ページ 208 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
PMV30UN,215	NXP	MOSFET N-CH 20V 5.7A SOT-23 FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 20V Current - Continuous Drain (Id) @ 25°C: 5.7A (Tc) Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V Vgs(th) (Max) @ Id: 700mV @ 1mA Gate Charge (Qg) (Max) @ Vgs: 7.4nC @ 4.5V Input Capacitance (Ciss) (Max) @ Vds: 460pF @ 20V Vgs (Max): ±8V FET Feature: - Power Dissipation (Max): 1.9W (Tc) Rds On (Max) @ Id, Vgs: 36 mOhm @ 2A, 4.5V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Supplier Device Package: TO-236AB (SOT23) Package / Case: TO-236-3, SC-59, SOT-23-3	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫4,000
BF1206,115	NXP	FET RF 6V 400MHZ 6TSSOP Transistor Type: N-Channel Dual Gate Frequency: 400MHz Gain: 30dB Voltage - Test: 5V Current Rating: 30mA Noise Figure: 1.3dB Current - Test: 18mA Power - Output: - Voltage - Rated: 6V Package / Case: 6-TSSOP, SC-88, SOT-363 Supplier Device Package: 6-TSSOP	パッケージ: 6-TSSOP, SC-88, SOT-363	在庫5,216
GTL16612DL,518	NXP	IC TXRX UNVRSL 18BIT 3ST SSOP56 Translator Type: Mixed Signal Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 18 Voltage - VCCA: - Voltage - VCCB: - Input Signal: GTL Output Signal: LVTTL, TTL Output Type: Tri-State, Non-Inverted Data Rate: - Operating Temperature: -40°C ~ 85°C (TA) Features: - Mounting Type: Surface Mount Package / Case: 56-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 56-SSOP	パッケージ: 56-BSSOP (0.295", 7.50mm Width)	在庫5,184
74LVU04DB,118	NXP	IC HEX INVERTER 14SSOP Logic Type: Inverter Number of Circuits: 6 Number of Inputs: 6 Features: - Voltage - Supply: 1 V ~ 5.5 V Current - Quiescent (Max): 40µA Current - Output High, Low: 12mA, 12mA Logic Level - Low: 0.2 V ~ 0.5 V Logic Level - High: 1 V ~ 2.4 V Max Propagation Delay @ V, Max CL: 7ns @ 3.3V, 50pF Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Supplier Device Package: 14-SSOP Package / Case: 14-SSOP (0.209", 5.30mm Width)	パッケージ: 14-SSOP (0.209", 5.30mm Width)	在庫6,272
N74F3037N,602	NXP	IC GATE NAND 4CH 2-INP 16-DIP Logic Type: NAND Gate Number of Circuits: 4 Number of Inputs: 2 Features: - Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Max): - Current - Output High, Low: 67mA, 160mA Logic Level - Low: 0.8V Logic Level - High: 2.4V Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF Operating Temperature: 0°C ~ 70°C Mounting Type: Through Hole Supplier Device Package: 16-DIP Package / Case: 16-DIP (0.300", 7.62mm)	パッケージ: 16-DIP (0.300", 7.62mm)	在庫5,184
74LVC544APW,112	NXP	IC TRANSCEIVER 8BIT INV 24TSSOP Logic Type: Transceiver, Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 24mA, 24mA Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP	パッケージ: 24-TSSOP (0.173", 4.40mm Width)	在庫4,496
TDA18214AHN/C1,518	NXP	IC SILICON TUNER 40HVQFN Type: Tuner Applications: TV Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	パッケージ: 40-VFQFN Exposed Pad	在庫7,920
P4080NSE1PNB	NXP	IC MPU Q OR IQ 1.5GHZ 1295FCBGA Core Processor: PowerPC e500mc Number of Cores/Bus Width: 8 Core, 32-Bit Speed: 1.5GHz Co-Processors/DSP: Security; SEC 4.0 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (8), 10 Gbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5)	パッケージ: 1295-BBGA, FCBGA	在庫3,376
KMPC8545EVUANJ	NXP	IC MPU MPC85XX 800MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫5,088
MPC875ZT80	NXP	IC MPU MPC8XX 80MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1), 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	パッケージ: 256-BBGA	在庫5,184
MC908LJ12CFBE	NXP	IC MCU 8BIT 12KB FLASH 52LQFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: IRSCI, SPI Peripherals: LCD, LVD, POR, PWM Number of I/O: 20 Program Memory Size: 12KB (12K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 52-LQFP Supplier Device Package: 52-LQFP (10x10)	パッケージ: 52-LQFP	在庫39,240
MC56F8346VFVER2	NXP	IC MCU 16BIT 128KB FLASH 144LQFP Core Processor: 56800E Core Size: 16-Bit Speed: 60MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Number of I/O: 62 Program Memory Size: 128KB (64K x 16) Program Memory Type: FLASH EEPROM Size: - RAM Size: 6K x 16 Voltage - Supply (Vcc/Vdd): 2.25 V ~ 3.6 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫6,792
