ページ 544 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
2PA1774R,135	NXP	TRANS PNP 50V 0.15A SC-75 Transistor Type: PNP Current - Collector (Ic) (Max): 150mA Voltage - Collector Emitter Breakdown (Max): 50V Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 1mA, 6V Power - Max: 150mW Frequency - Transition: 100MHz Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-75, SOT-416 Supplier Device Package: SC-75	パッケージ: SC-75, SOT-416	在庫2,912
1PS59SB14,115	NXP	DIODE ARRAY SCHOTTKY 30V SMT3 Diode Configuration: 1 Pair Series Connection Diode Type: Schottky Voltage - DC Reverse (Vr) (Max): 30V Current - Average Rectified (Io) (per Diode): 200mA (DC) Voltage - Forward (Vf) (Max) @ If: 800mV @ 100mA Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 5ns Current - Reverse Leakage @ Vr: 2µA @ 25V Operating Temperature - Junction: 125°C (Max) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫2,832
NX5P2924BUK	NXP	IC LOAD SWITCH HI SD 2.5A 9WLCSP Switch Type: General Purpose Number of Outputs: 1 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: On/Off Voltage - Load: 0.8 V ~ 5.5 V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 2.5A Rds On (Typ): 14 mOhm Input Type: Non-Inverting Features: Load Discharge, Slew Rate Controlled Fault Protection: - Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 6-XFBGA, WLCSP Supplier Device Package: 6-WLCSP (0.87x1.37)	パッケージ: 6-XFBGA, WLCSP	在庫7,568
HEF4025BT,653	NXP	IC GATE NOR 3CH 3-INP 14-SO Logic Type: NOR Gate Number of Circuits: 3 Number of Inputs: 3 Features: - Voltage - Supply: 3 V ~ 15 V Current - Quiescent (Max): - Current - Output High, Low: 2.4mA, 2.4mA Logic Level - Low: - Logic Level - High: - Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 14-SO Package / Case: 14-SOIC (0.154", 3.90mm Width)	パッケージ: 14-SOIC (0.154", 3.90mm Width)	在庫3,376
74HCT4059N,112	NXP	IC COUNTER PROGRAM DIV X N 24DIP Logic Type: Divide-by-N Direction: Down Number of Elements: 1 Number of Bits per Element: 16 Reset: Asynchronous Timing: Synchronous Count Rate: 36MHz Trigger Type: Positive Edge Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 24-DIP (0.600", 15.24mm) Supplier Device Package: 24-DIP	パッケージ: 24-DIP (0.600", 15.24mm)	在庫6,752
74AVCM162836DGG,11	NXP	IC RGSTRD DVR 3-ST 20BIT 56TSSOP Logic Type: Buffer, Non-Inverting Number of Elements: 1 Number of Bits per Element: 20 Input Type: - Output Type: Push-Pull Current - Output High, Low: 12mA, 12mA Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 56-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 56-TSSOP	パッケージ: 56-TFSOP (0.240", 6.10mm Width)	在庫7,440
MC908QT1ACPE	NXP	IC MCU 8BIT 1.5KB FLASH 8DIP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 5 Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	パッケージ: 8-DIP (0.300", 7.62mm)	在庫7,104
MC705B16NCFNER	NXP	IC MCU 8BIT 15KB OTP 52PLCC Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SCI Peripherals: POR, WDT Number of I/O: 32 Program Memory Size: 15KB (15K x 8) Program Memory Type: OTP EEPROM Size: 256 x 8 RAM Size: 352 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1)	パッケージ: 52-LCC (J-Lead)	在庫3,872
MC68332GCPV16B1	NXP	IC MCU 32BIT ROMLESS 144LQFP Core Processor: CPU32 Core Size: 32-Bit Speed: 16MHz Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 15 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫4,512
MPC5566MZP132	NXP	IC MCU 32BIT 3MB FLASH 416BGA Core Processor: e200z6 Core Size: 32-Bit Speed: 132MHz Connectivity: CAN, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 256 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	パッケージ: 416-BBGA	在庫18,360
MPC5553MZP132	NXP	IC MCU 32BIT 1.5MB FLASH 416BGA Core Processor: e200z6 Core Size: 32-Bit Speed: 132MHz Connectivity: CAN, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 220 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	パッケージ: 416-BBGA	在庫6,064
S912DT12PE2VPVER	NXP	IC MCU 16BIT 128KB FLASH 112LQFP Core Processor: CPU12 Core Size: 16-Bit Speed: 8MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 67 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 16x8/10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	パッケージ: 112-LQFP	在庫7,712
