Mitsubishi Electric has begun offering samples of a new integrated SBD*1 SiC*2-MOSFET*3 module with a voltage rating of 3.3kV and insulation resistance of 6.0kVrms. It will help to provide higher power density, efficiency and reliability for railways, electric power systems and large industrial converter systems.
Basic semiconductor once again appeared in the world's most powerful semiconductor exhibition - PCIM Europe 2023, in Nuremberg, Germany, the official release of the second generation of silicon carbide MOSFET products. The performance of the new generation of products has been greatly improved, and the product types have been further enriched, helping to achieve better energy efficiency and application reliability in the industries of new energy vehicles, DC fast charging, photovoltaic energy storage, industrial power supply, communication power supply and so on.
Phoenix Electric's new MACX-MR series of monitoring relays is intuitive, reliable, and supports fault tracing to continuously monitor various electrical parameters such as voltage, phase sequence, current, and motor coil temperature. Adapt to the harsh temperature and humidity environment, safe and accurate. Improves system availability and saves costly downtime or maintenance.
Samsung Electronics has announced the development of its first 128GB DRAM that supports Compute Express Link™ (CXL™) 2.0. At the same time, Samsung has worked closely with Intel to achieve milestone progress on Intel Xeon's platform.
ISM330IS and ISN330ISN iNEMO inertial modules from STMicroelectronics. These modules combine a three-axis digital accelerometer with a three-axis digital gyroscope and are integrated system-level packaging solutions. The always-on, low-power nature enables these inertial modules to deliver outstanding performance in industrial and Internet of Things (IoT) applications, including industrial robotics, asset tracking, condition monitoring, and complex motion detection.
Nano Micro announced the launch of CMOS-MEMS based relative humidity (RH) and temperature sensor NSHT30. The NSHT30 integrates a complete sensor system on a single chip, including capacitive relative humidity sensor, COMS temperature sensor and signal processor and I2C digital communication interface, in the DFN and LGA packages 2.5mm x 2.5mm x 0.9mm. Its I2C interface communication mode, minimal packaging and low power characteristics allow NSHT30 to be more widely integrated into a variety of applications
Diodes announced new additions to its portfolio of synchronous step-down converters. The AP62500 and AP62800 have continuous output current ratings of 5A and 8A, respectively, giving engineers more flexibility when developing point-of load (POL) solutions optimized for efficiency or size.
EPC9186, a three-phase BLDC motor driven inverter based on EPC2302 eGaN® FeTs, has been introduced by EPC9186. EPC9186 supports a wide input DC voltage ranging from 14 V to 80 V. High-power EPC9186 supports applications such as electric scooters, small electric vehicles, agricultural machinery, forklifts and high-power drones.
Southco, a leading global provider of engineering hardware solutions, has added a new product to the compression door lock. The new E3 VISE ACTION compression door lock with locking indication provides visual confirmation status with a reflective bright red clear indication to open or close.
Onsemi introduces the Hyperlux line of automotive image sensors with a 2.1µm pixel size, industry-leading 150dB ultra-high dynamic range (HDR) and LED flicker reduction (LFM) capabilities to deliver high performance, high speed and advanced features across the temperature range of automotive applications. Advancing the development of the next generation of Advanced Driver assistance systems (ADAS). HyperLux also supports a smooth transition to L2+ level autopilot, which only requires the driver to take over the wheel when alerted by the technology.
Infineon's OPTIGA™ Trust M iot security development suite. OPTIGA™ Trust M iot Security Development Suite is used to develop and evaluate end-to-end security use cases for smart homes, industrial automation, and enterprise devices, among others.
Nexperia has significantly raised the standard of design support for semiconductor engineers by announcing a new generation of interactive data manuals for use with power mosFeTs. By manipulating the interactive slider in the data manual, users can manually adjust the voltage, current, temperature and other conditions of their circuit application and observe how the operating point of the device dynamically responds to these changes.
The InnoSwitch3-EP IC's 750V PowiGaN switch achieves lower on-off and on-off losses, eliminates the need for metal fins and reduces the associated vibration effects. Powigan-based devices are also extremely reliable and durable, protecting the system from voltage spikes even during longer-lasting input surges and quickly recovering after the surge is over.
Nexperia has announced the availability of its first E-mode (enhanced) power GaN FeTs for low voltage (100/150 V) and high voltage (650 V) applications. Nexperia has added seven new E-mode devices to its cascading GaN nitride product portfolio, providing designers with the best options from gan FeTs to other silicon-based power devices.
Onsemi has launched the latest generation of 1200V EliteSiC Silicon Carbide (SiC) M3S devices to help power electronics engineers achieve greater energy efficiency and lower system costs. The new product line includes EliteSiC MosFeTs and modules that help increase switching speeds for a growing number of 800-V electric vehicle (EV) on-board chargers (OBCs) and energy infrastructure applications such as EV DC fast charging, solar solutions, and energy storage.
Microchip Technology announced the launch of Silicon Carbide (SiC) electronic Fuse (E-Fuse) demo boards. The device is available in six models for 400-800V battery systems with current ratings up to 30 amps. SiC power solutions offer the industry's broadest and most flexible portfolio of MosFETs, diodes and grid drivers, including bare chip, discrete devices, modules and customizable power modules.
Infineon Technologies AG, a global leader in automotive semiconductors, and FoxconnTechnology Group, the world's largest technology manufacturer and service provider, announced that they have signed a memorandum of understanding to establish a long-term partnership in the field of electric vehicles. The two sides will work together to develop electric vehicles with high energy efficiency and advanced intelligent features.
ScioSense, the industry leader in environmental and high-precision flow and time measurement sensor chips, announced the introduction of ENS161, a low-power, multi-gas sensor that enables continuous air quality monitoring in wearable and portable devices powered only by small capacity batteries.
