ページ 839 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
LD6806CX4/27H,315	NXP	IC REG LINEAR 2.7V 200MA 4WLCSP Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 2.7V Voltage - Output (Max): - Voltage Dropout (Max): 0.1V @ 200mA Current - Output: 200mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-XFBGA, WLCSP Supplier Device Package: 4-WLCSP (0.76x0.76)	パッケージ: 4-XFBGA, WLCSP	在庫3,824
LD6806TD/23P,125	NXP	IC REG LINEAR 2.3V 200MA 5TSOP Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 2.3V Voltage - Output (Max): - Voltage Dropout (Max): 0.13V @ 200mA Current - Output: 200mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: SC-74A, SOT-753 Supplier Device Package: 5-TSOP	パッケージ: SC-74A, SOT-753	在庫6,736
MC33298P	NXP	IC SWITCH SERIAL OCTAL 20-DIP Switch Type: General Purpose Number of Outputs: 8 Ratio - Input:Output: 1:8 Output Configuration: Low Side Output Type: N-Channel Interface: SPI Voltage - Load: 9 V ~ 26.5 V Voltage - Supply (Vcc/Vdd): 2.5 V ~ 4.5 V Current - Output (Max): 1A Rds On (Typ): 350 mOhm Input Type: - Features: - Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Operating Temperature: -40°C ~ 150°C (TJ) Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	パッケージ: 20-DIP (0.300", 7.62mm)	在庫6,612
UBA2017AP/1,112	NXP	IC CTLR CFL HF-TL 16DIP Type: CFL/TL Controller Frequency: - Voltage - Supply: 11.9 V ~ 13.8 V Current - Supply: 1.7mA Current - Output Source/Sink: - Dimming: Yes Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	パッケージ: 16-DIP (0.300", 7.62mm)	在庫7,264
N74F299N,602	NXP	IC SHIFT REGISTER 8BIT 20DIP Logic Type: Shift Register Output Type: Tri-State Number of Elements: 1 Number of Bits per Element: 8 Function: Universal Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	パッケージ: 20-DIP (0.300", 7.62mm)	在庫16,572
N74F126N,602	NXP	IC BUFFER TRI-ST QUAD 14DIP Logic Type: Buffer, Non-Inverting Number of Elements: 4 Number of Bits per Element: 1 Input Type: - Output Type: Push-Pull Current - Output High, Low: 15mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 14-DIP (0.300", 7.62mm) Supplier Device Package: 14-DIP	パッケージ: 14-DIP (0.300", 7.62mm)	在庫2,640
TDA8922BTH/N2,118	NXP	IC AMP AUD CLASS D 2X50W 24-HSOP Type: Class D Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Max Output Power x Channels @ Load: 88W x 1 @ 6 Ohm; 50W x 2 @ 6 Ohm Voltage - Supply: ±12.5 V ~ 30 V Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 24-HSOP Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad	パッケージ: 24-BSOP (0.433", 11.00mm Width) Exposed Pad	在庫6,048
PCA9545BPW,118	NXP	IC I2C SWITCH 4CH 20-TSSOP Applications: 4-Channel I2C Switcher Interface: I2C Voltage - Supply: 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP Mounting Type: Surface Mount	パッケージ: 20-TSSOP (0.173", 4.40mm Width)	在庫3,232
MC8640DTVU1067NE	NXP	IC MPU MPC86XX 1.067GHZ 1023BGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.067GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 1023-BCBGA, FCCBGA Supplier Device Package: 1023-FCCBGA (33x33)	パッケージ: 1023-BCBGA, FCCBGA	在庫5,776
P1017NSN5HFB	NXP	IC MPU Q OR IQ 800MHZ 457TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 457-LFBGA Supplier Device Package: 457-TEPBGA-1 (19x19)	パッケージ: 457-LFBGA	在庫3,392
S912XEQ384J3CAL	NXP	IC MCU 16BIT 384KB FLASH 112LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	パッケージ: 112-LQFP	在庫4,960
MPC564MZP56R2	NXP	IC MCU 32BIT 512KB FLASH 388BGA Core Processor: PowerPC Core Size: 32-Bit Speed: 56MHz Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 56 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V Data Converters: A/D 32x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 388-BBGA Supplier Device Package: 388-PBGA (27x27)	パッケージ: 388-BBGA	在庫4,256
MC908GR48AMFUE	NXP	IC MCU 8BIT 48KB FLASH 64QFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 53 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1.5K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 24x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	パッケージ: 64-QFP	在庫5,952
MK40DX256ZVLQ10	NXP	IC MCU 32BIT 256KB FLASH 144LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Number of I/O: 98 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 42x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫9,528
