ページ 115 - 最新のテクノロジ | Heisener Electronics
連絡先
SalesDept@heisener.com 86-755-83210559-841
Language Translation

* Please refer to the English Version as our Official Version.

最新のテクノロジ

レコード 4,647
ページ  115/259
Technology Cover

2022-06-21, Nexperia's USB4 ESD diode devices offer an excellent balance of protection and performance

Nexperia, a specialist in the field of basic semiconductor devices, has announced the launch of two optimized electrostatic discharge (ESD) protection diodes for repeat timers and signal Repeaters in high-speed data lines. PESD2V8Y1BSF is designed to protect the USB4 (Thunderbolt) interface, while PESD4V0Y1BCSF works with USB4 and HDMI 2.1.

Technology Cover

2022-06-21, Vishay Introduces TRANSZORB® TVS in SMC (DO-214AB) Package

Vishay Introduces TRANSZORB® TVS in SMC (DO-214AB) Package with High Surge Capability up to 3 kW and Leakage Current as Low as 1 μA.Bidirectional device operates up to +175 C and regulated breakdown voltage from 11.1 V to 133 V for automotive, industrial and communications applications

Technology Cover

2022-06-21, Renesas Electronics to Demonstrate First RA Series MCU Based on Cortex M85 Core

The Arm Cortex-M85 processor uses Helium technology, Arm's M-profile vector extension, to enable advanced DSP/ML capabilities and help accelerate computation-intensive applications such as edge node AI. The Cortex-M85 delivers performance in excess of 6 CoreMark/MHz, supporting demanding iot use cases that require the highest computational performance and DSP or ML capabilities, implemented on a single, easy-to-program Cortex-M processor.

Technology Cover

2022-06-21, KSC11 series features plastic contacts and supports up to 3 million uses

C&K has expanded its KSC product line with the addition of members with plastic contacts and up to 3 million service life. The KSC11 uses hard plastic contacts for high touch rate without sacrificing its service life.

Technology Cover

2022-06-20, Infineon launches world's first TPM security chip with post-quantum encryption for firmware updates

To deal with quantum computing will have a significant impact on network security, to ensure the confidentiality of encrypted data and the integrity of digital signatures brought threats. Infineon Technologies inc. has introduced the new OPTIGA™ TPM (Trusted Platform Module) SLB 9672 to further enhance system security. The TPM chip is a forward-looking security solution.

Technology Cover

2022-06-20, Microchip unveils new chip-scale atomic clock CSAC that can work in extreme environments

Microchip introduces a new chip-scale atomic clock (CSAC) that provides a wider operating temperature range, faster warm-up and better frequency stability in extreme environments. Type SA65 Chip-Scale Atomic Clock for Military and Industrial Systems with Ultra-High Accuracy and Low Power

Technology Cover

2022-06-20, Maxim Unveils Next-Generation IoT Security Chip with ChipDNA PUF Technology

Security has become a top priority in the IoT era, especially at the hardware level. Maxim hopes to bring both security and low power consumption to IoT applications with its cryptographic processors. Maxim Integrated (now officially part of ADI) has been working hard to accomplish this. The company has released a new low-power cryptographic controller that leverages Physical Unclonable Function (PUF) technology to improve hardware security.

Technology Cover

2022-06-20, Samsung plans to start mass production of GAA-based 2nm chips in 2025

According to BusinessKorea, Samsung Electronics is planning to catch up with TSMC, the world's largest foundry company, by building a 3-nanometer GAA (Gate-all-around) process in the next three years.

Technology Cover

2022-06-20, Infineon Introduces AIROC CYW20820 Bluetooth and Bluetooth Low Energy System-on-Chip

Infineon's AIROC CYW20820 Bluetooth and Low Power Bluetooth ® on-chip systems enable flexible, low power and high performance connectivity

Technology Cover

2022-06-20, New NFC Reader from STMicroelectronics Speeds Design of Payment and Consumer Applications

ST's ST25R3916B-AQWT and ST25R3917B-AQWT NFC Forum reader chips have high output power. The new device introduces a more flexible Active Waveform Shaping (AWS) improvement that simplifies the RF output adjustment process and facilitates optimization of overshoot and undershoot issues.

Technology Cover

2022-06-19, ABS sink box provides protection for small electronic circuits

BCL enclosures offer two series of competitively priced potting boxes made of tough, high-quality ABS that protect delicate electronics in a variety of applications. The GPL range has fixed lugs that attach securely to the surface and is available in standard colours of black, white, or grey, each in three different sizes, the smallest in the range, the PB109, measures just 11mm x 11mm x 9mm, while the largest It is 100mm x 60mm x 25mm.

Technology Cover

2022-06-19, Precision CMOS Operational Amplifiers in Small Packages

The Texas Instruments OPA3S328 CMOS operational amplifier. Integrated switches are provided, optimized for flexible cross-impedance applications. The device features low input bias current and low input capacitance, allowing low photocurrent operation (& LT; 1nA) to obtain high frequency transresistance gain. The zero-cross input technology provided on the device allows the flexibility of the input common mode circuit to span the entire supply range without bias.

Technology Cover

2022-06-19, Top five MCU suppliers, contributing 82% of global sales

Five of the largest microcontroller vendors develop and sell ARM-based MICROcontrollers. These companies accounted for 82.1 percent of global MCU sales in 2021, compared to 72.2 percent in 2016, indicating an expanding field of giants in microcontrollers. The largest MCU vendor increase since 2016 is due to major acquisitions and mergers.

Technology Cover

2022-06-19, ST will launch an MCU with NPU

STMicroelectronics will reportedly launch its first microcontroller with a full neural processing unit (NPU), the STM32N6. The chip will be sampled by the end of 2022.

Technology Cover

2022-06-19, The smallest mini camera that can be used in medical endoscopy applications

Mouser now stocks NanEyeM miniature camera modules from AMS OSRAM. Camera module is a kind of visual application of micro image sensor, small size is an essential factor. With a footprint of just 1mm², the module's low-voltage differential signal serial interface provides a high SIGNal-to-noise ratio digital output, allowing signals to exceed cable lengths up to 3m.

Technology Cover

2022-06-18, The world's first RISC-V 3D GPU is coming soon

Ultra-low power graphics IP leader Think Silicon will reportedly showcase the industry's first RISC-V-based Gpus -- the NEOX™ G and A series -- at Embedded World 2022. The company will also introduce NEMA ® | pico - VG, which is used in the SoC MCU driver NEMA ® | GPU series of new products, it supports rich vector graphics, and will cut up to 95% CPU utilization to improve the system efficiency.

Technology Cover

2022-06-18, Renesas successfully developed 22nm MRAM to replace flash memory in MCU?

Renesas Electronics Corporation announced that it has developed a test chip for embedded spin Transfer Moment Reluctance Random Access Memory (STT-MRAM) circuit technology. The chip has fast read and write operation and is manufactured using 22 nm process. The test chip consists of a 32 Megabit (Mbit) embedded MRAM storage unit array that can achieve 5.9 nanoseconds (ns) of random read access at a maximum junction temperature of 150°C and 5.8 Megabytes/SEC of write throughput (MB/ SEC).

Technology Cover

2022-06-18, New Microcontrollers for a New Era of Edge Computing for Industrial and IoT

NXP Semiconductors has released a new MCX microcontroller portfolio designed to drive innovation in smart homes, smart factories, smart cities, and emerging industrial and Iot edge applications. The portfolio consists of four families of devices built on a common platform and supported by the widely adopted MCUXpresso development tools and software suite. The four families in the portfolio were developed to simplify migration and scale up or down as needed to maximize software reuse to minimize development costs