ページ 762 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
MRF6V12500HSR5	NXP	FET RF 110V 1.03GHZ NI-1230H Transistor Type: LDMOS Frequency: 1.03GHz Gain: 19.7dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 200mA Power - Output: 500W Voltage - Rated: 110V Package / Case: NI-780S Supplier Device Package: NI-780S	パッケージ: NI-780S	在庫5,056
A2I25H060NR1	NXP	IC RF LDMOS AMP Transistor Type: LDMOS (Dual) Frequency: 2.59GHz Gain: 26.1dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 26mA Power - Output: 10.5W Voltage - Rated: 65V Package / Case: TO-270-17 Variant, Flat Leads Supplier Device Package: TO-270WB-17	パッケージ: TO-270-17 Variant, Flat Leads	在庫7,424
TDA3629/YWU	NXP	IC LIGHT POSITION CTRLR 8-DIP Applications: Automotive Current - Supply: 6mA Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40°C ~ 105°C Mounting Type: Through Hole Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-DIP	パッケージ: 8-DIP (0.300", 7.62mm)	在庫6,608
BUK124-50L,127	NXP	TOPFET LOGIC LVL 50V TO220-5 Switch Type: General Purpose Number of Outputs: 1 Ratio - Input:Output: 1:1 Output Configuration: Low Side Output Type: N-Channel Interface: On/Off Voltage - Load: 50V (Max) Voltage - Supply (Vcc/Vdd): 5V Current - Output (Max): 30A Rds On (Typ): 21 mOhm Input Type: Non-Inverting Features: Status Flag Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Operating Temperature: 150°C (TJ) Package / Case: TO-220-5 Formed Leads Supplier Device Package: SOT263-01	パッケージ: TO-220-5 Formed Leads	在庫7,968
MC10XS6325EK	NXP	IC SWITCH HIGH SIDE 32SOIC Switch Type: General Purpose Number of Outputs: 3 Ratio - Input:Output: - Output Configuration: High Side Output Type: - Interface: SPI Voltage - Load: 7 V ~ 18 V Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Current - Output (Max): 3.8A, 9A Rds On (Typ): 10 mOhm, 25 mOhm Input Type: - Features: Status Flag Fault Protection: Open Load Detect, Over Temperature Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP	パッケージ: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad	在庫4,800
74ABT2240D,112	NXP	IC BUFF INVERT 5.5V 20SOIC Logic Type: Buffer, Inverting Number of Elements: 2 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 12mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	パッケージ: 20-SOIC (0.295", 7.50mm Width)	在庫4,896
TDA2615/N1,112	NXP	IC AMP AUDIO PWR 8W STER AB 9SIL Type: Class AB Output Type: 2-Channel (Stereo) Max Output Power x Channels @ Load: 8W x 2 @ 8 Ohm Voltage - Supply: 15 V ~ 42 V, ±7.5 V ~ 21 V Features: Depop, Mute, Short-Circuit and Thermal Protection Mounting Type: Through Hole Operating Temperature: -25°C ~ 150°C (TA) Supplier Device Package: 9-SIL MPF Package / Case: 9-SIP Exposed Tab	パッケージ: 9-SIP Exposed Tab	在庫2,944
MPC860SRZQ50D4R2	NXP	IC MPU MPC8XX 50MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	パッケージ: 357-BBGA	在庫5,344
MPC8347CZQAGD	NXP	IC MPU MPC83XX 400MHZ 620BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: - RAM Controllers: DDR Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-PBGA (29x29)	パッケージ: 620-BBGA Exposed Pad	在庫4,752
MC68EN360ZP33L	NXP	IC MPU M683XX 33MHZ 357BGA Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 357-BGA Supplier Device Package: 357-PBGA (25x25)	パッケージ: 357-BGA	在庫2,112
MPC860DTCZQ50D4	NXP	IC MPU MPC8XX 50MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (2), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	パッケージ: 357-BBGA	在庫6,336
MC68HCP11E1VFNE2	NXP	IC MCU 8BIT ROMLESS 52PLCC Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1)	パッケージ: 52-LCC (J-Lead)	在庫3,584
SPC5517GAVMG80	NXP	IC MCU 32BIT 1.5MB FLASH 208BGA Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Speed: 80MHz Connectivity: CAN, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 144 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 208-BGA Supplier Device Package: 208-MAPBGA (17x17)	パッケージ: 208-BGA	在庫5,472
MCF52213AE50	NXP	IC MCU 32BIT 128KB FLASH 64LQFP Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫6,032
