ページ 761 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
PMN50XP,165	NXP	MOSFET P-CH 20V 4.8A 6TSOP FET Type: P-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 20V Current - Continuous Drain (Id) @ 25°C: 4.8A (Tc) Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V Vgs(th) (Max) @ Id: 950mV @ 250µA Gate Charge (Qg) (Max) @ Vgs: 10nC @ 4.5V Input Capacitance (Ciss) (Max) @ Vds: 1020pF @ 20V Vgs (Max): ±12V FET Feature: - Power Dissipation (Max): 2.2W (Tc) Rds On (Max) @ Id, Vgs: 60 mOhm @ 2.8A, 4.5V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 6-TSOP Package / Case: SC-74, SOT-457	パッケージ: SC-74, SOT-457	在庫2,912
A2I25D025NR1	NXP	IC TRANS RF LDMOS Transistor Type: LDMOS (Dual) Frequency: 2.69GHz Gain: 31.9dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 59mA Power - Output: 3.2W Voltage - Rated: 65V Package / Case: TO-270-17 Variant, Flat Leads Supplier Device Package: TO-270WB-17	パッケージ: TO-270-17 Variant, Flat Leads	在庫3,168
BAP51-06W,115	NXP	DIODE PIN GP 50V 50MA SOT323 Diode Type: PIN - 1 Pair Common Anode Voltage - Peak Reverse (Max): 50V Current - Max: 50mA Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz Resistance @ If, F: 2.5 Ohm @ 10mA, 100MHz Power Dissipation (Max): 240mW Operating Temperature: -65°C ~ 150°C (TJ) Package / Case: SC-70, SOT-323 Supplier Device Package: SOT-323-3	パッケージ: SC-70, SOT-323	在庫23,382
LD6806F/28H,115	NXP	IC REG LINEAR 2.8V 200MA 6-XSON Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 2.8V Voltage - Output (Max): - Voltage Dropout (Max): 0.13V @ 200mA Current - Output: 200mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 6-XFDFN Supplier Device Package: 6-XSON, SOT886 (1.45x1)	パッケージ: 6-XFDFN	在庫2,816
PCF1252-0T/F4,118	NXP	IC VOLT DETECT W/RESET 8SOIC Type: Simple Reset/Power-On Reset Number of Voltages Monitored: 1 Output: Push-Pull, Totem Pole Reset: Active High Reset Timeout: 400 µs Minimum Voltage - Threshold: 4.75V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	パッケージ: 8-SOIC (0.154", 3.90mm Width)	在庫2,928
MC34905CS5EK	NXP	IC SBC HIGH SPEED CAN 5V 32SOIC Applications: System Basis Chip Current - Supply: 2mA Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC	パッケージ: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad	在庫4,256
MC10XSD200BFKR2	NXP	IC SWITCH HIGH SIDE 23PQFN Switch Type: General Purpose Number of Outputs: 2 Ratio - Input:Output: - Output Configuration: High Side Output Type: - Interface: SPI Voltage - Load: 8 V ~ 36 V Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Current - Output (Max): 6A Rds On (Typ): 10 mOhm Input Type: - Features: - Fault Protection: Open Load Detect, Over Temperature, Over Voltage Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 23-PowerQFN Supplier Device Package: 23-PQFN (12x12)	パッケージ: 23-PowerQFN	在庫5,184
74LVC02APW/AUJ	NXP	IC GATE NOR 4CH 2-INP 14-TSSOP Logic Type: NOR Gate Number of Circuits: 4 Number of Inputs: 2 Features: - Voltage - Supply: 1.65 V ~ 3.6 V Current - Quiescent (Max): 10µA Current - Output High, Low: 24mA, 24mA Logic Level - Low: 0.12 V ~ 0.8 V Logic Level - High: 1.08 V ~ 2 V Max Propagation Delay @ V, Max CL: 4.4ns @ 3.3V, 50pF Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Supplier Device Package: 14-TSSOP Package / Case: 14-TSSOP (0.173", 4.40mm Width)	パッケージ: 14-TSSOP (0.173", 4.40mm Width)	在庫5,184
74ALVCH162827DGG:1	NXP	IC BUFF DVR TRI-ST 20BIT 56TSSOP Logic Type: Buffer, Non-Inverting Number of Elements: 2 Number of Bits per Element: 10 Input Type: - Output Type: Push-Pull Current - Output High, Low: 12mA, 12mA Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 56-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 56-TSSOP	パッケージ: 56-TFSOP (0.240", 6.10mm Width)	在庫3,744
PCA9516APW,118	NXP	IC REDRIVER I2C 5CH 16TSSOP Type: Buffer, ReDriver Applications: I2C Input: 2-Wire Bus Output: 2-Wire Bus Data Rate (Max): 400kHz Number of Channels: 5 Delay Time: - Signal Conditioning: - Capacitance - Input: 6pF Voltage - Supply: 3 V ~ 3.6 V Current - Supply: 5mA Operating Temperature: -40°C ~ 85°C Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	パッケージ: 16-TSSOP (0.173", 4.40mm Width)	在庫4,896
