ページ 506 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
BZX84-C2V7/LF1VL	NXP	DIODE ZENER TO-236AB SOT23 Voltage - Zener (Nom) (Vz): 2.7V Tolerance: ±5% Power - Max: 250mW Impedance (Max) (Zzt): 100 Ohms Current - Reverse Leakage @ Vr: 20µA @ 1V Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫2,336
LD6816CX4/33H,315	NXP	IC REG LINEAR 3.3V 150MA 4WLCSP Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 3.3V Voltage - Output (Max): - Voltage Dropout (Max): 0.075V @ 150mA Current - Output: 150mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature, Transient Voltage Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-XFBGA, WLCSP Supplier Device Package: 4-WLCSP (0.76x0.76)	パッケージ: 4-XFBGA, WLCSP	在庫6,832
LD6806F/13H,115	NXP	IC REG LINEAR 1.3V 200MA 6-XSON Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 1.3V Voltage - Output (Max): - Voltage Dropout (Max): 0.13V @ 200mA Current - Output: 200mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 6-XFDFN Supplier Device Package: 6-XSON, SOT886 (1.45x1)	パッケージ: 6-XFDFN	在庫6,816
74LV365PW,118	NXP	IC BUFF/DVR TRI-ST 6BIT 16TSSOP Logic Type: Buffer, Non-Inverting Number of Elements: 1 Number of Bits per Element: 6 Input Type: - Output Type: Push-Pull Current - Output High, Low: 8mA, 8mA Voltage - Supply: 1 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	パッケージ: 16-TSSOP (0.173", 4.40mm Width)	在庫6,064
PCA6408ABSHP	NXP	IC I/O EXPANDER 8BIT I2C 16HVQFN Number of I/O: 8 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 1.65 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-VFQFN Exposed Pad Supplier Device Package: 16-HVQFN (3x3)	パッケージ: 16-VFQFN Exposed Pad	在庫5,328
KMPC8241TZQ166D	NXP	IC MPU MPC82XX 166MHZ 357BGA Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 166MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	パッケージ: 357-BBGA	在庫3,952
P5020NXN7VNB	NXP	IC MPU Q OR IQ 2.0GHZ 1295FCBGA Core Processor: PowerPC e5500 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 2.0GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (5), 10 Gbps (1) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5)	パッケージ: 1295-BBGA, FCBGA	在庫7,136
MCIMX6L8DVN10AB	NXP	IC MPU I.MX6SL 1.0GHZ 432MAPBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 + PHY (3) Voltage - I/O: 1.2V, 1.8V, 3.0V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 432-TFBGA Supplier Device Package: 432-MAPBGA (13x13)	パッケージ: 432-TFBGA	在庫5,568
P87LPC761BN,112	NXP	IC MCU 8BIT 2KB OTP 16DIP Core Processor: 8051 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, WDT Number of I/O: 14 Program Memory Size: 2KB (2K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 6 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	パッケージ: 16-DIP (0.300", 7.62mm)	在庫2,880
S9S12DP51J4VPVE	NXP	IC MCU 16BIT 512KB FLASH 112LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: PWM, WDT Number of I/O: 20 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 14K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	パッケージ: 112-LQFP	在庫2,464
MCF51QU128VLHR	NXP	IC MCU 32BIT 128KB FLASH 64LQFP Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 48 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 19x12b, D/A 1x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫5,360
MKL14Z64VFM4R	NXP	IC MCU 32BIT 64KB FLASH 32QFN Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Number of I/O: 28 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (5x5)	パッケージ: 32-VFQFN Exposed Pad	在庫6,320
MC68HC908QY4VDTE	NXP	IC MCU 8BIT 4KB FLASH 16TSSOP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	パッケージ: 16-TSSOP (0.173", 4.40mm Width)	在庫14,352