S9S08SG8E2VTGR	NXP	IC MCU 8BIT 8KB FLASH 16TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	パッケージ: 16-TSSOP (0.173", 4.40mm Width)	在庫6,912
MKE14F512VLL16	NXP	IC MCU 32BIT 512KB FLASH 100LQFP Core Processor: ARM? Cortex?-M4F Core Size: 32-Bit Speed: 168MHz Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Number of I/O: 89 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 3x12b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: 100-LQFP	在庫7,140
MCF52256CAG66	NXP	IC MCU 32BIT 256KB FLASH 144LQFP Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 66MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 96 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫8,412
MC9S12XET256MAL	NXP	IC MCU 16BIT 256KB FLASH 112LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	パッケージ: 112-LQFP	在庫337,548
MMA8210EGR2	NXP	ACCEL 100G DSI/SPI 16SOIC Type: Digital Axis: X Acceleration Range: ±100g Sensitivity (LSB/g): 4 Sensitivity (mV/g): - Bandwidth: - Output Type: DSI, SPI Voltage - Supply: 6.3 V ~ 30 V Features: - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	パッケージ: 16-SOIC (0.295", 7.50mm Width)	在庫3,096
MMA7260QT	NXP	ACCELEROMETER 1.5-6G ANAL 16QFN Type: Analog Axis: X, Y, Z Acceleration Range: ±1.5g, 2g, 4g, 6g Sensitivity (LSB/g): - Sensitivity (mV/g): 800 (±1.5g) ~ 200 (±6g) Bandwidth: 350Hz (X,Y), 150Hz (Z) Output Type: Analog Voltage Voltage - Supply: 2.2 V ~ 3.6 V Features: Selectable Scale, Sleep Mode Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 16-LQFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	パッケージ: 16-LQFN Exposed Pad	在庫5,832
BGU7003,132	NXP	IC WIDEBAND AMP LN MMIC 6-XSON Frequency: 40MHz ~ 6GHz P1dB: -20.1dBm Gain: - Noise Figure: 0.8dB RF Type: General Purpose Voltage - Supply: 2.2 V ~ 2.85 V Current - Supply: 3mA ~ 15mA Test Frequency: 1.575GHz Package / Case: 6-XFDFN Supplier Device Package: 6-XSON, SOT891 (1x1)	パッケージ: 6-XFDFN	在庫3,060
SPC5604BF2VLL6R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 28x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: 100-LQFP	在庫6,592
S912ZVHL32F1VLQ	NXP	MAGNIV 16-BIT MCU S12Z CORE 32 Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Number of I/O: 100 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫5,824
SAF775DHN-N208W-BK	NXP	CAR DISP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
LX2120CC72232B	NXP	LAYERSCAPE 64-BIT ARM CORTEX-A72 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCPBGA (40x40)	パッケージ: -	Request a Quote
LS1018AXE7PQA	NXP	LAYERSCAPE 64-BIT ARM CORTEX-A72 Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.5GHz Co-Processors/DSP: - RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: - Ethernet: 1Gbps (1), 2.5Gbps (5) SATA: SATA 6Gbps (1) USB: USB 3.0 (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: Secure Boot, TrustZone® Package / Case: 448-BFBGA Supplier Device Package: 448-FBGA (17x17)	パッケージ: -	Request a Quote
S32G378ASAK1VUCR	NXP	MICROPROCESSORS - MPU 4X CORTEX- Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 2.5Gbps (3) SATA: - USB: USB 2.0 OTG (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	パッケージ: -	Request a Quote
S912ZVCA19AMLF	NXP	IC MCU 16BIT 192KB FLASH 48LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 28 Program Memory Size: 192KB (192K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Data Converters: A/D 10x12b SAR; D/A 1x8b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: -	Request a Quote
SAF775DEL-N208-K1K	NXP	CAR RADIO TUNER & AUDIO DSP Type: Audio, Car Signal Processor Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 267-LFBGA Supplier Device Package: 267-LFBGA (17x17)	パッケージ: -	Request a Quote
MIMX8DL1CVNFZAB	NXP	I.MX 8DUALXLITE 15SQ Core Processor: ARM® Cortex®-A35 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.2GHz Co-Processors/DSP: ARM® Cortex®-M4F RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 1Gbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG Package / Case: 388-LFBGA Supplier Device Package: 388-LBGA (15x15)	パッケージ: -	Request a Quote

