ページ 542 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
AFT09S200W02GNR3	NXP	FET RF 70V 960MHZ PLD Transistor Type: LDMOS Frequency: 960MHz Gain: 19.2dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.4A Power - Output: 56W Voltage - Rated: 70V Package / Case: OM-780-2 Supplier Device Package: OM-780-2	パッケージ: OM-780-2	在庫7,664
MMRF1310HR5	NXP	FET RF 2CH 133V 230MHZ NI780 Transistor Type: LDMOS (Dual) Frequency: 230MHz Gain: 26.5dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 100mA Power - Output: 300W Voltage - Rated: 133V Package / Case: NI-780-4 Supplier Device Package: NI-780-4	パッケージ: NI-780-4	在庫6,480
2PC1815GR,116	NXP	TRANS NPN 50V 0.15A TO-92 Transistor Type: NPN Current - Collector (Ic) (Max): 150mA Voltage - Collector Emitter Breakdown (Max): 50V Vce Saturation (Max) @ Ib, Ic: 300mV @ 10mA, 100mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 6V Power - Max: 500mW Frequency - Transition: 80MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	パッケージ: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	在庫3,696
BZX284-C18,115	NXP	DIODE ZENER 18V 400MW SOD2 Voltage - Zener (Nom) (Vz): 18V Tolerance: ±5% Power - Max: 400mW Impedance (Max) (Zzt): 20 Ohms Current - Reverse Leakage @ Vr: 50nA @ 12.6V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SOD-110 Supplier Device Package: SOD110	パッケージ: SOD-110	在庫2,048
TDA8350Q/N6,112	NXP	IC DC COUPLED V-DEFL 13-SIL Type: - Applications: - Mounting Type: Through Hole Package / Case: 13-SIP Formed Leads Supplier Device Package: 13-PDBS	パッケージ: 13-SIP Formed Leads	在庫2,128
SSL5031CTS/1X	NXP	IC LED DRIVER OFFLINE 6TSOP Type: AC DC Offline Switcher Topology: Step-Down (Buck) Internal Switch(s): Yes Number of Outputs: 1 Voltage - Supply (Min): 9.5V Voltage - Supply (Max): 16V Voltage - Output: - Current - Output / Channel: - Frequency: - Dimming: - Applications: Lighting Operating Temperature: -40°C ~ 160°C (TJ) Mounting Type: Surface Mount Package / Case: SC-74, SOT-457 Supplier Device Package: 6-TSOP	パッケージ: SC-74, SOT-457	在庫7,968
PCF8598C-2T/02,118	NXP	IC EEPROM 8KBIT 100KHZ 8SO Memory Type: Non-Volatile Memory Format: EEPROM Technology: EEPROM Memory Size: 8Kb (1K x 8) Memory Interface: I2C Clock Frequency: 100kHz Write Cycle Time - Word, Page: - Access Time: - Voltage - Supply: 2.5 V ~ 6.0 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.295", 7.50mm Width) Supplier Device Package: 8-SO	パッケージ: 8-SOIC (0.295", 7.50mm Width)	在庫3,424
TDA8946AJ/N2,112	NXP	IC AMP AUDIO PWR 15W STER 17SIL Type: Class AB Output Type: 2-Channel (Stereo) Max Output Power x Channels @ Load: 15W x 2 @ 8 Ohm Voltage - Supply: 4.5 V ~ 18 V Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Through Hole Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: DBS17P Package / Case: 17-SIP Formed Leads	パッケージ: 17-SIP Formed Leads	在庫7,840
TDA8595TH/N2S,112	NXP	IC AMP AUDIO I2C 45W QUAD 36HSOP Type: Class AB Output Type: 4-Channel (Quad) Max Output Power x Channels @ Load: 64W x 4 @ 2 Ohm Voltage - Supply: 8 V ~ 18 V Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Supplier Device Package: 36-HSOP Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad	パッケージ: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad	在庫2,160
PTN3300AHF,518	NXP	IC DVI/HDMI LEVEL SHIFT 48HWQFN Applications: DVI, HDMI Level Switching Interface: I2C Voltage - Supply: 3 V ~ 3.6 V Package / Case: 48-WFQFN Exposed Pad Supplier Device Package: 48-HWQFN Mounting Type: Surface Mount	パッケージ: 48-WFQFN Exposed Pad	在庫5,296
