ページ 206 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
PMN25UN,115	NXP	MOSFET N-CH 20V 6A 6TSOP FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 20V Current - Continuous Drain (Id) @ 25°C: 6A (Ta) Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V Vgs(th) (Max) @ Id: 1V @ 250µA Gate Charge (Qg) (Max) @ Vgs: 10nC @ 4.5V Input Capacitance (Ciss) (Max) @ Vds: 470pF @ 10V Vgs (Max): ±8V FET Feature: - Power Dissipation (Max): 530mW (Ta), 6.25W (Tc) Rds On (Max) @ Id, Vgs: 27 mOhm @ 6A, 4.5V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 6-TSOP Package / Case: SC-74, SOT-457	パッケージ: SC-74, SOT-457	在庫4,240
AFT09MS031NR1	NXP	FET RF 40V 870MHZ TO-270-2 Transistor Type: LDMOS Frequency: 870MHz Gain: 17.2dB Voltage - Test: 13.6V Current Rating: - Noise Figure: - Current - Test: 500mA Power - Output: 31W Voltage - Rated: 40V Package / Case: TO-270AA Supplier Device Package: TO-270-2	パッケージ: TO-270AA	在庫14,676
PMSTA3904,135	NXP	TRANS NPN 40V 0.2A SOT323 Transistor Type: NPN Current - Collector (Ic) (Max): 200mA Voltage - Collector Emitter Breakdown (Max): 40V Vce Saturation (Max) @ Ib, Ic: 300mV @ 5mA, 50mA Current - Collector Cutoff (Max): 50nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V Power - Max: 200mW Frequency - Transition: 300MHz Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-70, SOT-323 Supplier Device Package: SOT-323-3	パッケージ: SC-70, SOT-323	在庫6,176
BFU520AR	NXP	TRANS RF NPN 12V 30MA SOT23-3 Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 12V Frequency - Transition: 10GHz Noise Figure (dB Typ @ f): 0.7dB @ 900MHz Gain: 18dB Power - Max: 450mW DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V Current - Collector (Ic) (Max): 30mA Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫22,944
LD6835K/15PX	NXP	IC REG LINEAR 1.5V 300MA 4HXSON Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 1.5V Voltage - Output (Max): - Voltage Dropout (Max): 0.24V @ 300mA (Typ) Current - Output: 300mA Current - Quiescent (Iq): - Current - Supply (Max): 75µA PSRR: 75dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature, Soft Start Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-XDFN Exposed Pad Supplier Device Package: 4-HXSON (1x1)	パッケージ: 4-XDFN Exposed Pad	在庫7,440
74ALVCHT16835DGV:1	NXP	IC REGISTERED DVR 16BIT 56TVSOP Logic Type: Buffer, Non-Inverting Number of Elements: 1 Number of Bits per Element: 18 Input Type: - Output Type: Push-Pull Current - Output High, Low: 24mA, 24mA Voltage - Supply: 2.3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 56-TFSOP (0.173", 4.40mm Width) Supplier Device Package: 56-TSSOP	パッケージ: 56-TFSOP (0.173", 4.40mm Width)	在庫4,112
74ABT652AD,112	NXP	IC TRANSCEIVER 8BIT N-INV 24SOIC Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	パッケージ: 24-SOIC (0.295", 7.50mm Width)	在庫7,136
SC16C554DIB64,157	NXP	IC UART QUAD 64LQFP Features: - Number of Channels: 4, QUART FIFO's: 16 Byte Protocol: - Data Rate (Max): 5Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫4,256
MCZ33905CS3EKR2	NXP	IC SBC CAN HS 3.3V 32SOIC Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Mounting Type: Surface Mount	パッケージ: 32-SSOP (0.295", 7.50mm Width) Exposed Pad	在庫6,064
KMPC8358ZQAGDGA	NXP	IC MPU MPC83XX 400MHZ 668BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 668-BBGA Exposed Pad Supplier Device Package: 668-PBGA-PGE (29x29)	パッケージ: 668-BBGA Exposed Pad	在庫3,616
MC68MH360VR25VL	NXP	IC MPU M683XX 25MHZ 357BGA Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	パッケージ: 357-BBGA	在庫4,064
MC9S08RD8CFGE	NXP	IC MCU 8BIT 8KB FLASH 44LQFP Core Processor: S08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	パッケージ: 44-LQFP	在庫5,696