PCAL9535AHF,128	NXP	IC I/O EXPANDER 16BIT 24HWQFN Number of I/O: 16 Interface: I2C Interrupt Output: Yes Features: POR Output Type: Open Drain, Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 1.65 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-WFQFN Exposed Pad Supplier Device Package: 24-HWQFN (4x4)	パッケージ: 24-WFQFN Exposed Pad	在庫3,184
PCA9535CHF,118	NXP	IC I/O EXPANDER I2C 16B 24HWQFN Number of I/O: 16 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-WFQFN Exposed Pad Supplier Device Package: 24-HWQFN (4x4)	パッケージ: 24-WFQFN Exposed Pad	在庫6,832
PCAL6416AEVJ	NXP	IC I/O EXPANDER 16BIT 24VFBGA Number of I/O: 16 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Open Drain, Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 1.65 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-VFBGA Supplier Device Package: 24-VFBGA (3x3)	パッケージ: 24-VFBGA	在庫48,540
MC8640TVU1250HE	NXP	IC MPU MPC86XX 1.25GHZ 994FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.25GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 994-BCBGA, FCCBGA Supplier Device Package: 994-FCCBGA (33x33)	パッケージ: 994-BCBGA, FCCBGA	在庫6,512
MPC8313CVRAFFB	NXP	IC MPU MPC83XX 333MHZ 516BGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27x27)	パッケージ: 516-BBGA Exposed Pad	在庫5,872
MC8640DTVJ1000HE	NXP	IC MPU E600 DUAL CORE 1023FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 1023-BCBGA, FCCBGA Supplier Device Package: 1023-FCCBGA (33x33)	パッケージ: 1023-BCBGA, FCCBGA	在庫6,384
MC9S08DZ32MLH	NXP	IC MCU 8BIT 32KB FLASH 64LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 53 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫144,060
MC68711E20CFNE3	NXP	IC MCU 8BIT 20KB OTP 52PLCC Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: 20KB (20K x 8) Program Memory Type: OTP EEPROM Size: 512 x 8 RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1)	パッケージ: 52-LCC (J-Lead)	在庫16,224
MCF52236CAF50	NXP	IC MCU 32BIT 256KB FLASH 80LQFP Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 50MHz Connectivity: Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (14x14)	パッケージ: 80-LQFP	在庫3,840
MK22FN1M0AVLL12	NXP	IC MCU 32BIT 1MB FLASH 100LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 120MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 66 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 33x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: 100-LQFP	在庫7,424
MKL33Z256VMP4	NXP	IC MCU 32BIT 256KB FLASH 64BGA Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 16x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LFBGA Supplier Device Package: 64-MAPBGA (5x5)	パッケージ: 64-LFBGA	在庫8,520
MC34VR5100A0EPR2	NXP	POWER MANAGEMENT IC I.MX7 PRE- Applications: LS1 Communication Processors Current - Supply: 450µA Voltage - Supply: 2.8 V ~ 4.5 V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	パッケージ: 48-VFQFN Exposed Pad	在庫6,208
MC34PF3001A6EPR2	NXP	POWER MANAGEMENT IC I.MX7 PRE- Applications: Processor Current - Supply: - Voltage - Supply: 2.8 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	パッケージ: 48-VFQFN Exposed Pad	在庫7,760
NX30P6093AUKZ	NXP	OVP LOAD SWITCH & OTG UP TO 1.5A Switch Type: - Number of Outputs: - Ratio - Input:Output: - Output Configuration: - Output Type: - Interface: - Voltage - Load: - Voltage - Supply (Vcc/Vdd): - Current - Output (Max): - Rds On (Typ): - Input Type: - Features: - Fault Protection: - Operating Temperature: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫6,192
SPC5777CK3MMO3R	NXP	NXP 32-BIT MCU POWER ARCH CORES Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BGA Supplier Device Package: 516-MAPBGA (27x27)	パッケージ: 516-BGA	在庫2,192
MC68HC11E1VFNE3R	NXP	8BIT MCU512 BYTES RAM EPP Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1)	パッケージ: 52-LCC (J-Lead)	在庫3,184
SAF7751HV-N208W-SK	NXP	CAR DISP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
MFS2323BMMA0EP	NXP	IC Applications: System Basis Chip Current - Supply: - Voltage - Supply: 5.5V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	パッケージ: -	Request a Quote
LPC802M011JDH20J	NXP	LPC802M011JDH20 Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 15MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	パッケージ: -	Request a Quote
FS32K144UIT0VLFR	NXP	S32K144, M4F, 512 KB FLASH Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote

