pad Supplier Device Package: 668-PBGA-PGE (29x29)	パッケージ: 668-BBGA Exposed Pad	在庫7,904
P87C54UBAA,512	NXP	IC MCU 8BIT 16KB OTP 44PLCC Core Processor: 8051 Core Size: 8-Bit Speed: 33MHz Connectivity: EBI/EMI, UART/USART Peripherals: POR Number of I/O: 32 Program Memory Size: 16KB (16K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	パッケージ: 44-LCC (J-Lead)	在庫6,112
MCS12GC64VFUE	NXP	IC MCU 16BIT 64KB FLASH 80QFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 60 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	パッケージ: 80-QFP	在庫6,000
MC68HC908GT8CB	NXP	IC MCU 8BIT 8KB FLASH 42PSDIP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 34 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 42-SDIP (0.600", 15.24mm) Supplier Device Package: 42-PSDIP	パッケージ: 42-SDIP (0.600", 15.24mm)	在庫5,072
P89C668HBA/00,512	NXP	IC MCU 8BIT 64KB FLASH 44PLCC Core Processor: 8051 Core Size: 8-Bit Speed: 33MHz Connectivity: I2C, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 32 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	パッケージ: 44-LCC (J-Lead)	在庫2,656
MC908LJ12CFUE	NXP	IC MCU 8BIT 12KB FLASH 64QFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: IRSCI, SPI Peripherals: LCD, LVD, POR, PWM Number of I/O: 32 Program Memory Size: 12KB (12K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	パッケージ: 64-QFP	在庫23,460
LPC811M001JDH16J	NXP	IC MCU 32BIT 8KB FLASH 16TSSOP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 30MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	パッケージ: 16-TSSOP (0.173", 4.40mm Width)	在庫4,288
MSC7118VM1200	NXP	DSP 16BIT W/DDR CTRLR 400-MAPBGA Type: Fixed Point Interface: Host Interface, I2C, UART Clock Rate: 300MHz Non-Volatile Memory: ROM (8 kB) On-Chip RAM: 464kB Voltage - I/O: 3.30V Voltage - Core: 1.20V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17x17)	パッケージ: 400-LFBGA	在庫7,680
MPXM2010GST1	NXP	SENS PRESSURE 1.45 PSI MAX 5MPAK Pressure Type: Vented Gauge Operating Pressure: 1.45 PSI (10 kPa) Output Type: Wheatstone Bridge Output: 0 mV ~ 25 mV (10V) Accuracy: ±1% Voltage - Supply: 10 V ~ 16 V Port Size: Male - 0.12" (2.97mm) Tube Port Style: Barbless Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 10.88 PSI (75 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 5-SMD Module Supplier Device Package: 5-MPAK	パッケージ: 5-SMD Module	在庫4,734
TFF1017HN/N1,115	NXP	IC MIXER 10.7-12.75GHZ 16DHVQFN RF Type: Ku-Band Frequency: 10.7GHz ~ 12.75GHz Number of Mixers: 1 Gain: 42dB Noise Figure: 7dB Secondary Attributes: Down Converter Current - Supply: 52mA Voltage - Supply: 4.5 V ~ 5.5 V Package / Case: 16-VFQFN Exposed Pad Supplier Device Package: 16-DHVQFN (2.5x3.5)	パッケージ: 16-VFQFN Exposed Pad	在庫29,892
MCIMX6QP7CVT8AB	NXP	IC MPU I.MX6QP ENHAN 624FCBGA Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	パッケージ: 624-FBGA, FCBGA	在庫6,480
LPC54016JET180E	NXP	32-BIT ARM CORTEX-M4 Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Number of I/O: 145 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 360K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 180-TFBGA Supplier Device Package: 180-TFBGA (12x12)	パッケージ: 180-TFBGA	在庫7,488
SPC5603BK0CLQ4	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 123 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 28K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 36x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫4,768
S912ZVMC25F1MKKR	NXP	MAGNIV 16-BIT MCU, S12Z CORE, 25 Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 31 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 80-LQFP Exposed Pad Supplier Device Package: 80-TQFP-EP (12x12)	パッケージ: -	Request a Quote
S32G234MABK1VUCT	NXP	S32G234M ARM CORTEX-M7, HSE, LLC Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1/2.5Gbps (4) SATA: - USB: - Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	パッケージ: -	Request a Quote
SAF7770EL-203Z130K	NXP	IC Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
FD32K144HRT0VLHT	NXP	S32K144 32-BIT MCU, ARM CORTEX-M Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
LPC2388FBD144K	NXP	IC MCU 16/32B 512KB FLSH 144LQFP Core Processor: ARM7® Core Size: 16/32-Bit Speed: 72MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 104 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 98K x 8 Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b SAR; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: -	在庫1,755
S912ZVLA64ACLF	NXP	S12Z CPU, 64K FLASH Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Data Converters: A/D 10x10b, 10x12b; D/A 1x8b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: -	Request a Quote

