ページ 837 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
MMRF1314HR5	NXP	TRANS 960-1215MHZ 1000W PEAK 50V Transistor Type: LDMOS (Dual) Frequency: 1.4GHz Gain: 17.7dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 100mA Power - Output: 1000W Voltage - Rated: 105V Package / Case: SOT-979A Supplier Device Package: NI-1230-4H	パッケージ: SOT-979A	在庫7,552
BZX384-C3V3/ZLX	NXP	DIODE ZENER SOD323 Voltage - Zener (Nom) (Vz): 3.3V Tolerance: ±5% Power - Max: 300mW Impedance (Max) (Zzt): 95 Ohms Current - Reverse Leakage @ Vr: 50nA @ 700mV Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SC-76, SOD-323 Supplier Device Package: SC-76-2	パッケージ: SC-76, SOD-323	在庫2,464
MC33395TDWBR2	NXP	IC GATE DRIVER 3PHASE 32-SOIC Driven Configuration: Half-Bridge Channel Type: 3-Phase Number of Drivers: 6 Gate Type: N-Channel MOSFET Voltage - Supply: 5.5 V ~ 24 V Logic Voltage - VIL, VIH: - Current - Peak Output (Source, Sink): - Input Type: Non-Inverting High Side Voltage - Max (Bootstrap): - Rise / Fall Time (Typ): 350ns, 250ns Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 32-SOIC (0.295", 7.50mm Width) Supplier Device Package: 32-SOIC	パッケージ: 32-SOIC (0.295", 7.50mm Width)	在庫2,016
74LV259PW,118	NXP	IC 8BIT ADDRESSABL LATCH 16TSSOP Logic Type: D-Type, Addressable Circuit: 1:8 Output Type: Standard Voltage - Supply: 1 V ~ 3.6 V Independent Circuits: 1 Delay Time - Propagation: 36ns Current - Output High, Low: 6mA, 6mA Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	パッケージ: 16-TSSOP (0.173", 4.40mm Width)	在庫3,424
74LV4020D,112	NXP	IC 14BIT BINARY RIPPLE 16-SOIC Logic Type: Binary Counter Direction: Up Number of Elements: 1 Number of Bits per Element: 14 Reset: Asynchronous Timing: - Count Rate: 100MHz Trigger Type: Negative Edge Voltage - Supply: 1 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	パッケージ: 16-SOIC (0.154", 3.90mm Width)	在庫7,392
MB2245BB,518	NXP	IC TXRX 16BIT 52QFP Logic Type: Transceiver, Non-Inverting Number of Elements: 2 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 52-QFP Supplier Device Package: 52-QFN (10x10)	パッケージ: 52-QFP	在庫5,312
UJA1078TW/3V3/WD:1	NXP	IC SBC CAN/DUAL LIN 3.3 32HTSSOP Applications: Automotive Interface: CAN, LIN Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	パッケージ: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	在庫4,448
PCA9554D,112	NXP	IC I/O EXPANDER I2C 8B 16SOIC Number of I/O: 8 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SO	パッケージ: 16-SOIC (0.295", 7.50mm Width)	在庫23,964
MC34CM0902WEF	NXP	IC TXRX CAN 14SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 2/2 Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SOIC	パッケージ: 14-SOIC (0.154", 3.90mm Width)	在庫8,088
MPC8548ECVUAQG	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫4,928
MC68030RC33C	NXP	IC MPU M680X0 33MHZ 128PGA Core Processor: 68030 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 128-BPGA Supplier Device Package: 128-PGA (35x35)	パッケージ: 128-BPGA	在庫8,148
MCF5249VF140	NXP	IC MCU 32BIT ROMLESS 160MAPBGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 140MHz Connectivity: I2C, IDE, Memory Card, SPI, UART/USART Peripherals: DMA, I2S, POR, Serial Audio, WDT Number of I/O: 47 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 4x12b Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 160-BGA Supplier Device Package: 160-MAPBGA (15x15)	パッケージ: 160-BGA	在庫135,348
S9S08DZ16F2VLF	NXP	IC MCU 8BIT 16KB FLASH 48LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP	在庫4,176
S9S12G64F1MLC	NXP	IC MCU 16BIT 64KB FLASH 32LQFP Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	パッケージ: 32-LQFP	在庫2,416