MVF60NN152CMK40	NXP	IC MCU 32BIT ROMLESS 364MAPBGA Core Processor: ARM? Cortex?-A5 + Cortex?-M4 Core Size: 32-Bit Dual-Core Speed: 400MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, WDT Number of I/O: - Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1.5MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D Dual x 12b, D/A Dual x 12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫7,504
LPC1827JBD144E	NXP	IC MCU 32BIT 1MB FLASH 144LQFP Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 180MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 83 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 136K x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: A/D 8x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫4,208
MKV44F256VLH16	NXP	IC MCU 32BIT 256KB FLASH 64LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 168MHz Connectivity: CAN, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 48 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 29x12b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫5,664
MC9S08GT8ACFBER	NXP	IC MCU 8BIT 8KB FLASH 44QFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 36 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-QFP Supplier Device Package: 44-QFP (10x10)	パッケージ: 44-QFP	在庫17,454
MMA6821AKGWR2	NXP	ACCELEROMETER 10BIT SPI 16QFN Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫3,312
MMA5112NPKWR2	NXP	ACCELEROMETER PSI5 16QFN Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫4,158
MMA5224KWR2	NXP	ACCELEROMETER 240G PCM/SPI 16QFN Type: Digital Axis: X Acceleration Range: ±240g Sensitivity (LSB/g): 2 Sensitivity (mV/g): - Bandwidth: - Output Type: PCM, SPI Voltage - Supply: 4.2 V ~ 17 V Features: Selectable Low Pass Filter Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	パッケージ: 16-QFN Exposed Pad	在庫2,232
OM5581/N5322S02	NXP	KIT DEMO NFC PN532 Type: NFC Controller Frequency: 13.56MHz For Use With/Related Products: - Supplied Contents: 2 Boards, Cable, Power Supply	パッケージ: -	在庫8,118
TEF6730HW/V1,557	NXP	IC DIGITAL IF FRONT END 64HTQFP Frequency: - Sensitivity: - Data Rate (Max): - Modulation or Protocol: AM, FM, WB Applications: AM/FM Radio Receiver Current - Receiving: 85.3mA, 114.7mA Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: - Voltage - Supply: 8 V ~ 9 V Operating Temperature: -40°C ~ 85°C Package / Case: 64-TQFP Exposed Pad Supplier Device Package: 64-HTQFP (10x10)	パッケージ: 64-TQFP Exposed Pad	在庫8,478
MCIMX6S6AVM10AC	NXP	I.MX 6 SERIES 32-BIT MPU ARM CO Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-LFBGA Supplier Device Package: 624-MAPBGA (21x21)	パッケージ: 624-LFBGA	在庫7,440
S9S08RNA16W2MTG	NXP	8-BIT MCU S08 CORE 16KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	パッケージ: 16-TSSOP (0.173", 4.40mm Width)	在庫6,816
MKE02Z64VLH4R	NXP	KINETIS KE02: 40MHZ CORTEX-M0+ 5 Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 40MHz Connectivity: I²C, SPI, UART/USART Peripherals: LVD, PWM, WDT Number of I/O: 57 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 2x6b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫7,184
LD6816CX4-C16P-315	NXP	IC REG LINEAR FIXED LDO REG Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 1.6V Voltage - Output (Max): - Voltage Dropout (Max): 0.075V @ 150mA Current - Output: 150mA Current - Quiescent (Iq): 100 µA Current - Supply (Max): 250 µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature, Transient Voltage Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-UFBGA, WLCSP Supplier Device Package: 4-WLCSP (0.76x0.76)	パッケージ: -	Request a Quote
MPF7100BVBA3ESR2	NXP	POWER MANAGEMENT IC, I.MX 8DX/DX Applications: i.MX Processors Current - Supply: 10µA Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	パッケージ: -	Request a Quote
TJA1463ATK-0Z	NXP	IC TRANSCEIVER HALF 1/1 14HVSON Type: Transceiver Protocol: CANbus Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 100 mV Data Rate: 8Mbps Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 14-VDFN Exposed Pad Supplier Device Package: 14-HVSON (3x4.5)	パッケージ: -	在庫24,924
SP5747CSK0AVMJ2R	NXP	IC MCU 32BIT 4MB FLSH 256MAPPBGA Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz, 120MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 48x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-MAPPBGA (17x17)	パッケージ: -	Request a Quote

