AMS, a leading global provider of optical solutions, and Quadric, an IP innovator in end-to-end AI machine learning processors, have announced a strategic partnership to jointly develop integrated sensing modules that combine AMS 'cutting-edge Mira family of visible and infrared CMOS sensors with Quadric's new Chimera™ GPNPU processor
Onsemi announced that it has delivered its billionth induction sensor interface integrated circuit (IC) to HELLA, an international automotive parts supplier and part of the FORVIA Group. The ON designed IC is used in HELLA's contactless Inductive Position Sensor (CIPOS®) technology for automotive drive-by-wire systems. Over 25 years of collaboration, the two companies have developed innovative designs that reduce the size of the HELLA module and ON IC to better fit applications with high dimensional requirements for modules.
Swissbit expands the company's line of hardware security keys with the launch of the iShield Key Pro, which is not just another product that supports the FIDO standard. The new security key further adds more security standards and features, providing greater flexibility for online accounts to be more secure against password-free, authentication phishing attacks, and protection.
Agile Analog, a customizable analog IP company, has launched its first analog subsystem family, covering power management, PVT detection, and sleep management. These innovative digital packaging subsystems allow multiple analog ips to be placed directly into the digital design process and connected via a standard peripheral bus such as AMBA APB, significantly reducing the amount of work required to integrate multiple analog ips into any ASIC. These subsystems look like an ordinary digital IP block, with the standard interfaces that engineers expect to make it easy to understand and work with.
Imis Osram's Mira family of image sensors is the perfect choice for intelligent design and future product development. The product has the advantage of high frame rate and can provide monochromatic, multi-color and even infrared data images, thereby quickly delivering high quality data and showing outstanding performance. Thanks to AI-enhanced imaging, Imis Osram's image sensors are combined with AI processors to enable greater security and performance in consumer electronics and industrial products.
Ti remains committed to providing customers with innovative chip - and system-level solutions. As users' demand for charging speed and convenience continues to improve, TI works closely with its partners in DC charging devices, AC charging devices and power distribution units (PDUs) to help customers realize charging solutions with higher power and efficiency, and resolve the "endurance anxiety" of electric car owners. It is no longer a dream to charge at any time, charge as you go, and charge in an orderly manner.
Germany's Bosch Group said it will buy the assets of US chipmaker TSI Semiconductor to expand its semiconductor business in silicon carbide chips (SiC), foreign media reported. Bosch and TSI have reached an agreement, but did not disclose details of the acquisition, which is subject to regulatory approval.
Onsemi and luxury smart pure electric brand Krypton Intelligent Technology (ZEEKR) announced the signing of a long-term supply agreement (LTSA). Ansamey will provide Polkrypton with EliteSiC silicon carbide (SiC) power devices to improve the energy efficiency of its smart electric vehicles (EVs), resulting in improved performance, faster charging and longer range.
Nexperia announced the launch of a new 16-channel I2C Universal Input/Output (GPIO) extender portfolio designed to improve the flexibility and reuse of electronic systems. One of the GPIO extenders, the NCA9595, has an internal pull-up resistor that can be configured via registers, which can be customized to optimize power consumption. When it is necessary to expand the amount of I/O, this product portfolio enables a clean design while minimizing interconnection.
Infineon Technologies and Uplander (pmd), a quality partner specializing in 3D ToF, have jointly launched the IRS2877C ToF VGA sensor, a performance advanced version of the IRS2976C Time of Flight (ToF) VGA sensor. The sensor is a new addition to the REAL3™ family of products.
The research team recently designed a wireless bioelectronic patch made from a flexible printed circuit board that can be custom-designed to monitor several physiological biomarkers for the healing process and the onset of infection, control drug delivery through electroactive hydrogels, and apply voltage through electrical stimulation to promote healing at the wound site.
COSEL has announced the introduction of a 3500W AC/DC three-phase input enclosed power supply HCA3500TF for industrial equipment such as high-frequency amplifiers, laser processors and robots. Its input voltage is suitable for global, three-phase triangle or three-phase star networks, and the input voltage range is 180V to 528VAC. It has two output voltages, 48VDC and 65VDC, and can be adjusted in the positive 15% and negative 50% range using the fine tuning function.
For DC brushless motor control field, Holtek launched Flash MCU BD66FM5252 combined with lithium battery charging control. Brushless DC motor products used in handheld charging can save the cost of charging IC, giving the product unique competitiveness. BD66FM5252 has 8K×16 Flash ROM, 2K×8 RAM, 512×8 EEPROM and internal system frequency of 20MHz, has 11 channels 12-bit fast ADC, and configure 4 groups of PWM output/input capture function Timer.
Ames Osram (AMS) and Musco (Musco), the world's leading provider of optical solutions, announced that Armin-Wolf-Arena, the baseball stadium in Regensburg, Germany, has adopted Masco lighting systems in collaboration with Ames Osram OSCONIQ® LED, Create a new lighting experience of the world's top sporting events.
STMicroelectronics has released new extension tools that bring the benefits of Microsoft Visual Studio Code (VS Code), Microsoft's integrated development environment, to the STM32 microcontroller. VS Code is a popular integrated development environment (IDE) known for its ease of use and flexibility. IntelliSense, for example, simplifies and speeds up code editing.
Microchip Technology announced the launch of the MPLAB® SiC power simulator, which enables rapid evaluation of Microchip SiC power devices and modules in various topologies before implementing the design into hardware
Samsung Electronics has unveiled its first ultra wideband (UWB) solution, Exynos Connect U100. Optimized for mobile, automotive and Internet of Things (IoT) devices, the new ultra-wideband UWB solution improves measurement accuracy to single digit centimetres to provide accurate distance and location information.
Nexperia announced the launch of its first 80 V and 100 V hot-swapable dedicated mosFets (ASFeTs) in a compact 8x8 mm LFPAK88 package with enhanced Secure Workspace (SOA) features. Fully optimized for demanding hot-plug and soft-start applications, these new AsFeTs operate at 175°C and are suitable for advanced telecommunications and computing equipment.