MK10DN64VMP5	NXP	IC MCU 32BIT 64KB FLASH 64MAPBGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 44 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 19x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LFBGA Supplier Device Package: 64-MAPBGA (5x5)	パッケージ: 64-LFBGA	在庫4,784
KTY81/210,112	NXP	IC TEMPERATURE SENSOR SOD70 Resistance in Ohms @ 25°C: 2k Resistance Tolerance: - Operating Temperature: -55°C ~ 150°C Power - Max: - Mounting Type: Through Hole Package / Case: TO-226-2, TO-92-2 (TO-226AC) Supplier Device Package: PBCYT2	パッケージ: TO-226-2, TO-92-2 (TO-226AC)	在庫30,000
SE95DP,118	NXP	SENSOR TEMP I2C/SMBUS 8TSSOP Sensor Type: Digital, Local Sensing Temperature - Local: -55°C ~ 125°C Sensing Temperature - Remote: - Output Type: I2C/SMBus Voltage - Supply: 2.8 V ~ 5.5 V Resolution: 10 b Features: Output Switch, Programmable Limit, Shutdown Mode Accuracy - Highest (Lowest): ±1°C (±3°C) Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Operating Temperature: -55°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Supplier Device Package: 8-TSSOP	パッケージ: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)	在庫41,286
MC13192FC	NXP	IC RF TXRX 802.15.4/ISM 32-VFQFN Type: TxRx Only RF Family/Standard: 802.15.4, General ISM > 1GHz Protocol: Zigbee? Modulation: DSSS, O-QPSK Frequency: 2.4GHz Data Rate (Max): 250kbps Power - Output: 4dBm Sensitivity: -92dBm Memory Size: - Serial Interfaces: SPI GPIO: 7 Voltage - Supply: 2 V ~ 3.4 V Current - Receiving: 37mA Current - Transmitting: 30mA Operating Temperature: -40°C ~ 85°C Package / Case: 32-VFQFN Exposed Pad	パッケージ: 32-VFQFN Exposed Pad	在庫13,152
BGM1011,115	NXP	IC MMIC AMPLIFIER 6TSSOP Frequency: 0Hz ~ 3GHz P1dB: 12.2dBm (16.6mW) Gain: 30dB Noise Figure: 4.7dB RF Type: ISM Voltage - Supply: 5 V ~ 6 V Current - Supply: 25.5mA Test Frequency: 1GHz Package / Case: 6-TSSOP, SC-88, SOT-363 Supplier Device Package: 6-TSSOP	パッケージ: 6-TSSOP, SC-88, SOT-363	在庫4,536
MC33FS6500NAER2	NXP	SYSTEM BASIS CHIP DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP Exposed Pad	在庫5,504
SPC5643LAMMM1R	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 120MHz Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 32x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 257-LFBGA Supplier Device Package: 257-MAPBGA (14x14)	パッケージ: 257-LFBGA	在庫5,840
SPC5607BAMLU6R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 149 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 29x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	パッケージ: 176-LQFP	在庫4,768
MKV10Z64VFM7P	NXP	KV11 128K RP Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 75MHz Connectivity: I²C, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Number of I/O: 28 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 2x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (5x5)	パッケージ: 32-VFQFN Exposed Pad	在庫4,720
MC33FS4507NAE	NXP	SYSTEM BASIS CHIP, LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	パッケージ: -	Request a Quote
FS32K146HRT0MLQR	NXP	IC MCU 32BIT 1MB FLASH 144LQFP Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 80MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 128 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: -	Request a Quote
MIMX9332XVVXMAB	NXP	IC Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
MCF54453CVP200	NXP	IC MCU 32BIT ROMLESS 360BGA Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Data Converters: - Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 360-BBGA Supplier Device Package: 360-BGA (23x23)	パッケージ: -	在庫888
S9S12GN32J1CLC	NXP	IC MCU 16BIT 32KB FLASH 32LQFP Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	パッケージ: -	Request a Quote
SAF4000EL-102Z524Y	NXP	SAF4000EL Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote

BZX84-C2V7/LF1VL

NXP

DIODE ZENER TO-236AB SOT23

Voltage - Zener (Nom) (Vz): 2.7V
Tolerance: ±5%
Power - Max: 250mW
Impedance (Max) (Zzt): 100 Ohms
Current - Reverse Leakage @ Vr: 20µA @ 1V
Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫2,336

LD6816CX4/33H,315

NXP

IC REG LINEAR 3.3V 150MA 4WLCSP

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 3.3V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.075V @ 150mA
Current - Output: 150mA
Current - Quiescent (Iq): -
Current - Supply (Max): 100µA ~ 250µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature, Transient Voltage
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 4-XFBGA, WLCSP
Supplier Device Package: 4-WLCSP (0.76x0.76)

パッケージ: 4-XFBGA, WLCSP

在庫6,832

LD6806F/13H,115

NXP

IC REG LINEAR 1.3V 200MA 6-XSON

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 1.3V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.13V @ 200mA
Current - Output: 200mA
Current - Quiescent (Iq): -
Current - Supply (Max): 100µA ~ 250µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Supplier Device Package: 6-XSON, SOT886 (1.45x1)

パッケージ: 6-XFDFN

在庫6,816

74LV365PW,118

NXP

IC BUFF/DVR TRI-ST 6BIT 16TSSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 6
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 8mA, 8mA
Voltage - Supply: 1 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

パッケージ: 16-TSSOP (0.173", 4.40mm Width)

在庫6,064

PCA6408ABSHP

NXP

IC I/O EXPANDER 8BIT I2C 16HVQFN

Number of I/O: 8
Interface: I2C, SMBus
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 10mA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 1.65 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-VFQFN Exposed Pad
Supplier Device Package: 16-HVQFN (3x3)

パッケージ: 16-VFQFN Exposed Pad

在庫5,328

KMPC8241TZQ166D

NXP

IC MPU MPC82XX 166MHZ 357BGA

Core Processor: PowerPC 603e
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 166MHz
Co-Processors/DSP: -
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

パッケージ: 357-BBGA

在庫3,952

P5020NXN7VNB

NXP

IC MPU Q OR IQ 2.0GHZ 1295FCBGA

Core Processor: PowerPC e5500
Number of Cores/Bus Width: 2 Core, 64-Bit
Speed: 2.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (5), 10 Gbps (1)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 1295-BBGA, FCBGA
Supplier Device Package: 1295-FCPBGA (37.5x37.5)

パッケージ: 1295-BBGA, FCBGA

在庫7,136

MCIMX6L8DVN10AB

NXP

IC MPU I.MX6SL 1.0GHZ 432MAPBGA

Core Processor: ARM? Cortex?-A9
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (3)
Voltage - I/O: 1.2V, 1.8V, 3.0V
Operating Temperature: 0°C ~ 95°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 432-TFBGA
Supplier Device Package: 432-MAPBGA (13x13)

パッケージ: 432-TFBGA

在庫5,568

P87LPC761BN,112

NXP

IC MCU 8BIT 2KB OTP 16DIP

Core Processor: 8051
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Number of I/O: 14
Program Memory Size: 2KB (2K x 8)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

パッケージ: 16-DIP (0.300", 7.62mm)

在庫2,880

S9S12DP51J4VPVE

NXP

IC MCU 16BIT 512KB FLASH 112LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: PWM, WDT
Number of I/O: 20
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 14K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
Data Converters: A/D 8x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

パッケージ: 112-LQFP

在庫2,464

MCF51QU128VLHR

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

Core Processor: Coldfire V1
Core Size: 32-Bit
Speed: 50MHz
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 48
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 19x12b, D/A 1x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫5,360

MKL14Z64VFM4R

NXP

IC MCU 32BIT 64KB FLASH 32QFN

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, LIN, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Number of I/O: 28
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-QFN (5x5)

パッケージ: 32-VFQFN Exposed Pad

在庫6,320

MC68HC908QY4VDTE

NXP

IC MCU 8BIT 4KB FLASH 16TSSOP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LVD, POR, PWM
Number of I/O: 13
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 4x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

パッケージ: 16-TSSOP (0.173", 4.40mm Width)

在庫14,352

MK10DN64VMP5

NXP

IC MCU 32BIT 64KB FLASH 64MAPBGA

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 44
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 19x16b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LFBGA
Supplier Device Package: 64-MAPBGA (5x5)