PMN50XP,165

NXP

MOSFET P-CH 20V 4.8A 6TSOP

FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 4.8A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs(th) (Max) @ Id: 950mV @ 250µA
Gate Charge (Qg) (Max) @ Vgs: 10nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds: 1020pF @ 20V
Vgs (Max): ±12V
FET Feature: -
Power Dissipation (Max): 2.2W (Tc)
Rds On (Max) @ Id, Vgs: 60 mOhm @ 2.8A, 4.5V
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: 6-TSOP
Package / Case: SC-74, SOT-457

パッケージ: SC-74, SOT-457

在庫2,912

A2I25D025NR1

NXP

IC TRANS RF LDMOS

Transistor Type: LDMOS (Dual)
Frequency: 2.69GHz
Gain: 31.9dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 59mA
Power - Output: 3.2W
Voltage - Rated: 65V
Package / Case: TO-270-17 Variant, Flat Leads
Supplier Device Package: TO-270WB-17

パッケージ: TO-270-17 Variant, Flat Leads

在庫3,168

BAP51-06W,115

NXP

DIODE PIN GP 50V 50MA SOT323

Diode Type: PIN - 1 Pair Common Anode
Voltage - Peak Reverse (Max): 50V
Current - Max: 50mA
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 2.5 Ohm @ 10mA, 100MHz
Power Dissipation (Max): 240mW
Operating Temperature: -65°C ~ 150°C (TJ)
Package / Case: SC-70, SOT-323
Supplier Device Package: SOT-323-3

パッケージ: SC-70, SOT-323

在庫23,382

LD6806F/28H,115

NXP

IC REG LINEAR 2.8V 200MA 6-XSON

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 2.8V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.13V @ 200mA
Current - Output: 200mA
Current - Quiescent (Iq): -
Current - Supply (Max): 100µA ~ 250µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Supplier Device Package: 6-XSON, SOT886 (1.45x1)

パッケージ: 6-XFDFN

在庫2,816

PCF1252-0T/F4,118

NXP

IC VOLT DETECT W/RESET 8SOIC

Type: Simple Reset/Power-On Reset
Number of Voltages Monitored: 1
Output: Push-Pull, Totem Pole
Reset: Active High
Reset Timeout: 400 µs Minimum
Voltage - Threshold: 4.75V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

パッケージ: 8-SOIC (0.154", 3.90mm Width)

