Applications including e-scooters, e-forklifts and other LEVs, as well as power tools and battery management systems, necessitate high current rating, ruggedness and extended lifetime. Infineon Technologies AG answers these demands by providing more choices to power system designers to satisfy diverse design requirements and deliver maximum performance in the smallest space.
Hammond Electronics' 1551 Miniature plastic case home includes 49 different sizes, in addition to size and configuration options, select colors, flange covers, key rings and USB C versions are also available. One key feature is the snap closure, which allows the PCB to be opened and closed repeatedly without tools and maximizes the internal space of the PCB by removing the screw fixation to secure the cover to the base. All dimensions are 20mm high, providing enough space for onboard RJ45, USB and other standard communication interfaces.
Mouser has partnered with Microchip Technology to publish a new e-book that highlights products and technologies that will drive the next generation of automotive solutions. Modern cars are highly connected, with sensors monitoring key indicators and autonomous features supporting automatic parking and lane departure assistance. Solutions include microcontrollers, sensors, power supplies, antennas, and embedded
Mouser now offers the Kria KV260 Visual AI starter kit from Xilinx. The suite is designed to support accelerated visual applications. The suite is an out-of-the-box platform that also allows developers to add customization and differentiation at any level of abstraction, from application software to AI models to FPGA designs, through the preferred design environment
The Pico-TGU4 is a compact Pico-ITX single board powered by Intel's 11th generation tiger Lake U processor, which offers a 23% performance improvement over previous generations. The 2.5-inch device can be deployed in almost any tight space. Leveraging 11th generation Intel Core I3 / I5 / I7 and Celeron processors, it also leverages new Tiger Lake technology to offer an expanded selection of I/O capabilities
Fujikura has launched a new splicing and glass protecting system, the LZM-125 Series, which works in conjunction with onboard firmware to produce fully automatic glass shaping processes.The system employs a CO2 laser heat source to perform splicing, tapering, lensing and other high precision glass shaping operations with glass diameters of 2mm or less.
ON Semiconductor announces a pair of 1200 V full SiC MOSFET 2-PACK modules, further improving their range of products fit for the challenging EV market.The new module is based on planar technology and is suitable for driving voltages in the 18-20V range. Driving with negative gate voltage is very simple. The new SiC MOSFET module has been running with driver solutions such as the NCD5700x device
THine Electronics has launched a new standalone ISP, THP7312-P, which supports all the features of existing THP7312, but provides higher video streaming resolution at higher frame rates. The new ISP offers two package options, a BGA (8mm x 8mm) and a smaller WLCSP (3.9mm x 4mm). Support YUV format video streaming resolution up to 4K 30fps.
Infineon's growing portfolio of single-channel door drive ics now includes the new EiceDRIVER 1EDB single-channel door drive ICS family, providing 3kVrms (UL 1577) of current input-output isolation. The new series consists of four sections (1EDB6275F, 1EDB7275F, 1EDB8275F and 1EDB9275F) and is optimized for high/low side applications. All products offer independent and very low ohm (0.95 ohms) sources and (0.48 ohms)sink outputs for ease of design, providing the typical drive strength of 5.4a peak source and 9.8A peak sink
OKW has growing demand for its advanced touchscreen enclosures, including wall-mounted smart panels, low-profile handheld thin shells, square plan control center PROTEC and multi-function Interface-Terminal. These four areas cover a wide range of applications, with the new smart panel equipped with edge touch screens for power installations, building services, smart homes and security systems.
Lattice Semiconductor Corporation now offers enhancements to its Lattice sensAI solution stack for accelerating AI/ML application development on low power Lattice FPGAs. Enhancements incorporate support for the Lattice Propel design environment for embedded processor-based development and the TensorFlow Lite deep-learning framework for on-device inferencing.
The MAX38889 has a 94% peak efficiency, 9% higher than recent competing solutions, allowing it to support longer backup times. In applications such as smart meters or car dashboard cameras, regulators operate in step-down mode to charge backup power sources such as supercapacitors.
Melexis has introduced the MLX90377 single-mode and dual-mode (fully redundant) three-axis position sensor for automotive and industrial applications. The device is a magnetic rotation and linear position sensor IC, which builds on the successful development of the MLX90371 and MLX90372 three-axis sensors. A new PCB-free position sensor package is used. Ideal for high performance and safety critical applications.
Nicomatic released its 1mm pitch AMM series. Five standard layouts deliver in just a few days lead time. With five standard layouts of 6, 10, 20, 34 and 50 contacts and interconnecting with two rows, the series is specifically designed to meet the requirements of harsh environments. The series saves space and weight in the most demanding aerospace and other high reliability applications, including medical, defense and safety, and harsh industrial environments.
TDK has upgraded its Micronas 3D HAL Right-angle Hall effect sensor family, HAL 37XY (HAL 37XY, HAR 37XY and HAC 37XY) for functional safety aspects in automotive and industrial applications. The company incorporates vertical Hall plates into standard CMOS processes through its 3D HAL technology, this powerful right-angle sensor family offers superior temperature stability, high electrical impedance air gap variation and magnet aging, a variety of diagnostic features and very effective protective circuitry.
Avnet Silica now offers Miromico's FMLR-8X-X-STLX LoRa Iot module that runs a fully compatible BLE 5.0 stack using Semtech's 2.4ghz SX1280 LoRa transceiver, Based on Semtech's LoRa 2.4GHz technology, Miromico provides a firmware platform that supports running multiple wireless protocols, namely LoRa and BLE 5.0, on the same microcontroller. This solution does not require any additional BLE 5.0 devices. Target iot applications include tracking and tracking, building automation, mining, farming, building monitoring, telemetry, remote data recording, and more.
Display Technologies Inc. has released the new fan-less and compact embedded BoxPC Pro NPA-1904 from DISTEC. The PC is very robust, providing high computing power and running reliably even when running continuously. Two USB 2.0 ports are also available. The device can be pre-installed with the Windows 10 iot LTSC 2019 operating system, which is designed specifically for global industrial use and comes with special embedded features, including a write filter among others