MC9S08PT16VTG	NXP	IC MCU 8BIT 16KB FLASH 16TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	パッケージ: 16-TSSOP (0.173", 4.40mm Width)	在庫3,120
MC68331CAG16	NXP	IC MCU 32BIT ROMLESS 144LQFP Core Processor: CPU32 Core Size: 32-Bit Speed: 16MHz Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 18 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫13,632
MCF5329CVM240	NXP	IC MCU 32BIT ROMLESS 256MAPBGA Core Processor: Coldfire V3 Core Size: 32-Bit Speed: 240MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, LCD, PWM, WDT Number of I/O: 94 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.4 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	パッケージ: 256-LBGA	在庫6,480
TEF6892H/V3,557	NXP	IC RADIO SIGNAL PROC 44-QFP Function: Audio Tone Processor Applications: Automotive Audio Number of Channels: 6 Interface: I2C Voltage - Supply: 8 V ~ 9 V Operating Temperature: -40°C ~ 85°C (TA) Specifications: AM, FM Package / Case: 44-QFP Supplier Device Package: 44-PQFP (10x10)	パッケージ: 44-QFP	在庫3,776
MPXAZ4100AC6U	NXP	PRESSURE SENS 15.2PSI MAX 8-SOP Pressure Type: Absolute Operating Pressure: 2.9 PSI ~ 15.23 PSI (20 kPa ~ 105 kPa) Output Type: Analog Voltage Output: 0.3 V ~ 4.9 V Accuracy: ±1.8% Voltage - Supply: 4.85 V ~ 5.35 V Port Size: Male - 0.13" (3.17mm) Tube Port Style: Barbless Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-SMD, Gull Wing, Top Port Supplier Device Package: -	パッケージ: 8-SMD, Gull Wing, Top Port	在庫5,040
MMA6805AKGWR2	NXP	ACCELEROMETER 10BIT SPI 16QFN Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫3,150
TEF6646HW/V101	NXP	IC ONE-CHIP RADIO 64HTQFP Frequency: - Sensitivity: - Data Rate (Max): - Modulation or Protocol: AM, FM Applications: AM/FM Radio Receiver Current - Receiving: - Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: - Voltage - Supply: - Operating Temperature: - Package / Case: 64-TQFP Exposed Pad Supplier Device Package: 64-HTQFP (10x10)	パッケージ: 64-TQFP Exposed Pad	在庫7,218
SPC5642AF2MLU2	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z4 Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 84 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.25 V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	パッケージ: 176-LQFP	在庫3,328
MIMX8DX5FVLFZAC	NXP	I.MX 8DUALXPLUS 21X21 Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz, 264MHz Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) SATA: - USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: - Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Package / Case: 609-BFBGA Supplier Device Package: 609-FBGA (21x21)	パッケージ: -	Request a Quote
MC33FS5502Y3ESR2	NXP	HIGH VOLTAGE PMIC QFN56 Applications: Power Supplies Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	パッケージ: -	Request a Quote
FS32R294LAK0MJDT	NXP	S32R29 MULTICORE POWER ARCHITECT Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit 5-Core Speed: 250MHz, 500MHz, 430MHz Connectivity: CAN, Ethernet, FlexRay Peripherals: - Number of I/O: - Program Memory Size: 3MB (3M x 8) Program Memory Type: SRAM EEPROM Size: - RAM Size: 2.5M x 8 Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: Internal Operating Temperature: - Mounting Type: Surface Mount Package / Case: 269-LFBGA Supplier Device Package: 269-LFBGA (14x14)	パッケージ: -	Request a Quote
SAF4000EL-103Q400K	NXP	IC Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
LPC5526JBD64E	NXP	IC MCU 32BIT 256KB FLASH 64TQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 36 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 144K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-TQFP Exposed Pad Supplier Device Package: 64-HTQFP (10x10)	パッケージ: -	Request a Quote
LX2080XE71826B	NXP	IC MPU QORLQ 1.8GHZ 1517FCPBGA Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 8 Core, 64-Bit Speed: 1.8GHz Co-Processors/DSP: - RAM Controllers: DDR4 Graphics Acceleration: Yes Display & Interface Controllers: - Ethernet: 100Gbps (2) SATA: SATA 3.0 (4) USB: USB 3.0 (2) + PHY (2) Voltage - I/O: 1.2V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: Secure Boot, TrustZone® Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCPBGA (40x40)	パッケージ: -	Request a Quote