在庫2,928

MC34905CS5EK

NXP

IC SBC HIGH SPEED CAN 5V 32SOIC

Applications: System Basis Chip
Current - Supply: 2mA
Voltage - Supply: 5.5 V ~ 28 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC

パッケージ: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

在庫4,256

MC10XSD200BFKR2

NXP

IC SWITCH HIGH SIDE 23PQFN

Switch Type: General Purpose
Number of Outputs: 2
Ratio - Input:Output: -
Output Configuration: High Side
Output Type: -
Interface: SPI
Voltage - Load: 8 V ~ 36 V
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Current - Output (Max): 6A
Rds On (Typ): 10 mOhm
Input Type: -
Features: -
Fault Protection: Open Load Detect, Over Temperature, Over Voltage
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 23-PowerQFN
Supplier Device Package: 23-PQFN (12x12)

パッケージ: 23-PowerQFN

在庫5,184

74LVC02APW/AUJ

NXP

IC GATE NOR 4CH 2-INP 14-TSSOP

Logic Type: NOR Gate
Number of Circuits: 4
Number of Inputs: 2
Features: -
Voltage - Supply: 1.65 V ~ 3.6 V
Current - Quiescent (Max): 10µA
Current - Output High, Low: 24mA, 24mA
Logic Level - Low: 0.12 V ~ 0.8 V
Logic Level - High: 1.08 V ~ 2 V
Max Propagation Delay @ V, Max CL: 4.4ns @ 3.3V, 50pF
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Supplier Device Package: 14-TSSOP
Package / Case: 14-TSSOP (0.173", 4.40mm Width)

パッケージ: 14-TSSOP (0.173", 4.40mm Width)

在庫5,184

74ALVCH162827DGG:1

NXP

IC BUFF DVR TRI-ST 20BIT 56TSSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Number of Bits per Element: 10
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 56-TSSOP

パッケージ: 56-TFSOP (0.240", 6.10mm Width)

在庫3,744

PCA9516APW,118

NXP

IC REDRIVER I2C 5CH 16TSSOP

Type: Buffer, ReDriver
Applications: I2C
Input: 2-Wire Bus
Output: 2-Wire Bus
Data Rate (Max): 400kHz
Number of Channels: 5
Delay Time: -
Signal Conditioning: -
Capacitance - Input: 6pF
Voltage - Supply: 3 V ~ 3.6 V
Current - Supply: 5mA
Operating Temperature: -40°C ~ 85°C
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

パッケージ: 16-TSSOP (0.173", 4.40mm Width)

在庫4,896

PCAL9535AHF,128

NXP

IC I/O EXPANDER 16BIT 24HWQFN

Number of I/O: 16
Interface: I2C
Interrupt Output: Yes
Features: POR
Output Type: Open Drain, Push-Pull
Current - Output Source/Sink: 10mA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 1.65 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-WFQFN Exposed Pad
Supplier Device Package: 24-HWQFN (4x4)

パッケージ: 24-WFQFN Exposed Pad

在庫3,184

PCA9535CHF,118

NXP

IC I/O EXPANDER I2C 16B 24HWQFN

Number of I/O: 16
Interface: I2C, SMBus
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 10mA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-WFQFN Exposed Pad
Supplier Device Package: 24-HWQFN (4x4)

パッケージ: 24-WFQFN Exposed Pad

在庫6,832

PCAL6416AEVJ

NXP

IC I/O EXPANDER 16BIT 24VFBGA

Number of I/O: 16
Interface: I2C, SMBus
Interrupt Output: Yes
Features: POR
Output Type: Open Drain, Push-Pull
Current - Output Source/Sink: 10mA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 1.65 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-VFBGA
Supplier Device Package: 24-VFBGA (3x3)

パッケージ: 24-VFBGA

在庫48,540

MC8640TVU1250HE

NXP

IC MPU MPC86XX 1.25GHZ 994FCCBGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.25GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 994-BCBGA, FCCBGA
Supplier Device Package: 994-FCCBGA (33x33)