MPXM2102D	NXP	SENS PRESSURE 14.5 PSI MAX MPAK Pressure Type: Differential Operating Pressure: 14.5 PSI (100 kPa) Output Type: Wheatstone Bridge Output: 0 mV ~ 40 mV (10V) Accuracy: - Voltage - Supply: 10 V ~ 16 V Port Size: - Port Style: No Port Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 5-SMD Module Supplier Device Package: 5-MPAK	パッケージ: 5-SMD Module	在庫7,182
MMA5148LWR2	NXP	ACCELEROMETER PSI5 16QFN Type: Digital Axis: Z Acceleration Range: ±480g Sensitivity (LSB/g): 1 Sensitivity (mV/g): - Bandwidth: - Output Type: PCM, SPI Voltage - Supply: 4.2 V ~ 17 V Features: - Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	パッケージ: 16-QFN Exposed Pad	在庫6,822
MMA1270KEGR2	NXP	ACCELEROMETER 2.5G ANALOG 16SOIC Type: Analog Axis: Z Acceleration Range: ±2.5g Sensitivity (LSB/g): - Sensitivity (mV/g): 750 Bandwidth: 50Hz Output Type: Analog Voltage Voltage - Supply: 4.75 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	パッケージ: 16-SOIC (0.295", 7.50mm Width)	在庫7,200
SL2S2602FUDZ	NXP	IC I-CODE SLI UNCASED FOIL Type: RFID Reader Frequency: 13.56MHz Standards: ISO 15693 Interface: - Voltage - Supply: - Operating Temperature: -40°C ~ 85°C Package / Case: Die Supplier Device Package: Wafer	パッケージ: Die	在庫3,780
BGA6589,135	NXP	MMIC AMPLIFIER SOT89 Frequency: 0Hz ~ 3GHz P1dB: 20dBm (100mW) Gain: 17dB Noise Figure: 3.3dB RF Type: PCS, CDPD, Broadcast Television Voltage - Supply: 4.8V Current - Supply: 81mA Test Frequency: 1.95GHz Package / Case: TO-243AA Supplier Device Package: SOT-89-3	パッケージ: TO-243AA	在庫7,416
MC35FS6502NAER2	NXP	FS6500 Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP Exposed Pad	在庫6,368
S912XDT256F1CAG	NXP	16-BIT MCU S12X CORE 256KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CANbus, I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫2,784
FS32K148HAT0MLUT	NXP	S32K148 32-BIT MCU ARM Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: I²S, POR, PWM, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 32x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	パッケージ: 176-LQFP	在庫4,656
S912XET256BVAL	NXP	16-BIT MCU S12X CORE 256KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	パッケージ: 112-LQFP	在庫4,960
MFS8613BMDA0ESR2	NXP	SAFETY SYSTEM BASIS CHIP FOR DOM Applications: Camera Current - Supply: - Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	パッケージ: -	Request a Quote
MGD3100AM38EK	NXP	IC GATE DRIVER 15A 32SOIC Driven Configuration: Half-Bridge Channel Type: Single Number of Drivers: 1 Gate Type: IGBT, N-Channel MOSFET Voltage - Supply: 3.3V Logic Voltage - VIL, VIH: - Current - Peak Output (Source, Sink): 15A, 15A Input Type: - High Side Voltage - Max (Bootstrap): - Rise / Fall Time (Typ): - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 32-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 32-SOIC	パッケージ: -	Request a Quote
MC32PF1550A9EPR2	NXP	POWER MANAGEMENT IC 3 BUCK REGS Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Current - Supply: - Voltage - Supply: 4.1V ~ 6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (5x5)	パッケージ: -	Request a Quote
MFS8611BMDA0ESR2	NXP	SAFETY SYSTEM BASIS CHIP FOR DOM Applications: Camera Current - Supply: - Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	パッケージ: -	Request a Quote
LS1043ACE9QQB	NXP	LAYERSCAPE 64-BIT ARM CORTEX-A53 Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.6GHz Co-Processors/DSP: - RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1GbE (4), 2.5GbE (2), 10GbE (1) SATA: SATA 6Gbps (1) USB: USB 3.0 + PHY (3) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security Package / Case: 780-BFBGA Supplier Device Package: 780-FBGA (23x23)	パッケージ: -	Request a Quote