MC8641HX1000NB	NXP	IC MPU MPC86XX 1.0GHZ 994FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 994-BCBGA, FCCBGA Supplier Device Package: 994-FCCBGA (33x33)	パッケージ: 994-BCBGA, FCCBGA	在庫6,880
MC7448VS1700LD	NXP	IC MPU MPC74XX 1.7GHZ 360FCCLGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.7GHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-CLGA, FCCLGA Supplier Device Package: 360-FCCLGA (25x25)	パッケージ: 360-CLGA, FCCLGA	在庫4,144
P2010NXN2KHC	NXP	IC MPU Q OR IQ 1.2GHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	パッケージ: 689-BBGA Exposed Pad	在庫2,672
MCIMX6D4AVT10AC	NXP	IC MPU I.MX6D 1.0GHZ 624FCBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	パッケージ: 624-FBGA, FCBGA	在庫4,480
MC68HC11K1CFNE3	NXP	IC MCU 8BIT ROMLESS 84PLCC Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 37 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: 640 x 8 RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 84-LCC (J-Lead) Supplier Device Package: 84-PLCC (29.21x29.21)	パッケージ: 84-LCC (J-Lead)	在庫2,928
MC68HC908AB32CFU	NXP	IC MCU 8BIT 32KB FLASH 64QFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: POR, PWM Number of I/O: 51 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	パッケージ: 64-QFP	在庫82,836
SPC5747CK1MKU6	NXP	IC MCU 32BIT 4MB FLASH 176LQFP Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	パッケージ: 176-LQFP Exposed Pad	在庫6,640
S9S08DZ16F2MLC	NXP	IC MCU 8BIT 16KB FLASH 32LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 25 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	パッケージ: 32-LQFP	在庫20,976
PCK3807ADS,112	NXP	IC CLK BUFFER 1:10 400MHZ 20SSOP Type: Fanout Buffer (Distribution) Number of Circuits: 1 Ratio - Input:Output: 1:10 Differential - Input:Output: No/No Input: LVCMOS, LVTTL Output: LVTTL Frequency - Max: 400MHz Voltage - Supply: 2.3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-SSOP (0.154", 3.90mm Width) Supplier Device Package: 20-SSOP	パッケージ: 20-SSOP (0.154", 3.90mm Width)	在庫5,312
MMA2204EG	NXP	ACCELEROMETER 112.5G ANAL 16SOIC Type: Analog Axis: X Acceleration Range: ±112.5g Sensitivity (LSB/g): - Sensitivity (mV/g): 20 Bandwidth: 400Hz Output Type: Analog Voltage Voltage - Supply: 4.75 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	パッケージ: 16-SOIC (0.295", 7.50mm Width)	在庫3,474
TJA1057GT/1Z	NXP	HIGH-SPEED CAN TRANSCEIVER Type: Transceiver Protocol: CANbus Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 300mV Data Rate: 5Mbps Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	パッケージ: 8-SOIC (0.154", 3.90mm Width)	在庫6,112
T1014NXN7MQA	NXP	QORIQ 1XCPU 64-BIT PWR ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫3,472
S912XEP768W1MAL	NXP	16-BIT MCU S12X CORE 768KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	パッケージ: 112-LQFP	在庫4,208
FS32K144HFT0CLLT	NXP	S32K144 32-BIT MCU ARM CORTEX-M Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: 100-LQFP	在庫4,384
S9S12G192F0MLFR	NXP	16-BIT MCU S12 CORE 192KB FLAS Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 192KB (192K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 11K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP	在庫2,864
MKL03Z16VFG4R	NXP	KINETIS L 32-BIT MCU ARM CORTEX Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 7x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 16-WFQFN Exposed Pad Supplier Device Package: 16-QFN (3x3)	パッケージ: 16-WFQFN Exposed Pad	在庫4,752
SPC5606BAVLU6R	NXP	NXP 32-BIT MCU, POWER ARCH CORE Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
MF0ULH3101DUFV	NXP	MF0ULH3101DUFV Applications: - Core Processor: - Program Memory Type: - Controller Series: - RAM Size: - Interface: - Number of I/O: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote

AFT09S200W02GNR3

NXP

FET RF 70V 960MHZ PLD

Transistor Type: LDMOS
Frequency: 960MHz
Gain: 19.2dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.4A
Power - Output: 56W
Voltage - Rated: 70V
Package / Case: OM-780-2
Supplier Device Package: OM-780-2

パッケージ: OM-780-2

在庫7,664

MMRF1310HR5

NXP

FET RF 2CH 133V 230MHZ NI780

Transistor Type: LDMOS (Dual)
Frequency: 230MHz
Gain: 26.5dB
Voltage - Test: 50V
Current Rating: -
Noise Figure: -
Current - Test: 100mA
Power - Output: 300W
Voltage - Rated: 133V
Package / Case: NI-780-4
Supplier Device Package: NI-780-4

パッケージ: NI-780-4

在庫6,480

2PC1815GR,116

NXP

TRANS NPN 50V 0.15A TO-92

Transistor Type: NPN
Current - Collector (Ic) (Max): 150mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 300mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 6V
Power - Max: 500mW
Frequency - Transition: 80MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Supplier Device Package: TO-92-3

パッケージ: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

在庫3,696

BZX284-C18,115

NXP

DIODE ZENER 18V 400MW SOD2

Voltage - Zener (Nom) (Vz): 18V
Tolerance: ±5%
Power - Max: 400mW
Impedance (Max) (Zzt): 20 Ohms
Current - Reverse Leakage @ Vr: 50nA @ 12.6V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-110
Supplier Device Package: SOD110

パッケージ: SOD-110

在庫2,048

TDA8350Q/N6,112

NXP

IC DC COUPLED V-DEFL 13-SIL

Type: -
Applications: -
Mounting Type: Through Hole
Package / Case: 13-SIP Formed Leads
Supplier Device Package: 13-PDBS

パッケージ: 13-SIP Formed Leads

在庫2,128

SSL5031CTS/1X

NXP

IC LED DRIVER OFFLINE 6TSOP

Type: AC DC Offline Switcher
Topology: Step-Down (Buck)
Internal Switch(s): Yes
Number of Outputs: 1
Voltage - Supply (Min): 9.5V
Voltage - Supply (Max): 16V
Voltage - Output: -
Current - Output / Channel: -
Frequency: -
Dimming: -
Applications: Lighting
Operating Temperature: -40°C ~ 160°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Supplier Device Package: 6-TSOP

パッケージ: SC-74, SOT-457

在庫7,968

PCF8598C-2T/02,118

NXP

IC EEPROM 8KBIT 100KHZ 8SO

Memory Type: Non-Volatile
Memory Format: EEPROM
Technology: EEPROM
Memory Size: 8Kb (1K x 8)
Memory Interface: I2C
Clock Frequency: 100kHz
Write Cycle Time - Word, Page: -
Access Time: -
Voltage - Supply: 2.5 V ~ 6.0 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 8-SO

パッケージ: 8-SOIC (0.295", 7.50mm Width)

在庫3,424

TDA8946AJ/N2,112

NXP

IC AMP AUDIO PWR 15W STER 17SIL

Type: Class AB
Output Type: 2-Channel (Stereo)
Max Output Power x Channels @ Load: 15W x 2 @ 8 Ohm
Voltage - Supply: 4.5 V ~ 18 V
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: DBS17P
Package / Case: 17-SIP Formed Leads

パッケージ: 17-SIP Formed Leads

在庫7,840

TDA8595TH/N2S,112

NXP

IC AMP AUDIO I2C 45W QUAD 36HSOP

Type: Class AB
Output Type: 4-Channel (Quad)
Max Output Power x Channels @ Load: 64W x 4 @ 2 Ohm
Voltage - Supply: 8 V ~ 18 V
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 36-HSOP
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad

パッケージ: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad

在庫2,160

PTN3300AHF,518

NXP

IC DVI/HDMI LEVEL SHIFT 48HWQFN

Applications: DVI, HDMI Level Switching
Interface: I2C
Voltage - Supply: 3 V ~ 3.6 V
Package / Case: 48-WFQFN Exposed Pad
Supplier Device Package: 48-HWQFN
Mounting Type: Surface Mount

パッケージ: 48-WFQFN Exposed Pad

在庫5,296

MC8641HX1000NB

NXP

IC MPU MPC86XX 1.0GHZ 994FCCBGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 994-BCBGA, FCCBGA
Supplier Device Package: 994-FCCBGA (33x33)