LPC1830FET100,551	NXP	IC MCU 32BIT ROMLESS 100TFBGA Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 180MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT Number of I/O: 49 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 200K x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: A/D 8x10b, D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-TFBGA Supplier Device Package: 100-TFBGA (9x9)	パッケージ: 100-TFBGA	在庫4,528
MCF51QM128VLHR	NXP	IC MCU 32BIT 128KB FLASH 64LQFP Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 48 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 2x16b, 18x16b, D/A 1x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫3,120
MC9S08SH16CTJR	NXP	IC MCU 8BIT 16KB FLASH 20TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 17 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	パッケージ: 20-TSSOP (0.173", 4.40mm Width)	在庫14,388
MCHC908QT1VDWE	NXP	IC MCU 8BIT 1.5KB FLASH 8SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 5 Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 8-SOIC (0.209", 5.30mm Width) Supplier Device Package: 8-SOIC	パッケージ: 8-SOIC (0.209", 5.30mm Width)	在庫2,256
MC9S08SH8MTJ	NXP	IC MCU 8BIT 8KB FLASH 20TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 17 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	パッケージ: 20-TSSOP (0.173", 4.40mm Width)	在庫3,920
MK60FN1M0VMD15	NXP	IC MCU 32BIT 1MB FLASH 144MAPBGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 150MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 100 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 58x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LBGA Supplier Device Package: 144-MAPBGA (13x13)	パッケージ: 144-LBGA	在庫5,088
MSC8157ETVT1000A	NXP	IC DSP 6-CORE DGTL 783FCBGA Type: SC3850 Six Core Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Clock Rate: 1GHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 6.375MB Voltage - I/O: 1.0V, 1.5V, 2.5V Voltage - Core: 1.00V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫4,240
IP4305CX4/LF/P,315	NXP	TVS DIODE WLCSP4 Type: Steering (Rail to Rail) Unidirectional Channels: 2 Bidirectional Channels: - Voltage - Reverse Standoff (Typ): - Voltage - Breakdown (Min): 15V Voltage - Clamping (Max) @ Ipp: - Current - Peak Pulse (10/1000µs): - Power - Peak Pulse: - Power Line Protection: - Applications: - Capacitance @ Frequency: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 4-UFBGA, WLCSP Supplier Device Package: 4-WLCSP (0.96x0.96)	パッケージ: 4-UFBGA, WLCSP	在庫3,708
OM15029Z	NXP	DEMO BOARD MCU WIRELESS Type: - Frequency: - For Use With/Related Products: - Supplied Contents: -	パッケージ: -	在庫3,906
MC17XS6500CEKR2	NXP	IC SWITCH HIGH-SIDE PENTA 32SOIC Switch Type: - Number of Outputs: - Ratio - Input:Output: - Output Configuration: - Output Type: - Interface: - Voltage - Load: - Voltage - Supply (Vcc/Vdd): - Current - Output (Max): - Rds On (Typ): - Input Type: - Features: - Fault Protection: - Operating Temperature: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫5,920
MC33771BTA2AER2	NXP	BCC14 Function: Battery Cell Controller Battery Chemistry: Lithium-Ion Number of Cells: 7 ~ 14 Fault Protection: Over/Under Voltage Interface: SPI Operating Temperature: -40°C ~ 105°C (TA) Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP Exposed Pad	在庫6,080
LS1023AXN7MQB	NXP	QORIQ 2XCPU 64-BIT ARM ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫5,808
SPC5646CCF0VLU1	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Speed: 80MHz/120MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 147 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 27x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	パッケージ: 176-LQFP	在庫3,360
S9S12G64J0MLF	NXP	S12 CORE,64K FLASH,AU Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: -	Request a Quote
MCIMX6QP6AVT1ABR	NXP	I.MX 6 SERIES 32-BIT MPU, QUAD A Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	パッケージ: -	Request a Quote
SAF7770EL-101Z130Y	NXP	SAF7770EL Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 364-LFBGA Supplier Device Package: 364-LFBGA (15x15)	パッケージ: -	Request a Quote