MMRF1314HR5

NXP

TRANS 960-1215MHZ 1000W PEAK 50V

Transistor Type: LDMOS (Dual)
Frequency: 1.4GHz
Gain: 17.7dB
Voltage - Test: 50V
Current Rating: -
Noise Figure: -
Current - Test: 100mA
Power - Output: 1000W
Voltage - Rated: 105V
Package / Case: SOT-979A
Supplier Device Package: NI-1230-4H

パッケージ: SOT-979A

在庫7,552

BZX384-C3V3/ZLX

NXP

DIODE ZENER SOD323

Voltage - Zener (Nom) (Vz): 3.3V
Tolerance: ±5%
Power - Max: 300mW
Impedance (Max) (Zzt): 95 Ohms
Current - Reverse Leakage @ Vr: 50nA @ 700mV
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Supplier Device Package: SC-76-2

パッケージ: SC-76, SOD-323

在庫2,464

MC33395TDWBR2

NXP

IC GATE DRIVER 3PHASE 32-SOIC

Driven Configuration: Half-Bridge
Channel Type: 3-Phase
Number of Drivers: 6
Gate Type: N-Channel MOSFET
Voltage - Supply: 5.5 V ~ 24 V
Logic Voltage - VIL, VIH: -
Current - Peak Output (Source, Sink): -
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): -
Rise / Fall Time (Typ): 350ns, 250ns
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 32-SOIC

パッケージ: 32-SOIC (0.295", 7.50mm Width)

在庫2,016

74LV259PW,118

NXP

IC 8BIT ADDRESSABL LATCH 16TSSOP

Logic Type: D-Type, Addressable
Circuit: 1:8
Output Type: Standard
Voltage - Supply: 1 V ~ 3.6 V
Independent Circuits: 1
Delay Time - Propagation: 36ns
Current - Output High, Low: 6mA, 6mA
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

パッケージ: 16-TSSOP (0.173", 4.40mm Width)

在庫3,424

74LV4020D,112

NXP

IC 14BIT BINARY RIPPLE 16-SOIC

Logic Type: Binary Counter
Direction: Up
Number of Elements: 1
Number of Bits per Element: 14
Reset: Asynchronous
Timing: -
Count Rate: 100MHz
Trigger Type: Negative Edge
Voltage - Supply: 1 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

パッケージ: 16-SOIC (0.154", 3.90mm Width)

在庫7,392

MB2245BB,518

NXP

IC TXRX 16BIT 52QFP

Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 52-QFP
Supplier Device Package: 52-QFN (10x10)

パッケージ: 52-QFP

在庫5,312

UJA1078TW/3V3/WD:1

NXP

IC SBC CAN/DUAL LIN 3.3 32HTSSOP

Applications: Automotive
Interface: CAN, LIN
Voltage - Supply: 4.5 V ~ 28 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

パッケージ: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

在庫4,448

PCA9554D,112

NXP

IC I/O EXPANDER I2C 8B 16SOIC

Number of I/O: 8
Interface: I2C, SMBus
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 10mA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SO

パッケージ: 16-SOIC (0.295", 7.50mm Width)

在庫23,964

MC34CM0902WEF

NXP

IC TXRX CAN 14SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 2/2
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SOIC

パッケージ: 14-SOIC (0.154", 3.90mm Width)

在庫8,088

MPC8548ECVUAQG

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫4,928

MC68030RC33C

NXP

IC MPU M680X0 33MHZ 128PGA

Core Processor: 68030
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 33MHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 128-BPGA
Supplier Device Package: 128-PGA (35x35)

パッケージ: 128-BPGA

在庫8,148

MCF5249VF140

NXP

IC MCU 32BIT ROMLESS 160MAPBGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 140MHz
Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I2S, POR, Serial Audio, WDT
Number of I/O: 47
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 4x12b
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 160-BGA
Supplier Device Package: 160-MAPBGA (15x15)

パッケージ: 160-BGA

在庫135,348

S9S08DZ16F2VLF

NXP

IC MCU 8BIT 16KB FLASH 48LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP

在庫4,176

S9S12G64F1MLC

NXP

IC MCU 16BIT 64KB FLASH 32LQFP

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, IrDA, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

パッケージ: 32-LQFP

在庫2,416

MPXM2102D

NXP

SENS PRESSURE 14.5 PSI MAX MPAK

Pressure Type: Differential
Operating Pressure: 14.5 PSI (100 kPa)
Output Type: Wheatstone Bridge
Output: 0 mV ~ 40 mV (10V)
Accuracy: -
Voltage - Supply: 10 V ~ 16 V
Port Size: -
Port Style: No Port
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 58.02 PSI (400 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 5-SMD Module
Supplier Device Package: 5-MPAK