パッケージ: 994-BCBGA, FCCBGA

在庫6,512

MPC8313CVRAFFB

NXP

IC MPU MPC83XX 333MHZ 516BGA

Core Processor: PowerPC e300c3
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 333MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 516-BBGA Exposed Pad
Supplier Device Package: 516-TEPBGA (27x27)

パッケージ: 516-BBGA Exposed Pad

在庫5,872

MC8640DTVJ1000HE

NXP

IC MPU E600 DUAL CORE 1023FCCBGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 1023-BCBGA, FCCBGA
Supplier Device Package: 1023-FCCBGA (33x33)

パッケージ: 1023-BCBGA, FCCBGA

在庫6,384

MC9S08DZ32MLH

NXP

IC MCU 8BIT 32KB FLASH 64LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 53
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 24x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫144,060

MC68711E20CFNE3

NXP

IC MCU 8BIT 20KB OTP 52PLCC

Core Processor: HC11
Core Size: 8-Bit
Speed: 3MHz
Connectivity: SCI, SPI
Peripherals: POR, WDT
Number of I/O: 38
Program Memory Size: 20KB (20K x 8)
Program Memory Type: OTP
EEPROM Size: 512 x 8
RAM Size: 768 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 52-LCC (J-Lead)
Supplier Device Package: 52-PLCC (19.1x19.1)

パッケージ: 52-LCC (J-Lead)

在庫16,224

MCF52236CAF50

NXP

IC MCU 32BIT 256KB FLASH 80LQFP

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 50MHz
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 56
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (14x14)

パッケージ: 80-LQFP

在庫3,840

MK22FN1M0AVLL12

NXP

IC MCU 32BIT 1MB FLASH 100LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 66
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 33x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

在庫7,424

MKL33Z256VMP4

NXP

IC MCU 32BIT 256KB FLASH 64BGA

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 16x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LFBGA
Supplier Device Package: 64-MAPBGA (5x5)

パッケージ: 64-LFBGA

在庫8,520

MC34VR5100A0EPR2

NXP

POWER MANAGEMENT IC I.MX7 PRE-

Applications: LS1 Communication Processors
Current - Supply: 450µA
Voltage - Supply: 2.8 V ~ 4.5 V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

パッケージ: 48-VFQFN Exposed Pad

在庫6,208

MC34PF3001A6EPR2

NXP

POWER MANAGEMENT IC I.MX7 PRE-

Applications: Processor
Current - Supply: -
Voltage - Supply: 2.8 V ~ 5.5 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

パッケージ: 48-VFQFN Exposed Pad

在庫7,760

NX30P6093AUKZ

NXP

OVP LOAD SWITCH & OTG UP TO 1.5A

Switch Type: -
Number of Outputs: -
Ratio - Input:Output: -
Output Configuration: -
Output Type: -
Interface: -
Voltage - Load: -
Voltage - Supply (Vcc/Vdd): -
Current - Output (Max): -
Rds On (Typ): -
Input Type: -
Features: -
Fault Protection: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫6,192

SPC5777CK3MMO3R

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 516-BGA
Supplier Device Package: 516-MAPBGA (27x27)

パッケージ: 516-BGA

在庫2,192

MC68HC11E1VFNE3R

NXP

8BIT MCU512 BYTES RAM EPP

Core Processor: HC11
Core Size: 8-Bit
Speed: 3MHz
Connectivity: SCI, SPI
Peripherals: POR, WDT
Number of I/O: 38
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: 512 x 8
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 52-LCC (J-Lead)
Supplier Device Package: 52-PLCC (19.1x19.1)

パッケージ: 52-LCC (J-Lead)

在庫3,184

SAF7751HV-N208W-SK

NXP

CAR DISP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

Request a Quote

MFS2323BMMA0EP

NXP

IC

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

パッケージ: -

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LPC802M011JDH20J

NXP

LPC802M011JDH20

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 15MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O: 16
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Data Converters: A/D 12x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

パッケージ: -

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FS32K144UIT0VLFR

NXP

S32K144, M4F, 512 KB FLASH

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

Request a Quote