LD6806CX4/27H,315

NXP

IC REG LINEAR 2.7V 200MA 4WLCSP

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 2.7V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.1V @ 200mA
Current - Output: 200mA
Current - Quiescent (Iq): -
Current - Supply (Max): 100µA ~ 250µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 4-XFBGA, WLCSP
Supplier Device Package: 4-WLCSP (0.76x0.76)

パッケージ: 4-XFBGA, WLCSP

在庫3,824

LD6806TD/23P,125

NXP

IC REG LINEAR 2.3V 200MA 5TSOP

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 2.3V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.13V @ 200mA
Current - Output: 200mA
Current - Quiescent (Iq): -
Current - Supply (Max): 100µA ~ 250µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: SC-74A, SOT-753
Supplier Device Package: 5-TSOP

パッケージ: SC-74A, SOT-753

在庫6,736

MC33298P

NXP

IC SWITCH SERIAL OCTAL 20-DIP

Switch Type: General Purpose
Number of Outputs: 8
Ratio - Input:Output: 1:8
Output Configuration: Low Side
Output Type: N-Channel
Interface: SPI
Voltage - Load: 9 V ~ 26.5 V
Voltage - Supply (Vcc/Vdd): 2.5 V ~ 4.5 V
Current - Output (Max): 1A
Rds On (Typ): 350 mOhm
Input Type: -
Features: -
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Operating Temperature: -40°C ~ 150°C (TJ)
Package / Case: 20-DIP (0.300", 7.62mm)
Supplier Device Package: 20-DIP

パッケージ: 20-DIP (0.300", 7.62mm)

在庫6,612

UBA2017AP/1,112

NXP

IC CTLR CFL HF-TL 16DIP

Type: CFL/TL Controller
Frequency: -
Voltage - Supply: 11.9 V ~ 13.8 V
Current - Supply: 1.7mA
Current - Output Source/Sink: -
Dimming: Yes
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

パッケージ: 16-DIP (0.300", 7.62mm)

在庫7,264

N74F299N,602

NXP

IC SHIFT REGISTER 8BIT 20DIP

Logic Type: Shift Register
Output Type: Tri-State
Number of Elements: 1
Number of Bits per Element: 8
Function: Universal
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)
Supplier Device Package: 20-DIP

パッケージ: 20-DIP (0.300", 7.62mm)

在庫16,572

N74F126N,602

NXP

IC BUFFER TRI-ST QUAD 14DIP

Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Number of Bits per Element: 1
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 15mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Supplier Device Package: 14-DIP

パッケージ: 14-DIP (0.300", 7.62mm)

在庫2,640

TDA8922BTH/N2,118

NXP

IC AMP AUD CLASS D 2X50W 24-HSOP

Type: Class D
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Max Output Power x Channels @ Load: 88W x 1 @ 6 Ohm; 50W x 2 @ 6 Ohm
Voltage - Supply: ±12.5 V ~ 30 V
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 24-HSOP
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad

パッケージ: 24-BSOP (0.433", 11.00mm Width) Exposed Pad

在庫6,048

PCA9545BPW,118

NXP

IC I2C SWITCH 4CH 20-TSSOP

Applications: 4-Channel I2C Switcher
Interface: I2C
Voltage - Supply: 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP
Mounting Type: Surface Mount

パッケージ: 20-TSSOP (0.173", 4.40mm Width)

在庫3,232

MC8640DTVU1067NE

NXP

IC MPU MPC86XX 1.067GHZ 1023BGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.067GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 1023-BCBGA, FCCBGA
Supplier Device Package: 1023-FCCBGA (33x33)

パッケージ: 1023-BCBGA, FCCBGA

在庫5,776

P1017NSN5HFB

NXP

IC MPU Q OR IQ 800MHZ 457TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 457-LFBGA
Supplier Device Package: 457-TEPBGA-1 (19x19)

パッケージ: 457-LFBGA

在庫3,392

S912XEQ384J3CAL

NXP

IC MCU 16BIT 384KB FLASH 112LQFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 24K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

パッケージ: 112-LQFP

在庫4,960

MPC564MZP56R2

NXP

IC MCU 32BIT 512KB FLASH 388BGA

Core Processor: PowerPC
Core Size: 32-Bit
Speed: 56MHz
Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 56
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
Data Converters: A/D 32x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 388-BBGA
Supplier Device Package: 388-PBGA (27x27)

パッケージ: 388-BBGA

在庫4,256

MC908GR48AMFUE

NXP

IC MCU 8BIT 48KB FLASH 64QFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Number of I/O: 53
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1.5K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 24x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-QFP
Supplier Device Package: 64-QFP (14x14)

パッケージ: 64-QFP

在庫5,952

MK40DX256ZVLQ10

NXP

IC MCU 32BIT 256KB FLASH 144LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O: 98
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 42x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫9,528