2PA1774R,135

NXP

TRANS PNP 50V 0.15A SC-75

Transistor Type: PNP
Current - Collector (Ic) (Max): 150mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 1mA, 6V
Power - Max: 150mW
Frequency - Transition: 100MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Supplier Device Package: SC-75

パッケージ: SC-75, SOT-416

在庫2,912

1PS59SB14,115

NXP

DIODE ARRAY SCHOTTKY 30V SMT3

Diode Configuration: 1 Pair Series Connection
Diode Type: Schottky
Voltage - DC Reverse (Vr) (Max): 30V
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Voltage - Forward (Vf) (Max) @ If: 800mV @ 100mA
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5ns
Current - Reverse Leakage @ Vr: 2µA @ 25V
Operating Temperature - Junction: 125°C (Max)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫2,832

NX5P2924BUK

NXP

IC LOAD SWITCH HI SD 2.5A 9WLCSP

Switch Type: General Purpose
Number of Outputs: 1
Ratio - Input:Output: 1:1
Output Configuration: High Side
Output Type: N-Channel
Interface: On/Off
Voltage - Load: 0.8 V ~ 5.5 V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 2.5A
Rds On (Typ): 14 mOhm
Input Type: Non-Inverting
Features: Load Discharge, Slew Rate Controlled
Fault Protection: -
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 6-XFBGA, WLCSP
Supplier Device Package: 6-WLCSP (0.87x1.37)

パッケージ: 6-XFBGA, WLCSP

在庫7,568

HEF4025BT,653

NXP

IC GATE NOR 3CH 3-INP 14-SO

Logic Type: NOR Gate
Number of Circuits: 3
Number of Inputs: 3
Features: -
Voltage - Supply: 3 V ~ 15 V
Current - Quiescent (Max): -
Current - Output High, Low: 2.4mA, 2.4mA
Logic Level - Low: -
Logic Level - High: -
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Supplier Device Package: 14-SO
Package / Case: 14-SOIC (0.154", 3.90mm Width)

パッケージ: 14-SOIC (0.154", 3.90mm Width)

在庫3,376

74HCT4059N,112

NXP

IC COUNTER PROGRAM DIV X N 24DIP

Logic Type: Divide-by-N
Direction: Down
Number of Elements: 1
Number of Bits per Element: 16
Reset: Asynchronous
Timing: Synchronous
Count Rate: 36MHz
Trigger Type: Positive Edge
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Package / Case: 24-DIP (0.600", 15.24mm)
Supplier Device Package: 24-DIP

パッケージ: 24-DIP (0.600", 15.24mm)

在庫6,752

74AVCM162836DGG,11

NXP

IC RGSTRD DVR 3-ST 20BIT 56TSSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 20
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 1.2 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 56-TSSOP

パッケージ: 56-TFSOP (0.240", 6.10mm Width)

在庫7,440

MC908QT1ACPE

NXP

IC MCU 8BIT 1.5KB FLASH 8DIP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LVD, POR, PWM
Number of I/O: 5
Program Memory Size: 1.5KB (1.5K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

パッケージ: 8-DIP (0.300", 7.62mm)

在庫7,104

MC705B16NCFNER

NXP

IC MCU 8BIT 15KB OTP 52PLCC

Core Processor: HC05
Core Size: 8-Bit
Speed: 2.1MHz
Connectivity: SCI
Peripherals: POR, WDT
Number of I/O: 32
Program Memory Size: 15KB (15K x 8)
Program Memory Type: OTP
EEPROM Size: 256 x 8
RAM Size: 352 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 52-LCC (J-Lead)
Supplier Device Package: 52-PLCC (19.1x19.1)

パッケージ: 52-LCC (J-Lead)

在庫3,872

MC68332GCPV16B1

NXP

IC MCU 32BIT ROMLESS 144LQFP

Core Processor: CPU32
Core Size: 32-Bit
Speed: 16MHz
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 15
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫4,512

MPC5566MZP132

NXP

IC MCU 32BIT 3MB FLASH 416BGA

Core Processor: e200z6
Core Size: 32-Bit
Speed: 132MHz
Connectivity: CAN, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 256
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
Data Converters: A/D 40x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BBGA
Supplier Device Package: 416-PBGA (27x27)

パッケージ: 416-BBGA

在庫18,360

MPC5553MZP132

NXP

IC MCU 32BIT 1.5MB FLASH 416BGA

Core Processor: e200z6
Core Size: 32-Bit
Speed: 132MHz
Connectivity: CAN, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 220
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
Data Converters: A/D 40x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BBGA
Supplier Device Package: 416-PBGA (27x27)

パッケージ: 416-BBGA

在庫6,064

S912DT12PE2VPVER

NXP

IC MCU 16BIT 128KB FLASH 112LQFP

Core Processor: CPU12
Core Size: 16-Bit
Speed: 8MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 67
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 16x8/10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