MRF6V12500HSR5

NXP

FET RF 110V 1.03GHZ NI-1230H

Transistor Type: LDMOS
Frequency: 1.03GHz
Gain: 19.7dB
Voltage - Test: 50V
Current Rating: -
Noise Figure: -
Current - Test: 200mA
Power - Output: 500W
Voltage - Rated: 110V
Package / Case: NI-780S
Supplier Device Package: NI-780S

パッケージ: NI-780S

在庫5,056

A2I25H060NR1

NXP

IC RF LDMOS AMP

Transistor Type: LDMOS (Dual)
Frequency: 2.59GHz
Gain: 26.1dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 26mA
Power - Output: 10.5W
Voltage - Rated: 65V
Package / Case: TO-270-17 Variant, Flat Leads
Supplier Device Package: TO-270WB-17

パッケージ: TO-270-17 Variant, Flat Leads

在庫7,424

TDA3629/YWU

NXP

IC LIGHT POSITION CTRLR 8-DIP

Applications: Automotive
Current - Supply: 6mA
Voltage - Supply: 8 V ~ 18 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-DIP

パッケージ: 8-DIP (0.300", 7.62mm)

在庫6,608

BUK124-50L,127

NXP

TOPFET LOGIC LVL 50V TO220-5

Switch Type: General Purpose
Number of Outputs: 1
Ratio - Input:Output: 1:1
Output Configuration: Low Side
Output Type: N-Channel
Interface: On/Off
Voltage - Load: 50V (Max)
Voltage - Supply (Vcc/Vdd): 5V
Current - Output (Max): 30A
Rds On (Typ): 21 mOhm
Input Type: Non-Inverting
Features: Status Flag
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Operating Temperature: 150°C (TJ)
Package / Case: TO-220-5 Formed Leads
Supplier Device Package: SOT263-01

パッケージ: TO-220-5 Formed Leads

在庫7,968

MC10XS6325EK

NXP

IC SWITCH HIGH SIDE 32SOIC

Switch Type: General Purpose
Number of Outputs: 3
Ratio - Input:Output: -
Output Configuration: High Side
Output Type: -
Interface: SPI
Voltage - Load: 7 V ~ 18 V
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Current - Output (Max): 3.8A, 9A
Rds On (Typ): 10 mOhm, 25 mOhm
Input Type: -
Features: Status Flag
Fault Protection: Open Load Detect, Over Temperature
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP

パッケージ: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

在庫4,800

74ABT2240D,112

NXP

IC BUFF INVERT 5.5V 20SOIC

Logic Type: Buffer, Inverting
Number of Elements: 2
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 12mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO

パッケージ: 20-SOIC (0.295", 7.50mm Width)

在庫4,896

TDA2615/N1,112

NXP

IC AMP AUDIO PWR 8W STER AB 9SIL

Type: Class AB
Output Type: 2-Channel (Stereo)
Max Output Power x Channels @ Load: 8W x 2 @ 8 Ohm
Voltage - Supply: 15 V ~ 42 V, ±7.5 V ~ 21 V
Features: Depop, Mute, Short-Circuit and Thermal Protection
Mounting Type: Through Hole
Operating Temperature: -25°C ~ 150°C (TA)
Supplier Device Package: 9-SIL MPF
Package / Case: 9-SIP Exposed Tab

パッケージ: 9-SIP Exposed Tab

在庫2,944

MPC860SRZQ50D4R2

NXP

IC MPU MPC8XX 50MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 50MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

パッケージ: 357-BBGA

在庫5,344

MPC8347CZQAGD

NXP

IC MPU MPC83XX 400MHZ 620BGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: -
RAM Controllers: DDR
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 620-BBGA Exposed Pad
Supplier Device Package: 620-PBGA (29x29)

パッケージ: 620-BBGA Exposed Pad

在庫4,752

MC68EN360ZP33L

NXP

IC MPU M683XX 33MHZ 357BGA

Core Processor: CPU32+
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 33MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 357-BGA
Supplier Device Package: 357-PBGA (25x25)

パッケージ: 357-BGA

在庫2,112

MPC860DTCZQ50D4

NXP

IC MPU MPC8XX 50MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 50MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (2), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

パッケージ: 357-BBGA

在庫6,336

MC68HCP11E1VFNE2

NXP

IC MCU 8BIT ROMLESS 52PLCC

Core Processor: HC11
Core Size: 8-Bit
Speed: 2MHz
Connectivity: SCI, SPI
Peripherals: POR, WDT
Number of I/O: 38
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: 512 x 8
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 52-LCC (J-Lead)
Supplier Device Package: 52-PLCC (19.1x19.1)

パッケージ: 52-LCC (J-Lead)

在庫3,584

SPC5517GAVMG80

NXP

IC MCU 32BIT 1.5MB FLASH 208BGA

Core Processor: e200z0, e200z1
Core Size: 32-Bit Dual-Core
Speed: 80MHz
Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 144
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
Data Converters: A/D 40x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 208-BGA
Supplier Device Package: 208-MAPBGA (17x17)