LPC43S37JBD144E	NXP	IC MCU 32BIT 1MB FLASH 144LQFP Core Processor: ARM? Cortex?-M4/M0 Core Size: 32-Bit Dual-Core Speed: 204MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT Number of I/O: 83 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 136K x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: A/D 8x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫6,384
S912XET256BMAAR	NXP	IC MCU 16BIT 256KB FLASH 80QFP Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 80-BQFP Supplier Device Package: 80-QFP (14x14)	パッケージ: 80-BQFP	在庫5,472
S9S12HA32J0CLL	NXP	IC MCU 16BIT 32KB FLASH 100LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 32MHz Connectivity: EBI/EMI, I2C, IrDA, LIN, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 80 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: 100-LQFP	在庫36,600
LPC2114FBD64/01,15	NXP	IC MCU 32BIT 128KB FLASH 64LQFP Core Processor: ARM7? Core Size: 16/32-Bit Speed: 60MHz Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 46 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫7,360
MPC9449AE	NXP	IC CLK BUFFER 3:15 200MHZ 52LQFP Type: Fanout Buffer (Distribution), Divider, Multiplexer Number of Circuits: 1 Ratio - Input:Output: 3:15 Differential - Input:Output: Yes/No Input: LVCMOS, LVPECL Output: LVCMOS Frequency - Max: 200MHz Voltage - Supply: 2.375 V ~ 3.465 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 52-LQFP Supplier Device Package: 52-LQFP (10x10)	パッケージ: 52-LQFP	在庫4,912
MMA6827BKWR2	NXP	ACCELEROMETER 120G SPI 16QFN Type: Digital Axis: X, Y Acceleration Range: ±120g Sensitivity (LSB/g): 4.096 Sensitivity (mV/g): - Bandwidth: - Output Type: SPI Voltage - Supply: 3.135 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	パッケージ: 16-QFN Exposed Pad	在庫3,510
SA614AD,118	NXP	IC FM IF SYSTEM LOW PWR 16-SOIC Function: FM IF System Frequency: 25MHz RF Type: Cellular, ASK, FSK Secondary Attributes: RSSI Equipped Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	パッケージ: 16-SOIC (0.154", 3.90mm Width)	在庫5,472
MC32PF1510A3EP	NXP	PF1510 Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Current - Supply: - Voltage - Supply: 3.8 V ~ 7 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-QFN (5x5)	パッケージ: 40-VFQFN Exposed Pad	在庫5,472
SAF7741HV/N140ZK	NXP	IC HD RADIO PROCESSOR 144HLQFP Type: Car Signal Processor Interface: I²C, I²S, LSB, SPDIF Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: 3.30V Voltage - Core: 1.80V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-HLQFP (20x20)	パッケージ: 144-LQFP Exposed Pad	在庫7,376
SPC5745CFK1AMKU6	NXP	DUAL CORE 2M FLASH Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz, 160MHz Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, I²S, POR, WDT Number of I/O: 129 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	パッケージ: 176-LQFP Exposed Pad	在庫5,824
MKL27Z64VLH4R	NXP	KINETIS L 32-BIT MCU ARM CORTEX Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I²C, FlexIO, SPI, UART/USART, USB Peripherals: DMA, I²S, PWM, WDT Number of I/O: 51 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 17x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫2,864
LPC55S16JBD100E	NXP	IC MCU 32BIT 256KB FLSH 100HLQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-HLQFP (14x14)	パッケージ: -	在庫6
MC33VR5500V3ESR2	NXP	VR5500 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
FH32K146HAT0VLHT	NXP	S32K146 32-BIT MCU, ARM CORTEX-M Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
LPC2478FBD208K	NXP	IC MCU 16/32B 512KB FLSH 208LQFP Core Processor: ARM7® Core Size: 16/32-Bit Speed: 72MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Number of I/O: 160 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 98K x 8 Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 208-LQFP Supplier Device Package: 208-LQFP (28x28)	パッケージ: -	Request a Quote
FC32K118LFT0VLHT	NXP	S32K118, M0+, FLASH 256K, RAM 25 Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote

PMN25UN,115

NXP

MOSFET N-CH 20V 6A 6TSOP

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 6A (Ta)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs(th) (Max) @ Id: 1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs: 10nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds: 470pF @ 10V
Vgs (Max): ±8V
FET Feature: -
Power Dissipation (Max): 530mW (Ta), 6.25W (Tc)
Rds On (Max) @ Id, Vgs: 27 mOhm @ 6A, 4.5V
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: 6-TSOP
Package / Case: SC-74, SOT-457

パッケージ: SC-74, SOT-457

在庫4,240

AFT09MS031NR1

NXP

FET RF 40V 870MHZ TO-270-2

Transistor Type: LDMOS
Frequency: 870MHz
Gain: 17.2dB
Voltage - Test: 13.6V
Current Rating: -
Noise Figure: -
Current - Test: 500mA
Power - Output: 31W
Voltage - Rated: 40V
Package / Case: TO-270AA
Supplier Device Package: TO-270-2

パッケージ: TO-270AA

在庫14,676

PMSTA3904,135

NXP

TRANS NPN 40V 0.2A SOT323

Transistor Type: NPN
Current - Collector (Ic) (Max): 200mA
Voltage - Collector Emitter Breakdown (Max): 40V
Vce Saturation (Max) @ Ib, Ic: 300mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 50nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V
Power - Max: 200mW
Frequency - Transition: 300MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Supplier Device Package: SOT-323-3

パッケージ: SC-70, SOT-323

在庫6,176

BFU520AR

NXP

TRANS RF NPN 12V 30MA SOT23-3

Transistor Type: NPN
Voltage - Collector Emitter Breakdown (Max): 12V
Frequency - Transition: 10GHz
Noise Figure (dB Typ @ f): 0.7dB @ 900MHz
Gain: 18dB
Power - Max: 450mW
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Current - Collector (Ic) (Max): 30mA
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫22,944

LD6835K/15PX

NXP

IC REG LINEAR 1.5V 300MA 4HXSON

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 1.5V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.24V @ 300mA (Typ)
Current - Output: 300mA
Current - Quiescent (Iq): -
Current - Supply (Max): 75µA
PSRR: 75dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature, Soft Start
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 4-XDFN Exposed Pad
Supplier Device Package: 4-HXSON (1x1)

パッケージ: 4-XDFN Exposed Pad

在庫7,440

74ALVCHT16835DGV:1

NXP

IC REGISTERED DVR 16BIT 56TVSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 18
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 2.3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.173", 4.40mm Width)
Supplier Device Package: 56-TSSOP

パッケージ: 56-TFSOP (0.173", 4.40mm Width)

在庫4,112

74ABT652AD,112

NXP

IC TRANSCEIVER 8BIT N-INV 24SOIC

Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 24-SO

パッケージ: 24-SOIC (0.295", 7.50mm Width)

在庫7,136

SC16C554DIB64,157

NXP

IC UART QUAD 64LQFP

Features: -
Number of Channels: 4, QUART
FIFO's: 16 Byte
Protocol: -
Data Rate (Max): 5Mbps
Voltage - Supply: 2.5V, 3.3V, 5V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫4,256

MCZ33905CS3EKR2

NXP

IC SBC CAN HS 3.3V 32SOIC

Applications: System Basis Chip
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP
Mounting Type: Surface Mount

パッケージ: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

在庫6,064

KMPC8358ZQAGDGA

NXP

IC MPU MPC83XX 400MHZ 668BGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 668-BBGA Exposed Pad
Supplier Device Package: 668-PBGA-PGE (29x29)

パッケージ: 668-BBGA Exposed Pad

在庫3,616

MC68MH360VR25VL

NXP

IC MPU M683XX 25MHZ 357BGA

Core Processor: CPU32+
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 25MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

パッケージ: 357-BBGA

在庫4,064

MC9S08RD8CFGE

NXP

IC MCU 8BIT 8KB FLASH 44LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 44-LQFP
Supplier Device Package: 44-LQFP (10x10)