パッケージ: 64-LFBGA

在庫4,784

KTY81/210,112

NXP

IC TEMPERATURE SENSOR SOD70

Resistance in Ohms @ 25°C: 2k
Resistance Tolerance: -
Operating Temperature: -55°C ~ 150°C
Power - Max: -
Mounting Type: Through Hole
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Supplier Device Package: PBCYT2

パッケージ: TO-226-2, TO-92-2 (TO-226AC)

在庫30,000

SE95DP,118

NXP

SENSOR TEMP I2C/SMBUS 8TSSOP

Sensor Type: Digital, Local
Sensing Temperature - Local: -55°C ~ 125°C
Sensing Temperature - Remote: -
Output Type: I2C/SMBus
Voltage - Supply: 2.8 V ~ 5.5 V
Resolution: 10 b
Features: Output Switch, Programmable Limit, Shutdown Mode
Accuracy - Highest (Lowest): ±1°C (±3°C)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Operating Temperature: -55°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Supplier Device Package: 8-TSSOP

パッケージ: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

在庫41,286

MC13192FC

NXP

IC RF TXRX 802.15.4/ISM 32-VFQFN

Type: TxRx Only
RF Family/Standard: 802.15.4, General ISM > 1GHz
Protocol: Zigbee?
Modulation: DSSS, O-QPSK
Frequency: 2.4GHz
Data Rate (Max): 250kbps
Power - Output: 4dBm
Sensitivity: -92dBm
Memory Size: -
Serial Interfaces: SPI
GPIO: 7
Voltage - Supply: 2 V ~ 3.4 V
Current - Receiving: 37mA
Current - Transmitting: 30mA
Operating Temperature: -40°C ~ 85°C
Package / Case: 32-VFQFN Exposed Pad

パッケージ: 32-VFQFN Exposed Pad

在庫13,152

BGM1011,115

NXP

IC MMIC AMPLIFIER 6TSSOP

Frequency: 0Hz ~ 3GHz
P1dB: 12.2dBm (16.6mW)
Gain: 30dB
Noise Figure: 4.7dB
RF Type: ISM
Voltage - Supply: 5 V ~ 6 V
Current - Supply: 25.5mA
Test Frequency: 1GHz
Package / Case: 6-TSSOP, SC-88, SOT-363
Supplier Device Package: 6-TSSOP

パッケージ: 6-TSSOP, SC-88, SOT-363

在庫4,536

MC33FS6500NAER2

NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP Exposed Pad

在庫5,504

SPC5643LAMMM1R

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Speed: 120MHz
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 32x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 257-LFBGA
Supplier Device Package: 257-MAPBGA (14x14)

パッケージ: 257-LFBGA

在庫5,840

SPC5607BAMLU6R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 149
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 29x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

パッケージ: 176-LQFP

在庫4,768

MKV10Z64VFM7P

NXP

KV11 128K RP

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 75MHz
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 28
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 2x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-QFN (5x5)

パッケージ: 32-VFQFN Exposed Pad

在庫4,720

MC33FS4507NAE

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

パッケージ: -

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FS32K146HRT0MLQR

NXP

IC MCU 32BIT 1MB FLASH 144LQFP

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit Single-Core
Speed: 80MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 128
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b SAR; D/A1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: -

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MIMX9332XVVXMAB

NXP

IC

Architecture: -
Core Processor: -
Flash Size: -
RAM Size: -
Peripherals: -
Connectivity: -
Speed: -
Primary Attributes: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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MCF54453CVP200

NXP

IC MCU 32BIT ROMLESS 360BGA

Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Speed: 200MHz
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Number of I/O: 132
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Data Converters: -
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 360-BBGA
Supplier Device Package: 360-BGA (23x23)

パッケージ: -

在庫888

S9S12GN32J1CLC

NXP

IC MCU 16BIT 32KB FLASH 32LQFP

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

パッケージ: -

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SAF4000EL-102Z524Y

NXP

SAF4000EL

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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