パッケージ: 208-BGA

在庫5,472

MCF52213AE50

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 56
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫6,032

S9S08SG8E2VTGR

NXP

IC MCU 8BIT 8KB FLASH 16TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 12
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

パッケージ: 16-TSSOP (0.173", 4.40mm Width)

在庫6,912

MKE14F512VLL16

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

Core Processor: ARM? Cortex?-M4F
Core Size: 32-Bit
Speed: 168MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Number of I/O: 89
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 3x12b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

在庫7,140

MCF52256CAG66

NXP

IC MCU 32BIT 256KB FLASH 144LQFP

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 66MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 96
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫8,412

MC9S12XET256MAL

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

パッケージ: 112-LQFP

在庫337,548

MMA8210EGR2

NXP

ACCEL 100G DSI/SPI 16SOIC

Type: Digital
Axis: X
Acceleration Range: ±100g
Sensitivity (LSB/g): 4
Sensitivity (mV/g): -
Bandwidth: -
Output Type: DSI, SPI
Voltage - Supply: 6.3 V ~ 30 V
Features: -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

パッケージ: 16-SOIC (0.295", 7.50mm Width)

在庫3,096

MMA7260QT

NXP

ACCELEROMETER 1.5-6G ANAL 16QFN

Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 2g, 4g, 6g
Sensitivity (LSB/g): -
Sensitivity (mV/g): 800 (±1.5g) ~ 200 (±6g)
Bandwidth: 350Hz (X,Y), 150Hz (Z)
Output Type: Analog Voltage
Voltage - Supply: 2.2 V ~ 3.6 V
Features: Selectable Scale, Sleep Mode
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-LQFN Exposed Pad
Supplier Device Package: 16-QFN (6x6)

パッケージ: 16-LQFN Exposed Pad

在庫5,832

BGU7003,132

NXP

IC WIDEBAND AMP LN MMIC 6-XSON

Frequency: 40MHz ~ 6GHz
P1dB: -20.1dBm
Gain: -
Noise Figure: 0.8dB
RF Type: General Purpose
Voltage - Supply: 2.2 V ~ 2.85 V
Current - Supply: 3mA ~ 15mA
Test Frequency: 1.575GHz
Package / Case: 6-XFDFN
Supplier Device Package: 6-XSON, SOT891 (1x1)

パッケージ: 6-XFDFN

在庫3,060

SPC5604BF2VLL6R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 79
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 28x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

在庫6,592

S912ZVHL32F1VLQ

NXP

MAGNIV 16-BIT MCU S12Z CORE 32

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Number of I/O: 100
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫5,824

SAF775DHN-N208W-BK

NXP

CAR DISP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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LX2120CC72232B

NXP

LAYERSCAPE 64-BIT ARM CORTEX-A72

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCPBGA (40x40)

パッケージ: -

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LS1018AXE7PQA

NXP

LAYERSCAPE 64-BIT ARM CORTEX-A72

Core Processor: ARM® Cortex®-A72
Number of Cores/Bus Width: 1 Core, 64-Bit
Speed: 1.5GHz
Co-Processors/DSP: -
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Display & Interface Controllers: -
Ethernet: 1Gbps (1), 2.5Gbps (5)
SATA: SATA 6Gbps (1)
USB: USB 3.0 (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Secure Boot, TrustZone®
Package / Case: 448-BFBGA
Supplier Device Package: 448-FBGA (17x17)

パッケージ: -

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S32G378ASAK1VUCR

NXP

MICROPROCESSORS - MPU 4X CORTEX-

Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Speed: 400MHz, 1GHz
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 2.5Gbps (3)
SATA: -
USB: USB 2.0 OTG (1)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

パッケージ: -

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S912ZVCA19AMLF

NXP

IC MCU 16BIT 192KB FLASH 48LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 28
Program Memory Size: 192KB (192K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Data Converters: A/D 10x12b SAR; D/A 1x8b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: -

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SAF775DEL-N208-K1K

NXP

CAR RADIO TUNER & AUDIO DSP

Type: Audio, Car Signal Processor
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 267-LFBGA
Supplier Device Package: 267-LFBGA (17x17)

パッケージ: -

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MIMX8DL1CVNFZAB

NXP

I.MX 8DUALXLITE 15SQ

Core Processor: ARM® Cortex®-A35
Number of Cores/Bus Width: 2 Core, 64-Bit
Speed: 1.2GHz
Co-Processors/DSP: ARM® Cortex®-M4F
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Ethernet: 1Gbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TJ)
Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Package / Case: 388-LFBGA
Supplier Device Package: 388-LBGA (15x15)

パッケージ: -

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