パッケージ: 112-LQFP

在庫7,712

MVF60NN152CMK40

NXP

IC MCU 32BIT ROMLESS 364MAPBGA

Core Processor: ARM? Cortex?-A5 + Cortex?-M4
Core Size: 32-Bit Dual-Core
Speed: 400MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, WDT
Number of I/O: -
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 1.5MB
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D Dual x 12b, D/A Dual x 12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫7,504

LPC1827JBD144E

NXP

IC MCU 32BIT 1MB FLASH 144LQFP

Core Processor: ARM? Cortex?-M3
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O: 83
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 16K x 8
RAM Size: 136K x 8
Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
Data Converters: A/D 8x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫4,208

MKV44F256VLH16

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 168MHz
Connectivity: CAN, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 48
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 29x12b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫5,664

MC9S08GT8ACFBER

NXP

IC MCU 8BIT 8KB FLASH 44QFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 36
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 44-QFP
Supplier Device Package: 44-QFP (10x10)

パッケージ: 44-QFP

在庫17,454

MMA6821AKGWR2

NXP

ACCELEROMETER 10BIT SPI 16QFN

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫3,312

MMA5112NPKWR2

NXP

ACCELEROMETER PSI5 16QFN

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫4,158

MMA5224KWR2

NXP

ACCELEROMETER 240G PCM/SPI 16QFN

Type: Digital
Axis: X
Acceleration Range: ±240g
Sensitivity (LSB/g): 2
Sensitivity (mV/g): -
Bandwidth: -
Output Type: PCM, SPI
Voltage - Supply: 4.2 V ~ 17 V
Features: Selectable Low Pass Filter
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-QFN Exposed Pad
Supplier Device Package: 16-QFN (6x6)

パッケージ: 16-QFN Exposed Pad

在庫2,232

OM5581/N5322S02

NXP

KIT DEMO NFC PN532

Type: NFC Controller
Frequency: 13.56MHz
For Use With/Related Products: -
Supplied Contents: 2 Boards, Cable, Power Supply

パッケージ: -

在庫8,118

TEF6730HW/V1,557

NXP

IC DIGITAL IF FRONT END 64HTQFP

Frequency: -
Sensitivity: -
Data Rate (Max): -
Modulation or Protocol: AM, FM, WB
Applications: AM/FM Radio Receiver
Current - Receiving: 85.3mA, 114.7mA
Data Interface: PCB, Surface Mount
Memory Size: -
Antenna Connector: PCB, Surface Mount
Features: -
Voltage - Supply: 8 V ~ 9 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 64-TQFP Exposed Pad
Supplier Device Package: 64-HTQFP (10x10)

パッケージ: 64-TQFP Exposed Pad

在庫8,478

MCIMX6S6AVM10AC

NXP

I.MX 6 SERIES 32-BIT MPU ARM CO

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1GHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-LFBGA
Supplier Device Package: 624-MAPBGA (21x21)

パッケージ: 624-LFBGA

在庫7,440

S9S08RNA16W2MTG

NXP

8-BIT MCU S08 CORE 16KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 12
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

パッケージ: 16-TSSOP (0.173", 4.40mm Width)

在庫6,816

MKE02Z64VLH4R

NXP

KINETIS KE02: 40MHZ CORTEX-M0+ 5

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 40MHz
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Number of I/O: 57
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 2x6b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫7,184

LD6816CX4-C16P-315

NXP

IC REG LINEAR FIXED LDO REG

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 1.6V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.075V @ 150mA
Current - Output: 150mA
Current - Quiescent (Iq): 100 µA
Current - Supply (Max): 250 µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature, Transient Voltage
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 4-UFBGA, WLCSP
Supplier Device Package: 4-WLCSP (0.76x0.76)

パッケージ: -

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MPF7100BVBA3ESR2

NXP

POWER MANAGEMENT IC, I.MX 8DX/DX

Applications: i.MX Processors
Current - Supply: 10µA
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

パッケージ: -

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TJA1463ATK-0Z

NXP

IC TRANSCEIVER HALF 1/1 14HVSON

Type: Transceiver
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 100 mV
Data Rate: 8Mbps
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 14-VDFN Exposed Pad
Supplier Device Package: 14-HVSON (3x4.5)

パッケージ: -

在庫24,924

SP5747CSK0AVMJ2R

NXP

IC MCU 32BIT 4MB FLSH 256MAPPBGA

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz, 120MHz
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 178
Program Memory Size: 4MB (4M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Data Converters: A/D 48x10b, 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPPBGA (17x17)

パッケージ: -

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