PDTA144EK,115

NXP

TRANS PREBIAS PNP 250MW SMT3

Transistor Type: PNP - Pre-Biased
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 47k
Resistor - Emitter Base (R2) (Ohms): 47k
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
Frequency - Transition: -
Power - Max: 250mW
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫3,552

MC34726BFCR2

NXP

IC REG BUCK 1.8V 0.3A SYNC 8UDFN

Function: Step-Down
Output Configuration: Positive
Topology: Buck
Output Type: Fixed
Number of Outputs: 1
Voltage - Input (Min): 2.7V
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 1.8V
Voltage - Output (Max): -
Current - Output: 300mA
Frequency - Switching: 2MHz
Synchronous Rectifier: Yes
Operating Temperature: -25°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-UFDFN
Supplier Device Package: 8-QFN-D (2x2)

パッケージ: 8-UFDFN

在庫2,144

TDA3629/Y,112

NXP

IC LIGHT POSITION CTRLR 8-DIP

Applications: Automotive
Current - Supply: 6mA
Voltage - Supply: 8 V ~ 18 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-DIP

パッケージ: 8-DIP (0.300", 7.62mm)

在庫6,256

74HCT4515D,653

NXP

IC 4-16 DECOD/DEMUX INV 24SOIC

Type: Decoder/Demultiplexer
Circuit: 1 x 4:16
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 24-SO

パッケージ: 24-SOIC (0.295", 7.50mm Width)

在庫7,152

N74F174N,602

NXP

IC D-TYPE POS TRG SNGL 16DIP

Function: Master Reset
Type: D-Type
Output Type: Non-Inverted
Number of Elements: 1
Number of Bits per Element: 6
Clock Frequency: 100MHz
Max Propagation Delay @ V, Max CL: 10ns @ 5V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 1mA, 20mA
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Iq): 45mA
Input Capacitance: -
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)

パッケージ: 16-DIP (0.300", 7.62mm)

在庫6,160

UJA1075ATW/3V3WD,1

NXP

IC SBC CAN/LIN 3.3V HS 32HTSSOP

Applications: Automotive
Interface: CAN, LIN
Voltage - Supply: 4.5 V ~ 28 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

パッケージ: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

在庫4,528

PCA9548ABS,118

NXP

IC I2C SWITCH 8CH 24-HVQFN

Applications: Translating Switch
Interface: I2C, SMBus
Voltage - Supply: 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-HVQFN (4x4)
Mounting Type: Surface Mount

パッケージ: 24-VFQFN Exposed Pad

在庫117,372

MPC8572PXATLD

NXP

IC MPU MPC85XX 1.2GHZ 1023FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 1023-BFBGA, FCBGA
Supplier Device Package: 1023-FCPBGA (33x33)

パッケージ: 1023-BFBGA, FCBGA

在庫4,848

KMPC859PVR133A

NXP

IC MPU MPC8XX 133MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 133MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

パッケージ: 357-BBGA

在庫5,248

MPC8358CVRAGDDA

NXP

IC MPU MPC83XX 400MHZ 668BGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 668-BBGA Exposed Pad
Supplier Device Package: 668-PBGA-PGE (29x29)

パッケージ: 668-BBGA Exposed Pad

在庫7,904

P87C54UBAA,512

NXP

IC MCU 8BIT 16KB OTP 44PLCC

Core Processor: 8051
Core Size: 8-Bit
Speed: 33MHz
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Number of I/O: 32
Program Memory Size: 16KB (16K x 8)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

パッケージ: 44-LCC (J-Lead)

在庫6,112

MCS12GC64VFUE

NXP

IC MCU 16BIT 64KB FLASH 80QFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 60
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

パッケージ: 80-QFP

在庫6,000

MC68HC908GT8CB

NXP

IC MCU 8BIT 8KB FLASH 42PSDIP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Number of I/O: 34
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 42-SDIP (0.600", 15.24mm)
Supplier Device Package: 42-PSDIP