パッケージ: 44-LQFP

在庫5,696

LPC43S37JBD144E

NXP

IC MCU 32BIT 1MB FLASH 144LQFP

Core Processor: ARM? Cortex?-M4/M0
Core Size: 32-Bit Dual-Core
Speed: 204MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O: 83
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 136K x 8
Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
Data Converters: A/D 8x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫6,384

S912XET256BMAAR

NXP

IC MCU 16BIT 256KB FLASH 80QFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 59
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 80-BQFP
Supplier Device Package: 80-QFP (14x14)

パッケージ: 80-BQFP

在庫5,472

S9S12HA32J0CLL

NXP

IC MCU 16BIT 32KB FLASH 100LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 32MHz
Connectivity: EBI/EMI, I2C, IrDA, LIN, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Number of I/O: 80
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

在庫36,600

LPC2114FBD64/01,15

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

Core Processor: ARM7?
Core Size: 16/32-Bit
Speed: 60MHz
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 46
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V
Data Converters: A/D 4x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫7,360

MPC9449AE

NXP

IC CLK BUFFER 3:15 200MHZ 52LQFP

Type: Fanout Buffer (Distribution), Divider, Multiplexer
Number of Circuits: 1
Ratio - Input:Output: 3:15
Differential - Input:Output: Yes/No
Input: LVCMOS, LVPECL
Output: LVCMOS
Frequency - Max: 200MHz
Voltage - Supply: 2.375 V ~ 3.465 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 52-LQFP
Supplier Device Package: 52-LQFP (10x10)

パッケージ: 52-LQFP

在庫4,912

MMA6827BKWR2

NXP

ACCELEROMETER 120G SPI 16QFN

Type: Digital
Axis: X, Y
Acceleration Range: ±120g
Sensitivity (LSB/g): 4.096
Sensitivity (mV/g): -
Bandwidth: -
Output Type: SPI
Voltage - Supply: 3.135 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 16-QFN Exposed Pad
Supplier Device Package: 16-QFN (6x6)

パッケージ: 16-QFN Exposed Pad

在庫3,510

SA614AD,118

NXP

IC FM IF SYSTEM LOW PWR 16-SOIC

Function: FM IF System
Frequency: 25MHz
RF Type: Cellular, ASK, FSK
Secondary Attributes: RSSI Equipped
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

パッケージ: 16-SOIC (0.154", 3.90mm Width)

在庫5,472

MC32PF1510A3EP

NXP

PF1510

Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Current - Supply: -
Voltage - Supply: 3.8 V ~ 7 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-QFN (5x5)

パッケージ: 40-VFQFN Exposed Pad

在庫5,472

SAF7741HV/N140ZK

NXP

IC HD RADIO PROCESSOR 144HLQFP

Type: Car Signal Processor
Interface: I²C, I²S, LSB, SPDIF
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: 3.30V
Voltage - Core: 1.80V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Supplier Device Package: 144-HLQFP (20x20)

パッケージ: 144-LQFP Exposed Pad

在庫7,376

SPC5745CFK1AMKU6

NXP

DUAL CORE 2M FLASH

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz, 160MHz
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, I²S, POR, WDT
Number of I/O: 129
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 36x10b, 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

パッケージ: 176-LQFP Exposed Pad

在庫5,824

MKL27Z64VLH4R

NXP

KINETIS L 32-BIT MCU ARM CORTEX

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I²C, FlexIO, SPI, UART/USART, USB
Peripherals: DMA, I²S, PWM, WDT
Number of I/O: 51
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 17x16b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫2,864

LPC55S16JBD100E

NXP

IC MCU 32BIT 256KB FLSH 100HLQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 64
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Supplier Device Package: 100-HLQFP (14x14)

パッケージ: -

在庫6

MC33VR5500V3ESR2

NXP

VR5500

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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FH32K146HAT0VLHT

NXP

S32K146 32-BIT MCU, ARM CORTEX-M

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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LPC2478FBD208K

NXP

IC MCU 16/32B 512KB FLSH 208LQFP

Core Processor: ARM7®
Core Size: 16/32-Bit
Speed: 72MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O: 160
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 98K x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Data Converters: A/D 8x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Supplier Device Package: 208-LQFP (28x28)

パッケージ: -

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FC32K118LFT0VLHT

NXP

S32K118, M0+, FLASH 256K, RAM 25

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

Request a Quote