PMV30UN,215

NXP

MOSFET N-CH 20V 5.7A SOT-23

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 5.7A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs(th) (Max) @ Id: 700mV @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 7.4nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds: 460pF @ 20V
Vgs (Max): ±8V
FET Feature: -
Power Dissipation (Max): 1.9W (Tc)
Rds On (Max) @ Id, Vgs: 36 mOhm @ 2A, 4.5V
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: TO-236AB (SOT23)
Package / Case: TO-236-3, SC-59, SOT-23-3

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫4,000

BF1206,115

NXP

FET RF 6V 400MHZ 6TSSOP

Transistor Type: N-Channel Dual Gate
Frequency: 400MHz
Gain: 30dB
Voltage - Test: 5V
Current Rating: 30mA
Noise Figure: 1.3dB
Current - Test: 18mA
Power - Output: -
Voltage - Rated: 6V
Package / Case: 6-TSSOP, SC-88, SOT-363
Supplier Device Package: 6-TSSOP

パッケージ: 6-TSSOP, SC-88, SOT-363

在庫5,216

GTL16612DL,518

NXP

IC TXRX UNVRSL 18BIT 3ST SSOP56

Translator Type: Mixed Signal
Channel Type: Bidirectional
Number of Circuits: 1
Channels per Circuit: 18
Voltage - VCCA: -
Voltage - VCCB: -
Input Signal: GTL
Output Signal: LVTTL, TTL
Output Type: Tri-State, Non-Inverted
Data Rate: -
Operating Temperature: -40°C ~ 85°C (TA)
Features: -
Mounting Type: Surface Mount
Package / Case: 56-BSSOP (0.295", 7.50mm Width)
Supplier Device Package: 56-SSOP

パッケージ: 56-BSSOP (0.295", 7.50mm Width)

在庫5,184

74LVU04DB,118

NXP

IC HEX INVERTER 14SSOP

Logic Type: Inverter
Number of Circuits: 6
Number of Inputs: 6
Features: -
Voltage - Supply: 1 V ~ 5.5 V
Current - Quiescent (Max): 40µA
Current - Output High, Low: 12mA, 12mA
Logic Level - Low: 0.2 V ~ 0.5 V
Logic Level - High: 1 V ~ 2.4 V
Max Propagation Delay @ V, Max CL: 7ns @ 3.3V, 50pF
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Supplier Device Package: 14-SSOP
Package / Case: 14-SSOP (0.209", 5.30mm Width)

パッケージ: 14-SSOP (0.209", 5.30mm Width)

在庫6,272

N74F3037N,602

NXP

IC GATE NAND 4CH 2-INP 16-DIP

Logic Type: NAND Gate
Number of Circuits: 4
Number of Inputs: 2
Features: -
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Max): -
Current - Output High, Low: 67mA, 160mA
Logic Level - Low: 0.8V
Logic Level - High: 2.4V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Operating Temperature: 0°C ~ 70°C
Mounting Type: Through Hole
Supplier Device Package: 16-DIP
Package / Case: 16-DIP (0.300", 7.62mm)

パッケージ: 16-DIP (0.300", 7.62mm)

在庫5,184

74LVC544APW,112

NXP

IC TRANSCEIVER 8BIT INV 24TSSOP

Logic Type: Transceiver, Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.2 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 24-TSSOP

パッケージ: 24-TSSOP (0.173", 4.40mm Width)

在庫4,496

TDA18214AHN/C1,518

NXP

IC SILICON TUNER 40HVQFN

Type: Tuner
Applications: TV
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

パッケージ: 40-VFQFN Exposed Pad

在庫7,920

P4080NSE1PNB

NXP

IC MPU Q OR IQ 1.5GHZ 1295FCBGA

Core Processor: PowerPC e500mc
Number of Cores/Bus Width: 8 Core, 32-Bit
Speed: 1.5GHz
Co-Processors/DSP: Security; SEC 4.0
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (8), 10 Gbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Package / Case: 1295-BBGA, FCBGA
Supplier Device Package: 1295-FCPBGA (37.5x37.5)

パッケージ: 1295-BBGA, FCBGA

在庫3,376

KMPC8545EVUANJ

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫5,088

MPC875ZT80

NXP

IC MPU MPC8XX 80MHZ 256BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 80MHz
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1), 10/100 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: Cryptography
Package / Case: 256-BBGA
Supplier Device Package: 256-PBGA (23x23)

パッケージ: 256-BBGA

在庫5,184

MC908LJ12CFBE

NXP

IC MCU 8BIT 12KB FLASH 52LQFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Number of I/O: 20
Program Memory Size: 12KB (12K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 4x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 52-LQFP
Supplier Device Package: 52-LQFP (10x10)