パッケージ: 42-SDIP (0.600", 15.24mm)

在庫5,072

P89C668HBA/00,512

NXP

IC MCU 8BIT 64KB FLASH 44PLCC

Core Processor: 8051
Core Size: 8-Bit
Speed: 33MHz
Connectivity: I2C, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 32
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

パッケージ: 44-LCC (J-Lead)

在庫2,656

MC908LJ12CFUE

NXP

IC MCU 8BIT 12KB FLASH 64QFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Number of I/O: 32
Program Memory Size: 12KB (12K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 6x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-QFP
Supplier Device Package: 64-QFP (14x14)

パッケージ: 64-QFP

在庫23,460

LPC811M001JDH16J

NXP

IC MCU 32BIT 8KB FLASH 16TSSOP

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 30MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O: 14
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

パッケージ: 16-TSSOP (0.173", 4.40mm Width)

在庫4,288

MSC7118VM1200

NXP

DSP 16BIT W/DDR CTRLR 400-MAPBGA

Type: Fixed Point
Interface: Host Interface, I2C, UART
Clock Rate: 300MHz
Non-Volatile Memory: ROM (8 kB)
On-Chip RAM: 464kB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Supplier Device Package: 400-MAPBGA (17x17)

パッケージ: 400-LFBGA

在庫7,680

MPXM2010GST1

NXP

SENS PRESSURE 1.45 PSI MAX 5MPAK

Pressure Type: Vented Gauge
Operating Pressure: 1.45 PSI (10 kPa)
Output Type: Wheatstone Bridge
Output: 0 mV ~ 25 mV (10V)
Accuracy: ±1%
Voltage - Supply: 10 V ~ 16 V
Port Size: Male - 0.12" (2.97mm) Tube
Port Style: Barbless
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 10.88 PSI (75 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 5-SMD Module
Supplier Device Package: 5-MPAK

パッケージ: 5-SMD Module

在庫4,734

TFF1017HN/N1,115

NXP

IC MIXER 10.7-12.75GHZ 16DHVQFN

RF Type: Ku-Band
Frequency: 10.7GHz ~ 12.75GHz
Number of Mixers: 1
Gain: 42dB
Noise Figure: 7dB
Secondary Attributes: Down Converter
Current - Supply: 52mA
Voltage - Supply: 4.5 V ~ 5.5 V
Package / Case: 16-VFQFN Exposed Pad
Supplier Device Package: 16-DHVQFN (2.5x3.5)

パッケージ: 16-VFQFN Exposed Pad

在庫29,892

MCIMX6QP7CVT8AB

NXP

IC MPU I.MX6QP ENHAN 624FCBGA

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 4 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet: 10/100/1000 Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Package / Case: 624-FBGA, FCBGA
Supplier Device Package: 624-FCBGA (21x21)

パッケージ: 624-FBGA, FCBGA

在庫6,480

LPC54016JET180E

NXP

32-BIT ARM CORTEX-M4

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O: 145
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 360K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 180-TFBGA
Supplier Device Package: 180-TFBGA (12x12)

パッケージ: 180-TFBGA

在庫7,488

SPC5603BK0CLQ4

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 123
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 28K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 36x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫4,768

S912ZVMC25F1MKKR

NXP

MAGNIV 16-BIT MCU, S12Z CORE, 25

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 31
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Data Converters: A/D 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 80-LQFP Exposed Pad
Supplier Device Package: 80-TQFP-EP (12x12)

パッケージ: -

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S32G234MABK1VUCT

NXP

S32G234M ARM CORTEX-M7, HSE, LLC

Core Processor: ARM® Cortex®-M7
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Speed: 400MHz
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1/2.5Gbps (4)
SATA: -
USB: -
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

パッケージ: -

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SAF7770EL-203Z130K

NXP

IC

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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FD32K144HRT0VLHT

NXP

S32K144 32-BIT MCU, ARM CORTEX-M

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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LPC2388FBD144K

NXP

IC MCU 16/32B 512KB FLSH 144LQFP

Core Processor: ARM7®
Core Size: 16/32-Bit
Speed: 72MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O: 104
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 98K x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Data Converters: A/D 8x10b SAR; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: -

在庫1,755

S912ZVLA64ACLF

NXP

S12Z CPU, 64K FLASH

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: -

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