パッケージ: 994-BCBGA, FCCBGA

在庫6,880

MC7448VS1700LD

NXP

IC MPU MPC74XX 1.7GHZ 360FCCLGA

Core Processor: PowerPC G4
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.7GHz
Co-Processors/DSP: Multimedia; SIMD
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 360-CLGA, FCCLGA
Supplier Device Package: 360-FCCLGA (25x25)

パッケージ: 360-CLGA, FCCLGA

在庫4,144

P2010NXN2KHC

NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 125°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

パッケージ: 689-BBGA Exposed Pad

在庫2,672

MCIMX6D4AVT10AC

NXP

IC MPU I.MX6D 1.0GHZ 624FCBGA

Core Processor: ARM? Cortex?-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-FBGA, FCBGA
Supplier Device Package: 624-FCBGA (21x21)

パッケージ: 624-FBGA, FCBGA

在庫4,480

MC68HC11K1CFNE3

NXP

IC MCU 8BIT ROMLESS 84PLCC

Core Processor: HC11
Core Size: 8-Bit
Speed: 3MHz
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 37
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: 640 x 8
RAM Size: 768 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 84-LCC (J-Lead)
Supplier Device Package: 84-PLCC (29.21x29.21)

パッケージ: 84-LCC (J-Lead)

在庫2,928

MC68HC908AB32CFU

NXP

IC MCU 8BIT 32KB FLASH 64QFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI, SPI
Peripherals: POR, PWM
Number of I/O: 51
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-QFP
Supplier Device Package: 64-QFP (14x14)

パッケージ: 64-QFP

在庫82,836

SPC5747CK1MKU6

NXP

IC MCU 32BIT 4MB FLASH 176LQFP

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz/160MHz
Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 129
Program Memory Size: 4MB (4M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

パッケージ: 176-LQFP Exposed Pad

在庫6,640

S9S08DZ16F2MLC

NXP

IC MCU 8BIT 16KB FLASH 32LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 25
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 10x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

パッケージ: 32-LQFP

在庫20,976

PCK3807ADS,112

NXP

IC CLK BUFFER 1:10 400MHZ 20SSOP

Type: Fanout Buffer (Distribution)
Number of Circuits: 1
Ratio - Input:Output: 1:10
Differential - Input:Output: No/No
Input: LVCMOS, LVTTL
Output: LVTTL
Frequency - Max: 400MHz
Voltage - Supply: 2.3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Supplier Device Package: 20-SSOP

パッケージ: 20-SSOP (0.154", 3.90mm Width)

在庫5,312

MMA2204EG

NXP

ACCELEROMETER 112.5G ANAL 16SOIC

Type: Analog
Axis: X
Acceleration Range: ±112.5g
Sensitivity (LSB/g): -
Sensitivity (mV/g): 20
Bandwidth: 400Hz
Output Type: Analog Voltage
Voltage - Supply: 4.75 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

パッケージ: 16-SOIC (0.295", 7.50mm Width)

在庫3,474

TJA1057GT/1Z

NXP

HIGH-SPEED CAN TRANSCEIVER

Type: Transceiver
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 300mV
Data Rate: 5Mbps
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

パッケージ: 8-SOIC (0.154", 3.90mm Width)

在庫6,112

T1014NXN7MQA

NXP

QORIQ 1XCPU 64-BIT PWR ARCH 1.

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫3,472

S912XEP768W1MAL

NXP

16-BIT MCU S12X CORE 768KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 768KB (768K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

パッケージ: 112-LQFP

在庫4,208

FS32K144HFT0CLLT

NXP

S32K144 32-BIT MCU ARM CORTEX-M

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: -
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

在庫4,384

S9S12G192F0MLFR

NXP

16-BIT MCU S12 CORE 192KB FLAS

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 192KB (192K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 11K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP

在庫2,864

MKL03Z16VFG4R

NXP

KINETIS L 32-BIT MCU ARM CORTEX

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number of I/O: 14
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 7x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 16-WFQFN Exposed Pad
Supplier Device Package: 16-QFN (3x3)

パッケージ: 16-WFQFN Exposed Pad

在庫4,752

SPC5606BAVLU6R

NXP

NXP 32-BIT MCU, POWER ARCH CORE

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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MF0ULH3101DUFV

NXP

MF0ULH3101DUFV

Applications: -
Core Processor: -
Program Memory Type: -
Controller Series: -
RAM Size: -
Interface: -
Number of I/O: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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