パッケージ: 52-LQFP

在庫39,240

MC56F8346VFVER2

NXP

IC MCU 16BIT 128KB FLASH 144LQFP

Core Processor: 56800E
Core Size: 16-Bit
Speed: 60MHz
Connectivity: CAN, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Number of I/O: 62
Program Memory Size: 128KB (64K x 16)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 6K x 16
Voltage - Supply (Vcc/Vdd): 2.25 V ~ 3.6 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫6,792

LPC1830FET100,551

NXP

IC MCU 32BIT ROMLESS 100TFBGA

Core Processor: ARM? Cortex?-M3
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O: 49
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 200K x 8
Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
Data Converters: A/D 8x10b, D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-TFBGA
Supplier Device Package: 100-TFBGA (9x9)

パッケージ: 100-TFBGA

在庫4,528

MCF51QM128VLHR

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

Core Processor: Coldfire V1
Core Size: 32-Bit
Speed: 50MHz
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 48
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 2x16b, 18x16b, D/A 1x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫3,120

MC9S08SH16CTJR

NXP

IC MCU 8BIT 16KB FLASH 20TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 17
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

パッケージ: 20-TSSOP (0.173", 4.40mm Width)

在庫14,388

MCHC908QT1VDWE

NXP

IC MCU 8BIT 1.5KB FLASH 8SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LVD, POR, PWM
Number of I/O: 5
Program Memory Size: 1.5KB (1.5K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Supplier Device Package: 8-SOIC

パッケージ: 8-SOIC (0.209", 5.30mm Width)

在庫2,256

MC9S08SH8MTJ

NXP

IC MCU 8BIT 8KB FLASH 20TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 17
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

パッケージ: 20-TSSOP (0.173", 4.40mm Width)

在庫3,920

MK60FN1M0VMD15

NXP

IC MCU 32BIT 1MB FLASH 144MAPBGA

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 150MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 100
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 58x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LBGA
Supplier Device Package: 144-MAPBGA (13x13)

パッケージ: 144-LBGA

在庫5,088

MSC8157ETVT1000A

NXP

IC DSP 6-CORE DGTL 783FCBGA

Type: SC3850 Six Core
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Clock Rate: 1GHz
Non-Volatile Memory: ROM (96 kB)
On-Chip RAM: 6.375MB
Voltage - I/O: 1.0V, 1.5V, 2.5V
Voltage - Core: 1.00V
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫4,240

IP4305CX4/LF/P,315

NXP

TVS DIODE WLCSP4

Type: Steering (Rail to Rail)
Unidirectional Channels: 2
Bidirectional Channels: -
Voltage - Reverse Standoff (Typ): -
Voltage - Breakdown (Min): 15V
Voltage - Clamping (Max) @ Ipp: -
Current - Peak Pulse (10/1000µs): -
Power - Peak Pulse: -
Power Line Protection: -
Applications: -
Capacitance @ Frequency: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 4-UFBGA, WLCSP
Supplier Device Package: 4-WLCSP (0.96x0.96)

パッケージ: 4-UFBGA, WLCSP

在庫3,708

OM15029Z

NXP

DEMO BOARD MCU WIRELESS

Type: -
Frequency: -
For Use With/Related Products: -
Supplied Contents: -

パッケージ: -

在庫3,906

MC17XS6500CEKR2

NXP

IC SWITCH HIGH-SIDE PENTA 32SOIC

Switch Type: -
Number of Outputs: -
Ratio - Input:Output: -
Output Configuration: -
Output Type: -
Interface: -
Voltage - Load: -
Voltage - Supply (Vcc/Vdd): -
Current - Output (Max): -
Rds On (Typ): -
Input Type: -
Features: -
Fault Protection: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫5,920

MC33771BTA2AER2

NXP

BCC14

Function: Battery Cell Controller
Battery Chemistry: Lithium-Ion
Number of Cells: 7 ~ 14
Fault Protection: Over/Under Voltage
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP Exposed Pad

在庫6,080

LS1023AXN7MQB

NXP

QORIQ 2XCPU 64-BIT ARM ARCH 1.

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫5,808

SPC5646CCF0VLU1

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 147
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 27x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

パッケージ: 176-LQFP

在庫3,360

S9S12G64J0MLF

NXP

S12 CORE,64K FLASH,AU

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: -

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MCIMX6QP6AVT1ABR

NXP

I.MX 6 SERIES 32-BIT MPU, QUAD A

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 4 Core, 32-Bit
Speed: 1GHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Ethernet: 10/100/1000Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Package / Case: 624-FBGA, FCBGA
Supplier Device Package: 624-FCBGA (21x21)

パッケージ: -

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SAF7770EL-101Z130Y

NXP

SAF7770EL

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Supplier Device Package: 364-LFBGA (15x15)

パッケージ: -

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