MC9S08PT16VTG

NXP

IC MCU 8BIT 16KB FLASH 16TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, LIN, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 14
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

パッケージ: 16-TSSOP (0.173", 4.40mm Width)

在庫3,120

MC68331CAG16

NXP

IC MCU 32BIT ROMLESS 144LQFP

Core Processor: CPU32
Core Size: 32-Bit
Speed: 16MHz
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 18
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫13,632

MCF5329CVM240

NXP

IC MCU 32BIT ROMLESS 256MAPBGA

Core Processor: Coldfire V3
Core Size: 32-Bit
Speed: 240MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Number of I/O: 94
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.4 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

パッケージ: 256-LBGA

在庫6,480

TEF6892H/V3,557

NXP

IC RADIO SIGNAL PROC 44-QFP

Function: Audio Tone Processor
Applications: Automotive Audio
Number of Channels: 6
Interface: I2C
Voltage - Supply: 8 V ~ 9 V
Operating Temperature: -40°C ~ 85°C (TA)
Specifications: AM, FM
Package / Case: 44-QFP
Supplier Device Package: 44-PQFP (10x10)

パッケージ: 44-QFP

在庫3,776

MPXAZ4100AC6U

NXP

PRESSURE SENS 15.2PSI MAX 8-SOP

Pressure Type: Absolute
Operating Pressure: 2.9 PSI ~ 15.23 PSI (20 kPa ~ 105 kPa)
Output Type: Analog Voltage
Output: 0.3 V ~ 4.9 V
Accuracy: ±1.8%
Voltage - Supply: 4.85 V ~ 5.35 V
Port Size: Male - 0.13" (3.17mm) Tube
Port Style: Barbless
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 58.02 PSI (400 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 8-SMD, Gull Wing, Top Port
Supplier Device Package: -

パッケージ: 8-SMD, Gull Wing, Top Port

在庫5,040

MMA6805AKGWR2

NXP

ACCELEROMETER 10BIT SPI 16QFN

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫3,150

TEF6646HW/V101

NXP

IC ONE-CHIP RADIO 64HTQFP

Frequency: -
Sensitivity: -
Data Rate (Max): -
Modulation or Protocol: AM, FM
Applications: AM/FM Radio Receiver
Current - Receiving: -
Data Interface: PCB, Surface Mount
Memory Size: -
Antenna Connector: PCB, Surface Mount
Features: -
Voltage - Supply: -
Operating Temperature: -
Package / Case: 64-TQFP Exposed Pad
Supplier Device Package: 64-HTQFP (10x10)

パッケージ: 64-TQFP Exposed Pad

在庫7,218

SPC5642AF2MLU2

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z4
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 84
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.25 V
Data Converters: A/D 40x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

パッケージ: 176-LQFP

在庫3,328

MIMX8DX5FVLFZAC

NXP

I.MX 8DUALXPLUS 21X21

Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width: 3 Core, 64-Bit
Speed: 1.2GHz, 264MHz
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet: 10/100/1000Mbps (2)
SATA: -
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Package / Case: 609-BFBGA
Supplier Device Package: 609-FBGA (21x21)

パッケージ: -

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MC33FS5502Y3ESR2

NXP

HIGH VOLTAGE PMIC QFN56

Applications: Power Supplies
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

パッケージ: -

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FS32R294LAK0MJDT

NXP

S32R29 MULTICORE POWER ARCHITECT

Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Speed: 250MHz, 500MHz, 430MHz
Connectivity: CAN, Ethernet, FlexRay
Peripherals: -
Number of I/O: -
Program Memory Size: 3MB (3M x 8)
Program Memory Type: SRAM
EEPROM Size: -
RAM Size: 2.5M x 8
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 269-LFBGA
Supplier Device Package: 269-LFBGA (14x14)

パッケージ: -

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SAF4000EL-103Q400K

NXP

IC

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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LPC5526JBD64E

NXP

IC MCU 32BIT 256KB FLASH 64TQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 36
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 144K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Supplier Device Package: 64-HTQFP (10x10)

パッケージ: -

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LX2080XE71826B

NXP

IC MPU QORLQ 1.8GHZ 1517FCPBGA

Core Processor: ARM® Cortex®-A72
Number of Cores/Bus Width: 8 Core, 64-Bit
Speed: 1.8GHz
Co-Processors/DSP: -
RAM Controllers: DDR4
Graphics Acceleration: Yes
Display & Interface Controllers: -
Ethernet: 100Gbps (2)
SATA: SATA 3.0 (4)
USB: USB 3.0 (2) + PHY (2)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TJ)
Security Features: Secure Boot, TrustZone®
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCPBGA (40x40)

パッケージ: -

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