パッケージ: 5-SMD Module

在庫7,182

MMA5148LWR2

NXP

ACCELEROMETER PSI5 16QFN

Type: Digital
Axis: Z
Acceleration Range: ±480g
Sensitivity (LSB/g): 1
Sensitivity (mV/g): -
Bandwidth: -
Output Type: PCM, SPI
Voltage - Supply: 4.2 V ~ 17 V
Features: -
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-QFN Exposed Pad
Supplier Device Package: 16-QFN (6x6)

パッケージ: 16-QFN Exposed Pad

在庫6,822

MMA1270KEGR2

NXP

ACCELEROMETER 2.5G ANALOG 16SOIC

Type: Analog
Axis: Z
Acceleration Range: ±2.5g
Sensitivity (LSB/g): -
Sensitivity (mV/g): 750
Bandwidth: 50Hz
Output Type: Analog Voltage
Voltage - Supply: 4.75 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

パッケージ: 16-SOIC (0.295", 7.50mm Width)

在庫7,200

SL2S2602FUDZ

NXP

IC I-CODE SLI UNCASED FOIL

Type: RFID Reader
Frequency: 13.56MHz
Standards: ISO 15693
Interface: -
Voltage - Supply: -
Operating Temperature: -40°C ~ 85°C
Package / Case: Die
Supplier Device Package: Wafer

パッケージ: Die

在庫3,780

BGA6589,135

NXP

MMIC AMPLIFIER SOT89

Frequency: 0Hz ~ 3GHz
P1dB: 20dBm (100mW)
Gain: 17dB
Noise Figure: 3.3dB
RF Type: PCS, CDPD, Broadcast Television
Voltage - Supply: 4.8V
Current - Supply: 81mA
Test Frequency: 1.95GHz
Package / Case: TO-243AA
Supplier Device Package: SOT-89-3

パッケージ: TO-243AA

在庫7,416

MC35FS6502NAER2

NXP

FS6500

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP Exposed Pad

在庫6,368

S912XDT256F1CAG

NXP

16-BIT MCU S12X CORE 256KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 80MHz
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 119
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 24x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫2,784

FS32K148HAT0MLUT

NXP

S32K148 32-BIT MCU ARM

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: I²S, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 32x12b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

パッケージ: 176-LQFP

在庫4,656

S912XET256BVAL

NXP

16-BIT MCU S12X CORE 256KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

パッケージ: 112-LQFP

在庫4,960

MFS8613BMDA0ESR2

NXP

SAFETY SYSTEM BASIS CHIP FOR DOM

Applications: Camera
Current - Supply: -
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

パッケージ: -

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MGD3100AM38EK

NXP

IC GATE DRIVER 15A 32SOIC

Driven Configuration: Half-Bridge
Channel Type: Single
Number of Drivers: 1
Gate Type: IGBT, N-Channel MOSFET
Voltage - Supply: 3.3V
Logic Voltage - VIL, VIH: -
Current - Peak Output (Source, Sink): 15A, 15A
Input Type: -
High Side Voltage - Max (Bootstrap): -
Rise / Fall Time (Typ): -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Supplier Device Package: 32-SOIC

パッケージ: -

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MC32PF1550A9EPR2

NXP

POWER MANAGEMENT IC 3 BUCK REGS

Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Current - Supply: -
Voltage - Supply: 4.1V ~ 6V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (5x5)

パッケージ: -

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MFS8611BMDA0ESR2

NXP

SAFETY SYSTEM BASIS CHIP FOR DOM

Applications: Camera
Current - Supply: -
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

パッケージ: -

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LS1043ACE9QQB

NXP

LAYERSCAPE 64-BIT ARM CORTEX-A53

Core Processor: ARM® Cortex®-A53
Number of Cores/Bus Width: 4 Core, 64-Bit
Speed: 1.6GHz
Co-Processors/DSP: -
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1GbE (4), 2.5GbE (2), 10GbE (1)
SATA: SATA 6Gbps (1)
USB: USB 3.0 + PHY (3)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: ARM TZ, Boot Security
Package / Case: 780-BFBGA
Supplier Device Package: 780-FBGA (23x23)

パッケージ: -

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